Bao Li Plastics Co., Ltd. recently successfully used computer-aided engineering (CAE) to analyze the use of liquid crystalline polymers (liquid crystal polymer, referred to as LCP) to produce connector components of the reflow deformation problem.
Reduce thermal deformation and improve the yield of good products Currently, LCP connectors are growing rapidly in applications of smartphones, power switches and automotive-related components.
This analysis technology will be beneficial to improve product processing efficiency and yield.
LCP components can be significantly expanded in the reflow process in high temperature environments, which adversely affect the smoothness of the finished product.
Thermal deformation may affect the welding of LCP components and metal ends, thus reducing the adhesion between LCP components and metal ends, and reducing thermal deformation is important for the processing of LCP components.
Cae Predicting three phase product variants
Bao plastic try to use CAE, according to the product in the design phase of the deformation defects, to predict the reflow process of molded products. The Baoli LCP grade Laperosⓡ resin, which has a rigid molecular structure, is difficult to bend, and, like most polymers, has a weaker molecular interlocking.
Therefore, LCP has better dimensional accuracy and heat resistance, and can withstand high reflow temperature during solder bonding. Bao Li Plastic found that using CAE analysis can predict three stages of product deformation.
This includes the initial deformation after forming (warpage), due to thermal expansion and shrinkage caused by the peak thermal deformation, and thermal contraction caused by cooling deformation.
Bao-Li Plastics will continue to promote the development of CAE analysis technology to improve its accuracy and expand its scope of application. Prediction of the deformation of LCP connectors by CAE assisted Plastic Plastics