Familiar with semiconductor manufacturers frankly, this year mobile phone main swap upgrade needs, biometrics, AI operations, multiple lenses, full screen, etc., will continue to promote the operation

The Helio a series, introduced by MediaTek, is seen as a strategic product that pushes the edge AI concept to the mass market, and the top semiconductor supply system says the mobile chip, with its lightweight AI computing capabilities, will be the focus of upgrades in the smartphone market and has the opportunity to drive a swap. And while the MediaTek a series hits the entry-level smartphone market, it's not sloppy on performance, a series will still select TSMC 12 nm process, the latter segment of the package by the moon and control its silicon products and moon Light Kaohsiung factory to take off the package large single, testing the main focus on the Beijing-yuan electricity, silicon, although the overall smart mobile phone market growth space is limited, But the imaginary space for AI computing is infinite. The market, MediaTek into a number of wafer foundry partners such as Groffand (GlobalFoundries), and even the first use GF 14 nm process, 2019 return to TSMC's projection, familiar with semiconductor supply chain manufacturers revealed that, Although the MediaTek a series hopes to grab into the parity smartphone market, but performance requirements still have a certain level, MediaTek ultimately is still in the TSMC 12 nano-process projection, A22 as a P22 extension, performance, power consumption requirements are still higher than the low-end chip, Semiconductor-related manufacturers do not believe that MediaTek's main AI operation of the mobile phone chip will quickly switch to GF, but the rest of the other areas of MediaTek IC switch to GF, but the action is not groundless. For the relevant wafer foundry partners, specific products and customers, MediaTek and other manufacturers to speak the system does not make public comments. Familiar with the seal test manufacturer said, a series as the main market in the low-end AI mobile phone chip markets, to face is Qualcomm (QUALCOMM) direct competition, but in addition to taking into account the gross margin, MediaTek still needs to focus on the AI generation of high-speed computing capabilities, TSMC 12 nm FinFET process is naturally the preferred MediaTek. According to the relevant manufacturers, a series of large number of wafer testing by the Beijing Yuan Power, and with the Silicon division of food products test orders business opportunities. The package part, to the Japanese-moonlight Kaohsiung Plant for the bulk, Silicon also won some of the packaging orders. Semiconductor-related manufacturers said that this year's smart mobile phone market, although not much room for growth, however, from the wafer foundry manufacturers, the latter part of the test vendor orders to see, the mobile phone market basic disk does not have a particularly large recession, Apple (AAPL) related to various types of IC demand gradually start pull, the sun-moon control, Beijing Yuan electric and so on, Operating performance will usher in the 3rd quarter Peak, the non-Apple camp has also been gradually adjusted inventory in the first half.

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