Toshiba Storage today announced that it has developed a 96-layer stacked 3D QLC flash prototype, using its own BiCS stereo stacking technology, and working with Western Digital.
Compared with the current TLC flash memory, the new generation QLC increases the data that each unit can store from 3 bits to 4 bits, so the capacity can be greatly improved. Of course, with the decline of read and write performance and life, it needs to pass the flash memory. Master control, algorithm and other aspects of optimization cooperation.
Toshiba disclosed that their 96-layer BiCS QLC flash single-chip has a maximum capacity of 1.33Tb and can be packaged in a 16-chip stack architecture, providing a compelling capacity of 2.66TB in a single package.
Toshiba will showcase the latest results at the 2018 Flash Summit on August 6-9, and ship samples to SSDs and OEMs in early September. It is expected to be put into mass production in 2019.
Toshiba said that it will continue to improve the capacity, performance and meet the needs of the data center market in the future.
At the same time, Intel has also begun production of the first SSD using 3D QLC flash memory for the data center market, but the details are not clear.
