According to the previous report of the micro-network, in July 2017, Changdian Technology moved the semiconductor packaging and testing equipment from the original Shanghai factory of Xingke Jinpeng to the new factory of Jiangsu Changjiang Jiangyin completed in 2016, and installed and tested one by one. It is scheduled to be completed before the end of 2017. In the future, this new plant will be jointly established with Jiangsu Changjiang and SMIC in August 2014. The 12-inch bump processing and supporting wafer chip test (CP) Testing) The company, SMIC, shares its foothold in the Jiangyin High-tech Industrial Development Zone, and realizes the pre-, mid- and post-sector industrial chain of semiconductors, providing customers with one-stop shopping services.
In addition, Changjiang Electronics also disclosed that Changchun's advanced export value in 2017 accounted for about 80% of its revenue, and its direct export to the US was less than 2%.