Yesterday evening, without any notice, Qualcomm suddenly released its new processor platform - Xiaolong 670. From the name point of view, this processor should be an advanced version of the Snapdragon 6 Series processor.
The Snapdragon 670 is built using the 10nm LPP process. The CPU integrates two Kryo 360 performance cores with a maximum frequency of 2.0GHz. In addition, there are six Kryo 360 efficiency cores with a frequency of 1.7GHz and a 1GB L3 cache shared by the core.
In terms of CPU performance, the Snapdragon 670 has improved by 15% compared to the Snapdragon 660. The latter uses the 4xA73+4xA53 architecture. On the GPU side, the Snapdragon 670 integrates the Adreno 615, which is 25% better than the Snapdragon 660's Adreno 512. At the same time, Snapdragon 670 will also support 8GB LPDDR4X memory, support Aqstic audio technology, QC4.0+ fast charge and so on.
In other respects, the Snapdragon 670 also integrates the Hexagon 685 DSP vector processing unit, which is the same level as the Snapdragon 710 and even the Snapdragon 845. In addition, the AI performance of the Snapdragon 670 has also been significantly improved.
The ISP image signal processor used by the Snapdragon 670 is the Spectra 250, which supports up to 25 megapixels or dual 16 megapixels and supports 4K 30FPS video recording. Baseband integrated X12 LTE (downstream 600Mbps, Cat.15), external connectivity , supports Bluetooth 5.0 and 2X2 WiFi.
At the press conference, Qualcomm said that the Snapdragon 670 has been officially put into production, and the specific commercial terminal equipment is expected to be released at the end of the year. The strength of the Snapdragon 670 is believed to be announced at that time.
