First, the contents of the meeting:
1, advanced electronic Components new materials research and market development prospects;
2, 5G polymer electronic Components materials innovation and application;
3, 5G ceramic materials in the application of electronic components;
4, the application of magnetic materials in electronic components;
5, the application of new energy storage materials in electronic components;
6, graphene in the electronic components of the application of research;
7, 5G semiconductor materials and electronic components development;
8, the application and development of ultra-materials in electronic components;
9, the application of nano-technology in electronic materials;
10, innovation and development of new materials for electronic components packaging;
11, the innovation and development of new film materials in electronic components;
12, superconducting materials, high-conductivity materials, high-heat dissipation materials in the electronic element of the application research;
13, anti-vibration, high-temperature new materials in the application of electronic components protection;
14, anti-static, anti-electromagnetic, radiation protection of new materials in the application of electronic components;
15, moisture-proof, anti-corrosion, mildew, anti-pollution new materials in the application of electronic components;
16, electronic components anti-lightning, anti-surge and other protection technology, new technology, new design, new structure;
Second, "participants" research, production and application of advanced electronic components preparation materials, protection of new materials, new technologies, technology, new structure of scientific research institutions, enterprises, sea-mounted, land, air-installed and other institutions.
Iii. designated account for conference fee Fees are shown in the registration form, the Association members of the Conference please contact the secretariat (to join the unit please call), the registration fee please remit to the designated account.
The order of speeches is subject to registration and remittance.
Account name: China (Beijing) New Materials Research Institute
Bank: ABC Beijing Xuanwu Sub-branch sales department
Bank account number: 1117 1101 0400 08202
Iv. contact information of the secretariat of the Conference Organizing Committee
Donglingyang: Mobile phone/micro-signal 13718204214; tel/fax: 010-63262242;
E_mail:donglingyang2008@163.com
Contact person: Dongling Yang 13718204214 (WeChat) Tel/Fax: 010-63262242
e-mail:donglingyang2008@163.com;445995324@qq.com; The fourth session of the military electronic components preparation of new materials and Protection technology seminar