Allegro LLC Expands Family of DC/DC Buck Regulators with Low EMI

Allegro MicroSystems, LLC announced the addition of A8660, ARG81880 and ARG81801 to the regulator family of devices that reduce electromagnetic interference (EMI) through switching frequency dithering and system noise management through external clock synchronization. Designed for AEC-Q100 automotive-grade standards, these devices are designed for a wide range of input operating voltages, withstand conditions such as vehicle stop/start, cold start and load dump, and can be switched at 2.2 MHz, thus reducing components Dimensions and cost. Comprehensive safety and protection for robust design and simplified component qualification. These devices feature a wide output current range (from less than 1A to over 10A) to provide a tightly regulated power supply over temperature Rail, ideal for advanced driver assistance systems (ADAS), head-up displays (HUD), telematics (de), infotainment, dashboards, cameras, electronic control units, smart home appliances, Industrial automation / robotics, the Internet of Things and other automotive and industrial applications. Allegro can provide these

The A8660 synchronous buck controller can deliver up to 10A of current to the load, meeting the growing demand for higher power in automotive and industrial equipment. This product features flexible power monitoring with adjustable rise delay for Microcontroller reset and power sequencing. A high voltage, enable input that allows shorting of the battery, combined with a second logic level input signal, simplifies the design of the ignition input drive. A8660 uses 4×4 The QFN-20 is available in a tin-winged wing package with an exposed power pad (suffix ES).

The ARG81880 requires only three external components, saving board space and system cost. Optional current limit minimizes inductor and capacitor size, and its 20ns controllable turn-on time helps achieve 18V at 2MHz Conversion to 2.5V, no pulse skipping. The ARG81880 is capable of delivering up to 800mA of output current in a thin 10-pin 3×3 QFN exposed pad with a tin-wrap side package.

The ARG81801 is designed to provide excellent thermal performance for designs up to 3A, even on PCBs with no vias under the thermal pad. This product is available in a 4 x 4 QFN-24 exposed pad with a tin-coated side package.