Cai said that Licheng has invested in TSV in 2010, which has enabled the operation to continue to grow in recent years, and set a new record for the 12-inch capacity to jump from 30,000 to 80,000 in the short term. The development of traditional packaging technology To the highest level, they will all face the challenge of Moore's Law. As the process evolution becomes a bottleneck, it is necessary to make up for it by encapsulation technology. It is necessary to integrate a lot of technologies.
Cai said that the new packaging technology, including the vehicle IoT, needs new packaging technology. Licheng saw this trend very early. In 2015, it decided to invest NT$3 billion to develop a panel-level fan-out package (FOPLP). The world's first production line was established at the end of 2016. It has been trial-running so far and has been produced in small quantities.
Cai said that the panel-level fan-out package will take at least 2 years from construction to mass production. The market demand is expected to emerge in 2020. The existing technology should cover the market demand until 2025. He pointed out that The production line has been built by only five companies in the world. It is expected to reach medium production in the second half of next year and mass production in 2020.
Cai Yigong pointed out that Licheng has obtained 5,000 pings of land in Zhuke. It is expected that this season will break through the construction of a four-story high-tech factory and fully invest in the construction of advanced process lines to meet the new growth momentum of the operation that emerged in 2020. He believes that the future will be The target customers will not be limited to semiconductors, but will extend to system vendors.
In addition, for the infringement lawsuit of the big customer Micron in China and UMC, the court issued a production injunction, Cai said that it is known that only the solid-state hard disk (SSD) and memory modules, Xi'an plant has discontinued the above products, affecting Licheng Not big. He pointed out that Micron's wafer and component packaging and testing were not affected. "Otherwise, the world should be chaotic now."
Li Jia, general manager of Licheng, pointed out that Infinera’s contribution to Licheng’s revenue in the past was quite high. Licheng actively reduced the proportion of single customers in recent years, hoping not to exceed 30%. With the significant growth in revenue in recent years, the proportion of revenue from Micron’s revenue It has seen a decline, and the risk of impact is relatively low. It is understood that Micron currently contributes about 25% to Licheng's revenue.