Gexin is about to deliver Socionext's next-generation graphics controller

Today, Gexin announced that Socionext Inc. will manufacture the third generation, also the latest generation of graphics controller SC1701, which uses a 55nm low power extension (55LPx) process technology with embedded non-volatile memory. The 55LPx platform supports several new features in the Socionext SC1701 series, including enhanced diagnostic and security protection for advanced in-car display systems, cyclic redundancy code (CRC) verification, picture freeze detection, and multi-window signature units. Socionext will The SC1701 will be available from the end of July.

In recent years, the number of in-vehicle electronic systems has risen exponentially, and the demand for multiple content-rich displays has increased. Socionext's SC1701 controller integrates multiple system component functions with APIX®3 technology and automotive safety functions. To meet the ever-increasing demands for high-speed video and data connectivity, as well as stringent security requirements. The device supports up to single UHD (4K) or two FHD (2K) display resolutions at 30bpp and utilizes VESA® The Display Stream Compression (DSC) method can receive two separate video streams over a single link. In addition, the SC1701 provides video content protection through built-in HDCP decryption technology for a richer user experience.

The core 55LPx platform uses SST's SuperFlash® memory technology to provide a fast-developing solution that is fully compliant with consumer, industrial and Tier 1 automotive-grade standard applications. With SuperFlash on the 55LPx, it can be implemented Small unit size, faster read speed, and better data retention and durability.

At present, Gexin is mass-produced in Singapore's 300mm production line to support 55LPx platform. In addition to SC1701, Socionext is currently relying on this technology to develop a number of products, as well as ON Semiconductor, Silicon Mobility and Fudan Microelectronics. The grid core 55LPx platform to optimize its chip design for wearable IoT and automotive products.