Apple, Huawei, Samsung and other well-known semiconductor products are now in Wenzhou.

It is hard to imagine that in domestic semiconductor packaging materials, a wire less than a fine hair, comes from a company in Wenzhou.

The production process of its products is complex, and the entire process is carried out under a high degree of purification, constant temperature and humidity, and a microscope. The strict management of product production requires strictness and is beyond the imagination of many people.

Entered Zhejiang Jiabo Science & Technology Co., Ltd., located in Yueqing Saltpan Industrial Zone, a high-tech enterprise engaged in R&D, production and sales of bonding wires for semiconductor packaging materials. The entire production plant is a sterile production plant where workers are required to enter and exit. Strict security checks and aseptic dressing are only allowed. More high-end is that each machine here is worth millions of dollars, and the highest one is more than 8 million yuan. In the words of the workshop manager, production is between , Ding point error is often a thousand miles.

Bonding wire is one of the five important structural materials for semiconductor packaging. It is a special material for semiconductor packaging. The materials are all precious metals such as gold or silver. Once out of waste, the cost is very high.

The diameter of the bond wire produced is only from millimeters to micrometers, less than half of the hair. Not only is it resistant to high temperatures, but also resistant to oxidation and fracture, it has high requirements for conductivity, chemical properties, and weldability. High-end bond wire has always been imported.

This situation is changing, and many domestic counterparts are struggling to catch up. This high-end semiconductor-specific material has increasingly appeared in Chinese manufacturing. Jia Bo has been exploring the pioneers in the field at the moment of its establishment.

For many growth companies, the survival of the first, R & D center is a very distant matter. From the beginning of the establishment of Yueqing in 2009, Jiabo technology is committed to innovation, take half of the profits each year for technological innovation and research and development. In terms of the responsible person, only the core technology is the king, and the iron pot is also responsible for research and development. To this end, Jiabo has established a key alloy wire R&D center, a closed test R&D center, and a wire aging research and development center. Center, and cooperation with Zhejiang University, Zhejiang University's Bonded Wire Technology Center settled in the company. This is the first time Zhejiang University has set the Bonding Wire Technology Center in Yueqing private enterprises.

The quality and quality requirements of Jiabo Company are almost exact. The products produced must go through an elemental plasma spectrometer, and after aging of the finished product, the thermal shock life test should be conducted. Each batch of products must undergo extended performance, breaking test. It can be said that A product has to undergo 'resonance', it is with excellent quality, has been at the leading level in the semiconductor packaging materials industry. Products accounted for nearly 20% of the national market share, has become the main drafting unit of national industry standards. Apple mobile phones, Siemens and other well-known domestic and foreign products are behind Jia Bo manufacturing.

Entering the product laboratory of Jiabo Company, each precision instrument tests various parameters such as heat-resistance, corrosion resistance, elongation, etc., of the bonded wire product to be delivered. In the words of the staff, even if there is only a slight error, the company They are all treated as waste, and they are guaranteed to be completely safe. Many welding of bond wires can only be seen under the microscope. For the staff in the lab, the products here are invisible, but the product defects are never invisible.

With the rapid development of electronic technology in recent years, the continuous upgrading of smart home appliances, digital electronics, and automotive electronics has driven the overall scale of the semiconductor packaging industry to continue to expand. Future competition is even more cruel. 'To improve our innovation capabilities, we must not rely on our own efforts. Ladder climbs up and uses external forces to jump out of the local area to integrate talents, capital, and other innovative resources and elements to enhance the overall strength of innovation. ' This is the prospect of Xuebo Night, the chairman of Jiabo, and the future development of Jiabo. .

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