In order to make the wearable device lighter and less susceptible, the related 0 components of course want to be thinner and better, at present, however, almost all wearable devices have to assemble 0 components on printed circuit boards, or develop multiple-chip modules (MCM) or system-level encapsulation (SiP), and customize the organic or ceramic substrates that are connected to the chip by the copper wire ( substrate). To that end, Mountain, a new venture company based in Mountain View, Calif., Zglue developed a zip chip (named Zglue Integration Platform), using off-the-shelf minimum commercial chips as a multiple-chip module, But Zglue claims that the company's technology allows customers to fully customize the chip to software, eliminating complex design and modification processes to reduce costs and shorten time-to-market for design and mass production. According to Zglue consultant Greg Taylor, it's not easy or cheap to develop MCM or SIP, but big companies are different. He predicts that developing a SIP prototype would cost more than 200,000 dollars for a small business. The secret of Zglue, according to the introduction, is to use a silicon substrate with a thin grid for a programmable connection between the chips and parts of the resistor, capacitance, and to build a gate valve for power management, system management and storage. Zglue to patent 2.5d/3d IC packaging technology stacking chip; The bottom is zglue unique silicon chip, the upper layer for micro-controller (MCU), sensors, communications, storage and other chips, according to the needs of the product to add the required functions, configuration of different chips, so that the combination of more flexible, lower cost, but also reduce risk, accelerate the time to market. To build a ZIP chip, engineers start with a cloud-based grid and use a drag-and-drop design tool to pick from off-the-shelf 0 component sets. After organizing different 0 components, engineers can use Zglue software to specify different connection paths and generate 0 components and links lists, as well as software development kits for the product. The key to sustaining low costs is that the actual process will not occur until the zero component is placed on the zip chip. The automatic test tool can measure the position of the chip on each zip chip grid, and connect it immediately. The Zglue software obtains the predetermined chip placement map and the actual placement map, and determines that each actual chip is connected to the encapsulated pin (PIN). Subsequently, the routing in software programs The grid, connects the chip to the desired configuration, and stores the programming in the ZIP chip memory. Each zip chip produced by the self-assembly line will be independent of the entire process. This means that the chip does not have to be placed precisely when it is made, so that the device is relatively inexpensive and the process is faster. According to the introduction, the ZIP chip can not only be applied to medical, fashion, sports and other wearable devices, but also can be used in IoT devices, not only reduce the volume, but also reduce costs. Greg Taylor points out that at present it may take at least 6 months to build a polycrystalline module on a substrate, from design to factory production; But the process of zglue can be shortened to about 1 weeks or less. According to the introduction, Zglue's 3 founder Jawad Nastullah, Myron Shak and Ming Zhang, met at Intel (Intel). They evolved concepts to form Zglue key technologies, and went deep into their semiconductor ventures, with collaborations including Transmeta, AMD and Maxim integrated. Consultant Greg Taylor, who served more than 25 years at Intel, has witnessed the birth of 10 generations of microprocessors and made important contributions. The company was founded in 2014, but until the end of 2015 to obtain the SEED accelerator StartX admitted that it won attention only after winning the support of the National Science Foundation and persuading seed investors to invest in Foundation. The first zip prototype was produced in March 2016, while the fully configured ZIP chip was released in May. At present, the company has 40 employees, up to now raise funds of about 10 million dollars. While the company said it was continuing to test new chips, it also claimed to have started mass production.
