On the evening of August 8, Qualcomm officially released the Snapdragon 670 mobile platform. The Snapdragon 670 platform is a new product of the Snapdragon 600 series. Compared with the previous Snapdragon 660 platform, it has better product features and will be used for users. Bring a more powerful experience.
Qualcomm Snapdragon 670 uses the same CPU configuration as Qualcomm Snapdragon 710, adopts 10nm LPP process technology, eight cores, has two 2.0GHz Kryo 360 CPU performance cores and six 1.7GHz Kryo 360 CPU efficiency cores, size and core sharing 1MB L3 cache. In terms of CPU performance, the Snapdragon 670 will improve performance by 15% compared to the previous generation Snapdragon 660, while maintaining power consumption performance. In terms of GPU performance, the Snapdragon 670 adopts the new Adreno 615, which is better than the previous generation. Snapdragon 660's Adreno 512 boosts performance by 35%, up to 8GB LPDDR4X memory, Aqstic audio technology, QC4.0+ fast charge, etc.
Not only that, the Snapdragon 670 integrated Hexagon 685 DSP vector processing unit is the same as the Snapdragon 710, with the Snapdragon X12 modem, external connectivity, Bluetooth 5.0 and 2X2 WiFi support. In addition, the Snapdragon 670 platform is Snapdragon. The first platform in the 600 Series platform to use the Qualcomm Spectra 250 ISP, with a maximum support of 25 million pixels or 16 million pixels, for the dark environment noise control, dynamic picture capture and picture depth of field environment collection has a considerable improvement Users can capture moments with ultra-high resolution while supporting 4K 30FPS video recording.
In this way, the difference between the Snapdragon 670 and the Snapdragon 710 is mainly concentrated on the CPU, resolution and modem. The Qualcomm official has not indicated which Snapdragon 670 will be applied to which new products, but combined with Qualcomm. And OPPO new machine release and OPPO 骁 660 first launch tradition, guess OPPO is likely to get the first qualification again.