Set micro-network news (spring and summer) In 2018, Jiangsu Province has arranged 135 major industrial projects, with an estimated total investment of 1.4 trillion yuan and an annual planned investment of 224.3 billion yuan. On July 31, Jiangsu Province major industrial projects on-site promotion The latest progress of major industrial projects will be announced. Among them, 58 new projects have started (91 in total), and the operating rate has reached 63.7%. At the same time, major industrial projects completed an investment of 99.3 billion yuan in the first half of the year, an increase of 80% over the same period. The completion rate was 44.3%.
Major industrial projects in Jiangsu Province include 70 strategic emerging industry projects, such as Nanjing TSMC 12-inch wafer project, Wuxi Huahong IC project, Nantong Tongfu micro-power smart chip package test project, Huai'an era 12-inch phase change memory chip, etc. The promotion meeting said that these projects are progressing smoothly.
Nanjing TSMC's 12-inch wafer project started on July 7, 2016. TSMC Nanjing plant only took 20 months to achieve 16-nanometer wafer mass production. According to the Economic Daily, TSMC senior vice president and chief financial officer He Limei A week ago, the Nanjing plant will give priority to filling 20,000 pieces per month, and the follow-up does not rule out the expansion of the factory according to customer needs.
Wuxi Huahong IC project On March 2, Huahong Wuxi IC R&D and manufacturing base project was held. The project will build several 12-inch integrated circuit chip production lines in phases, of which the total investment of the first phase project is about 2.5 billion US dollars. A new 12-inch process integrated circuit chip production line with a production capacity of 90~65/55 nm and a monthly production capacity of about 40,000 pieces will be used to support applications in emerging fields such as 5G and the Internet of Things. After the project is completed, the annual output value will reach 5 billion yuan. The first phase of the project is planned to complete the civil construction in the first half of 2019. In the second half of the year, the construction of the purification plant and the installation of the mechanical and electrical equipment will be completed, and the line will be gradually realized.
Nantong Tongfu Microelectronics Intelligent Chip Packaging and Testing Project Nantong Tongfu Microelectronics Co., Ltd. Phase I Fuwei Intelligent Chip Packaging Test Project has been completed and put into production. It has the world's most advanced packaging technology and produces high-tech smart chips. It is reported that the second phase of the investment of more than 2.5 billion yuan is intensively carried out in the foundation construction, and the future three phases are also proceeding in an orderly manner to promote the planning and construction. After the completion, the base will become the largest in the country, internationally. One of the leading integrated circuit testing and industrialization bases for integrated circuits.
Huai'an era 12-inch phase change memory chip project Huai'an Times Core Semiconductor Co., Ltd. has a total investment of 13 billion yuan, which was completed in March this year. It is reported that after the project is fully completed, it will reach an annual output of 100,000 pieces of 12-inch phase change memory. Annual sales of 4.5 billion yuan, profits and taxes of 300 million yuan, Huai'an will become an important growth pole for the development of the domestic integrated circuit industry.