Compared to AMD's frequent display of its desktops for many years, server processor planning roadmap, and various reports on the success of the next generation of products, Intel's side is too boring, the future of plans, and many places are uncertain .
Now foreign media has exposed the plan of an Intel Xeon server processor, but also admits that there are too many uncertainties, and with the CEO Ke Zaiqi because of Taoist news, classes, the future of Intel's overall strategy and product planning is also likely There will be major adjustments.
Cascade Lake-SP
This is officially announced and will be released later this year.
14nm++ process , Existing Skylake-SP Xeon Scalable Xeon Extensible Family Upgrade, Interface is LGA3647, The biggest change is Support Optane DIMM memory stick.
Cascade Lake-AP
The first time I saw it, it was released in 2019.
The suffix 'AP' means 'Advanced Processor', or 14nm++ process, Using MCM multi-chip packaging, the two Cascade Lake-SP cores are integrated together (commonly known as glue Dafa) to gain more cores and compete with AMD EPYC.
Intel Xeon currently has only a maximum of 28 cores. The Cascade Lake-SP family is still the most constant because of its nature. AMD EPYC already has 32 cores. The next generation is very likely to be more. Intel has to compete with the first batch of its own. Dual-core, quad-core, again out of the MCM package.
In fact, AMD EPYC is an MCM package, with four Dies inside each processor. Intel just mocked when it was first released. It has to be done now...
Cooper Lake-SP/AP
This code is also the first time I saw it, Still using 14nm++ process , released later in 2019 or 2020.
It is similar to Cascade Lake-SP/AP. Also a native, an MCM package that supports six UPI buses , Other details are unknown.
It also appeared to be an accident. The root cause was that 10nm could not be mass-produced at a later stage, and it had to temporarily increase the number of products to transition.
Ice Lake-SP/AP
The 10nm process has finally arrived, and the improved version is 10nm+In other words, the current process stage is likely to eventually fail to solve the mass production problems, and it has to be reformed again, but It will be released in 2020 at the earliest. It may even be until 2021.
In addition to the new process, Ice Lake will also have a new interface LGA4189, new architecture, support for eight channels of memory, and finally comparable to AMD EPYC.
From the time point of view, AMD should release the 7nm+ process during the period 2020-2021, the third-generation EPYC Milan of the Zen 3 architecture, but according to AMD, their 7nm process, the competitor of the second-generation EPYC Rome of the Zen 2 architecture. Is Ice Lake.
According to this speed, Intel’s incomparable server field will face the embarrassing situation of both the technology and the architecture. It is no wonder that Kecchi will admit that the server and data center market may be robbed of up to 20% by AMD. The share.
