Wafer two brothers battle, Gexin force 22FDX, UMC promotes acquisition and A-share listing

Gexin and UMC competed for the status of Wafer II, and Gexin announced on the 12th that the 22nm fully depleted silicon-on-insulator (FD-SOI, 22FDX) technology has been favored by customers and has created more than US$2 billion. Design revenue.

This is the first time that Gexin announced that the process passed the vehicle standard IC standard and quality certification, and officially announced that it has achieved significant results in the automotive, 5G and Internet of Things (IoT).

Gexin is currently one of the few wafer foundries specializing in 22FDX. Gexin emphasized that the 22FDX process has now received more than 50 customer product introduction designs.

UMC announced the acquisition of the entire shareholding of Fujitsu's joint venture, Fujitsu Semiconductor (MIFS), and the application for A-share listing in China. The industry believes that this will help UMC deepen Japanese cars. Use market layout, and through the mainland's booming capital market to raise more funds to seize the mainland semiconductor business opportunities.

Unlike TSMC 22FFT, the core 22FDX locks lower voltage semiconductor components, and efficiently integrates RF, transceiver, baseband, processor and power management components into a single chip with low power and high density. The design of the body circuit is a device that requires long-lasting battery life, improved processing capability and wiring capability to achieve high performance requirements.

The core 22FDX has been favored by the IoT chip factory with the support of Synaptics IP. The core technology and the process technology platform are extended to artificial intelligence (AI), AR/VR, 5G and advanced driver assistance systems. (ADAS), automotive semiconductors and other fields.

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