Artificial intelligence IoT prospects wide NXP to | 'cross-border' | processor attack

In recent years, with the rapid development of the Internet of Things and the application of artificial intelligence in the field of edge computing, system designers hope that the embedded processor can combine high performance and low cost, and at the same time have higher security. Introduces the innovative cross-border processor i.MX RT series, which fills the gap between MCU and application processor. Recently, NXP held the i.MX RT media conference again. NXP senior vice president and microcontroller Geoff Lees, general manager of the business line, introduced the latest developments of the i.MX RT series with relevant teams, and deeply explained the market prospects of microcontrollers, the latest development and application of edge computing technology in the context of the rapid development of artificial intelligence Internet of Things. .

The product line is further enriched, and i.MX RT is recognized by users.

Over the years, the embedded processing field has been divided into two camps based on design requirements: MCUs that require cost-effective and flexible applications, and applications that go beyond the MCU's functional range will use application processors. But with the development of the Internet of Things and industry Market demand is changing, such as the 'always on' function, which requires continuous monitoring of the sensing signal, processing of information from various sensors, and real-time wake-up from sleep mode while maintaining low power consumption; For example, GUI (graphical interface) is increasingly integrated into IoT systems, and higher requirements are placed on the performance of embedded processors. Based on these requirements, NXP Semiconductors introduced the 'cross-border' embedded processor i.MX RT. In response to market demand, we can improve data processing capabilities and improve user experience without increasing cost and power consumption. After one year of development, the i.MX RT series has gained more user recognition. According to NXP's microcontroller business Zeng Jintao, senior product manager of the line globally: 'The first i.MX RT series product i.MX RT 1050 was released in June last year, and mass production was realized in October. Less than one In the course of the year, four major customers in the Chinese market have begun to use this series of products in large quantities. In addition, we are currently working with 2,500 customers to develop projects. The i.MX RT series has generated a potential market of the order of $500 million. . '

Currently, NXP is further enriching the i.MX RT series product line. Based on the i.MX RT 1050, this year's enhanced version of the i.MX RT 1060 is available, with enhanced performance and configuration; i.MX RT The positioning of the 1020 is more cost-effective, with a 500MHz clock speed, a comprehensive interface, and encryption. In addition, NXP is also targeting the Chinese market, based on the i.MX RT 1050, a large package version, reducing the PCB In the case of board costs, users can get a higher price/performance ratio.

Zeng Jintao also introduced the next product plan of i.MX RT. 'Next, we will also introduce the i.MX RT series of enhanced DSP, which will enhance the processing capabilities of speech recognition, artificial intelligence, hardware acceleration, etc. after integrating the DSP module; Launched integrated WIFI, Bluetooth i.MX RT series, extended the networking capabilities of embedded chips; introduced the more cost-effective i.MX RT 1010, introduced the version of the package i.MX RT processor and flash module.

The i.MX RT series will form a KE1X series, DSC series and other microcontroller products for smart home appliances, and i.MX 6ULL ​​series, i.MX 6SL series and other application processors for a wide range of IoT applications. A new product line that meets the needs of high performance and low cost IoT market applications.

Artificial intelligence pays attention to edge computing and strengthens cooperation with the Chinese market

Artificial intelligence is also the focus of this media event. With the rapid development of artificial intelligence, the Internet of Things field in the edge computing environment has become more and more widely used. In this interview, Geoff Lees pointed out: 'Artificial Intelligence allows machines to perceive the environment and enable them to respond better to human commands. As processor technology advances, artificial intelligence is shifting from cloud computing to embedded applications while still evolving rapidly. I am very concerned about the development of artificial intelligence, and I hope to introduce artificial intelligence technology into the intelligent Internet of Things.

According to Geoff Lees, NXP emphasizes cost and application in the development of artificial intelligence. 'No one will do AI for AI. Artificial intelligence technology will eventually go to productization. The key to landing is cost. It is an application. NXP's products and solutions have a wide range of applications in the field of edge computing of the Internet of Things. As the market demand for AI technology increases, we will choose the appropriate AI core to join existing products, users do not have to Developing application software. The overall solution of 'turnkey' is our development direction and our strength. ' Geoff Lees said.

At the same time, Geoff Lees is very optimistic about the development of artificial intelligence in China. 'I think China's artificial intelligence and machine learning market is leading the world. Although American companies first started to develop AI technology, now the breadth of Chinese companies developing AI products is other countries. There is no way to compare. Chinese AI products are diverse, including toys, which have begun to emphasize the concept of AI. China is the most active area in AI applications.

Therefore, NXP will strengthen its cooperation with Chinese companies in the field of artificial intelligence in edge computing. According to Geoff Lees's concept, cooperation can be divided into three phases: The first phase is to cooperate with the artificial intelligence company of China's voice-side, related operations. The system and ecosystem are ported to NXP's products, not only in i.MX 7ULP, i.MX8M and other application processors, i.MX RT and other cross-border processors, even in lower-end microprocessors. The relevant ecological environment and operating system will be transplanted. The second phase is optimization. NXP will work with Chinese universities and research institutes to transplant relevant research results into products, including tools, language algorithms, etc. Not all data Processing operations must be done in the cloud, many machine learning algorithms can be optimized locally and more efficiently and safely. The third stage is to transfer more advanced machine learning, algorithms to low-cost microprocessing. On the microcontroller, the application range of machine learning is further extended in the field of edge computing.

NXP's focus on artificial intelligence focuses on edge computing, while emphasizing cost, application, and collaboration with the Chinese market.

Optimistic about the FD-SOI process, suitable for the intelligent Internet of Things market

The development and transformation of artificial intelligence Internet of Things is promoted by the combination of microprocessor technology and process technology. In terms of manufacturing process, FD-SOI route becomes the focus of NXP's intelligent Internet of Things layout.

In the 2017 media event, GEOFF LEES said that NXP's embedded application processor will focus on FD-SOI technology. There are two reasons for adopting FD-SOI: First, with the development of technology, chips The complexity is getting higher and higher, such as integrated analog circuits, RF circuits, etc., and also requires the chip to have lower power consumption. Some applications require a fast wake-up function to communicate with the network cloud in real time. 'I personally think FD- SOI is the most suitable chip manufacturing process for IoT applications. ' GEOFF LEES said.

As a semiconductor manufacturing process, FD-SOI has many technical advantages, such as reducing parasitic capacitance and increasing device frequency. Compared with bulk silicon, the frequency of SOI devices is increased by 20% to 35%. Due to the reduction of parasitic capacitance, leakage is reduced. Current, SOI device power consumption is reduced by 35% to 70%; the latch-up effect is eliminated; the pulse current interference of the substrate is suppressed, and the occurrence of soft errors is reduced; and compatible with the silicon process, the process can be reduced by 13% to 20%, etc. In the low-power IoT chip products, the FD-SOI technology has its own characteristics.

It is understood that NXP's i.MX 7ULP has been mass-produced with Samsung's 28nm FD-SOI, and six chips are in preparation, including i.MX 8 and i.MX 8X, and iMX RT will also be transferred. To the FD-SOI process.

At present, there are two major OEM companies in the world with FD-SOI production lines - Samsung and Grofund. In addition to the 12FDX process development in Dresden, Germany, Grofund is expected to be put into mass production in 2019. It is also building a FD-SOI production line in Chengdu, Sichuan, China. Shanghai Huali Microelectronics, a foundry company in China, has also reported the development of FD-SOI production process.

GEOFF LEES said that when the technology is mature, it does not rule out cooperation with other foundries.

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