Micro-network news, ToF sensor chip and 3D vision solution provider Polycore Microelectronics recently announced the completion of tens of millions of yuan of Series A financing, the round of investment by Wuyue Huanuo, Changan Private Capital and Chunxiao Dongke in 2017 Completion. According to Juxinwei, this round of financing will be mainly used for the mass production of ToF sensor chips, and at the same time promote the application and landing of 3D vision technology in many artificial intelligence scenes.
Founded in early 2016, Polycore Microelectronics is currently located in Wuhan East Lake New Technology Development Zone. It is composed of a number of returning Chinese with rich industry experience. It is dedicated to providing high quality in the fields of consumer electronics, artificial intelligence and automotive electronics. Innovative company for performance mixed-signal chips and their solutions. The company currently has multiple product lines including ToF 3D sensing, sensor signal conditioning and intelligent audio, and its high-performance sensor signal conditioning chip has been implemented in the consumer and automotive markets. Shipping.
Has completed 3 rounds of accumulated 40 million yuan financing
Since its inception, Juxin Microelectronics has completed 3 rounds of financing of RMB 40 million. Its sensor signal conditioning chip has been used in production to small batch production in less than one year, achieving the highest precision and lowest power consumption in the industry. Resistance bridge sensor conditioning solution. And ToF sensor chip and 3D imaging solution based on this technology will be the top priority of the future development of the core.
Kong Fanxiao, co-founder of Polycore Microelectronics and general manager of ToF 3D sensing product line, said that the company is working with domestic first-tier mobile phone manufacturers to bring highly integrated, high-performance ToF 3D vision chips to the smartphone industry. System solution.
In terms of ToF sensor chips, Polycore Microelectronics is the first team in China to master Back-Side Illuminated high-precision ToF sensor chips and 3D image algorithm technology. The company expects ToF sensor products to be released at this year. Core specifications such as accuracy, dynamic range, power consumption and size have reached the industry leading level.
In addition, in terms of 3D imaging solutions, Polycore Microelectronics has taken root in the domestic 3D vision industry chain and has established cooperative relationships with first-line module manufacturers in the industry to develop a one-stop 3D depth camera solution, relying on the rapid development of the Chinese market. Together to promote the application of 3D vision technology in various industries.
The ToF sensor chip, the core of ToF technology, has been monopolized by a handful of European manufacturers. The high-performance, high-reliability chips used in smartphones or automobiles are in the early stage of the industry, even in foreign countries. Offering mass-produced products to the market. The core team is from the birthplace of ToF technology, the 'European Silicon Valley' built by Delft/Eindhoven in the Netherlands, Leuven/Brussels in Belgium and Aachen/Siegen in Germany. Leading ToF sensor company, world-class microelectronics KU Leuven and TU Delft, and the world's microelectronics hall - the IMEC Institute in Belgium. Here, the core team has accumulated nearly 10 years of industry experience, from product strategic planning The core technology research and development and the market sales have repeatedly built the industry closed loop. It has created an industry story of three years of sales revenue from zero to hundreds of millions of dollars.
3D camera becomes the next growth point after fingerprint recognition
Compared with other 3D vision technologies, ToF technology has the advantages of excellent system cost, simple and stable structure, long measuring distance, and more suitable for outdoor scenes. It is consistently optimistic by users in the mobile phone, industrial and automotive industries.
Market research firm Yole predicts that Apple will equip at least one ToF depth camera in a new generation of iPhones in 2019 to enable AR and virtual game applications. The major mobile phone manufacturers in the Android camp are also actively deploying in the next generation of flagship models. With the ToF depth camera on the go. With the continuous evolution of technology and cost optimization, after 2020, there may even be two ToF sensors in the Apple mobile phone, leading ToF 3D sensing and imaging technology to become the standard for smart phones.
The application scenarios of smart phones put forward higher requirements for the performance of ToF 3D chips in terms of resolution, accuracy, size, strong light interference, power consumption, etc. It is based on their in-depth understanding of application scenarios and years of industry. Accumulation, Polycore Microelectronics is able to polish its products from devices, circuits, algorithms, applications, etc., bringing the industry's high-precision, low-power ToF 3D chips for smartphone applications, and 3D based on this chip. Imaging overall solution.
Kong Fanxiao believes that the emergence of iPhone X, the first time to bring 3D depth perception technology into mainstream consumer electronics products, with the evolution and maturity of technology, I believe that products equipped with 3D depth camera will become the mainstream of the industry, such as boost Face payment, AR/VR, image enhancement and other applications are rapidly developing. 3D camera will become the next growth point after fingerprint recognition.