Matsushita Electric Industrial Co., Ltd. Automotive Electronics and Electromechanical Systems Co., Ltd. realizes the productization of 'high heat-resistance secondary mounting underfill material '1' CV5794 series' to improve the reliability of mounting of automotive components, starting from October 2018 Started mass production.
In the context of the high functionality of in-vehicle systems such as ADAS (Advanced Driver Assistance System) and autonomous driving, the wiring of mounted semiconductor packages is becoming more and more miniaturized, and the reduction in joint strength due to the reduction in the area of solder joints is faced. One subject. In addition, in the future, with the concentration of IVI (New Generation Automotive Communication System) information in the cockpit, it is expected that the size of semiconductor packages will become larger. In this context, the company relies on the company's unique resin design technology. , High-heat-resistant secondary mounting underfill material, which is suitable for automotive applications and contributes to improved mounting reliability and production efficiency of large semiconductor packages. .
'Features'
1. Contribute to improving the installation reliability of automotive components with excellent heat resistance
・Temperature alternation test: 5,000 cycles at -55 ° C to 125 ° C. ※1
(The company's previous products * 2 3000 cycles or more)
・Glass transition temperature (Tg) '2': 180 ° C (the highest in the industry * 3) (the company's previous products * 2 120 ° C)
・The coefficient of thermal expansion (CTE) '3': 20ppm or less (the company's previous products *2 50ppm)
2. Enhance the installation of large semiconductor packages (20mm square or larger) with high fluidity
・Viscosity: 1Pa·s or less (the company's previous products ※2 4Pa・s)
・Compatible package size: 20mm square (the company's previous products ※ 2 10mm square)
3. Can be refrigerated, easy to handle, and contribute to reducing transportation costs
・Storage conditions: 5°C (the company's previous products*2 -20°C or less)
*1: Measurement conditions: Semiconductor package (size 6mm square, solder ball pitch 300μm, solder ball size 200μm, solder ball height 145μm, solder type SnAgCu (tin, silver, copper)), mounting substrate (size 30×30×0.978 Mm, protective film thickness 21μm)
*2: Previous products of the company: Secondary installation underfill material (Model: CV5350AS, CV5313)
*3: As of September 3, 2018, as a secondary installation of underfill material (investigation by the company)
'Use' is used to enhance semiconductor packages and electronics for in-vehicle camera modules, in-vehicle communication modules (modules for millimeter-wave radar), in-vehicle ECUs (electronic control units), next-generation cockpit/IVI (new generation automotive communication systems) Component installation
'Remarks' will be displayed at the Automotive Electronics Technology Exhibition held at the Nagoya International Exhibition Center from September 5th to 7th, 2018.
'Commodity Consulting' Automotive Electronics and Electromechanical Systems Corporation Electronic Materials Division
Https://industrial.panasonic.cn/ea/products/electronic-materials/semiconductor-encapsulation/ecom-fine-flow/hr2nduf?ad=press20180903
Https://industrial.panasonic.cn/cuif/ea/contact-us?field_contact_group=2797&field_contact_lineup=3243&ad=press20180903
'Detailed description'
1. Contribute to improving the installation reliability of automotive components with excellent heat resistance
It is important to ensure the installation reliability at high temperature and low temperature in the material of the vehicle components. In particular, in order to ensure the mounting strength of the component materials at high temperatures, it is required to have a reinforcing material excellent in heat resistance. To improve the mounting reliability, although heat resistance is employed. A material with high flexibility and small temperature expansion is an effective method, but as for the resin of the conventional underfill material, high glass transition temperature (Tg) and low coefficient of thermal expansion (CTE) are taken into consideration to improve heat resistance. It is a big problem. This material uses the company's unique resin design technology, reaction control technology, to achieve high Tg (180 ° C) while achieving a low CTE (20ppm). This inhibits the material and the substrate The heat shrinkage is poor, thereby reducing the stress applied to the solder ball '4'. Even after 5,000 cycles or more in the temperature alternating test at -55 ° C to 125 ° C, peeling or cracking of the solder joint portion does not occur, which Contribute to improve the installation reliability of automotive components.
2. Enhance the installation of large semiconductor packages (20mm square or larger) with high fluidity
Under the requirements of multi-functionalization and intensification of in-vehicle information communication systems, the size of semiconductor packages is expected to increase. The materials used in the past are limited in order to ensure the heat resistance of the reinforcing materials. In the semiconductor package, the inability to uniformly and fully fill the reinforcing material has been a major issue. This material uses the company's resin design technology, filling material control technology to achieve high flow, can be used to enhance the semiconductor package above 20mm square Installation of the pieces.
'Liquidity test'
3. Can be refrigerated, easy to handle, and contribute to reducing transportation costs
In the past, it was necessary to carry out cryopreservation (storage below -20 °C) due to material properties, and the burden and storage during customer handling. Temperature management during transportation was a major issue. This material is controlled by our unique reaction. The technology enables storage under cold storage (5 ° C). As a result, the temperature management during handling and transportation of the customer is simple and easy, and no auxiliary materials such as dry ice are needed, thus contributing to cost reduction.
'Basic specifications'
Model CV5794 Series
Minimum flow gap (μm) 20
Viscosity (Pa·s, 25°C) 1 or less
Tg (°C) 180
C.T.E.1 (ppm/°C) 20
Elasticity (GPa, 25 ° C) 13
Storage conditions are kept at 5 ° C
'Terminal description'
'1' secondary mounting underfill
A process of mounting a semiconductor element and an electronic component on a main board and a circuit board by means of electrical connection is referred to as a secondary mounting underfill material. At this time, a reinforcing material is used in order to maintain and improve connection reliability. By using a leaf shape Type resin, coating the periphery of the semiconductor element, and immersing it in the substrate and package components. After that, it is thermally cured to become a hardened material that does not melt.
'2' glass transition temperature (Tg)
The phenomenon of transitioning from a glassy hard state to a soft rubber state when heating a polymer or the like is called a glass transition, and a temperature at which a glass transition is caused is called a glass transition temperature.
'3' Coefficient of thermal expansion
It is the ratio of the increase in the material length per unit temperature when the temperature is changed under a certain pressure. The thermal expansion coefficient is one of the important characteristics that affect the installation reliability.
'4' solder ball
Solder is an alloy used for soldering electronic parts and the like. In order to exchange electrical signals between a semiconductor package and an electronic component and the printed circuit board, the respective terminals are connected in an electrically connected state. Solder ball is a spherical solder that is pre-mounted on the side of the package when a single-sided sealed package such as a BGA (solder ball array) substrate is fixed.
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