Intel released Xeon's next three generations roadmap: 10nm IceLake See you in 2020

Intel announced the new Xeon roadmap at today's Data Center Innovation Summit. In the fourth quarter of this year, Intel will update its Xeon Scalable family, codenamed or architected as Cascade Lake, 14nm process. Xeon will redesign the memory controller, support the Optane DIMM non-volatile memory stick, introduce the DLBoost extended instruction set AVX512_VNNI with accelerated depth computing capability, and also protect the Spectre and Meltdown vulnerabilities from the hardware level.

It is reported that the non-volatile memory stick with Cascade Lake will have 128GB, 256GB and 512GB capacity.

Next year, the Xeon family will upgrade to the Cooper Lake architecture, still 14nm, integrating the new generation of DLBoost instruction set BFLOAT16.

Finally, Ice Lake is now confirmed to be the codename for Intel's first generation 10nm server CPU in 2020.

Previously, it was considered the successor of Cannon Lake, but Intel now separates the consumer and enterprise architectures, and the second generation of consumer-grade 10nm is unknown.

Another roadmap leaked previously (not officially confirmed) shows that the Cascade Lake-SP uses the LGA3647 interface, and the number of Cooper Lake-SP interfaces will reach 4,189.

It is worth mentioning that since Google customized Xeon to Intel in 2008, more than 50% of the Xeon chips shipped today are personalized by Intel according to customer needs (such as scenarios, loads).