On the morning of July 17, Intel and Micron announced that the 3D Xpoint storage technology cooperation between the two parties continued to advance. Will work together to develop second-generation 3D Xpoint flash memory chips.
3D Xpoint is a non-volatile storage technology that offers extreme durability and low latency. The current commercial product is represented by Intel Optane.
It is reported that, The second generation of 3D Xpoint will be completed in the first half of 2019 And still manufactured at the IMFT (Intel-Micron Flash Technologies) factory in Lehi, Utah.
According to the data, 12 years ago, Intel and Micron established a joint venture IM Flash Technologies (IMFT). The first products were 72nm NAND. In 2012, Intel sold the shares of most IMFT factories to Micron, but only retained Lehi is a stronghold.
However, it should be noted that Intel and Micron have determined that they will 'divide their way' after 2019, that is, independently develop third-generation or more advanced flash technologies. After all, Micron's QuantX is a long-term dystocia, and it is a de facto competitive relationship with Aurora.
When Intel first announced 3D Xpoint storage, it claimed to be 1000 times faster than current SSD flash memory, 1000 times longer and 10 times denser, but the first generation is far from this level. It seems that at least two generations are needed. Efforts, especially considering that 3D Xpoint will enter the memory market in the future.
