Global 5G communication generation is about to be in 2020 commercial operation, technology manufacturers Samsung Electronics, Huawei, Qualcomm and other actively expand the layout, although for the Taiwan chip industry, 2021-2022 years is the real outbreak, but consider the launch can not delay the investment, The latter part of the testing industry has a lot of thinking about a variety of new state packaging technology, and expected 5G generation compared to 4G will have greater change, the need to include a number of IC system-level packaging (SiP), will be in the 5G generation play a very important packaging process. Industry estimates that the 2020 5G market will create a global hardware and software supply system of 580 billion U.S. dollars output value, then 5G smartphone sales to see 2 million, 2025 will be more than 1.1 billion, the substitution effect quickly play, become the smartphone market the most important growth kinetic energy. Because of the technical complexity of the 5G smartphone internal module, the encapsulation technology must take into account the thin and short demand of semiconductors for mobile devices, and it has many functions, and the new type of SIP will become the key packaging technology of 5G generation. In fact, from TSMC, Sun-Moon, MediaTek and other industry development trends, has highlighted the 5G generation of advanced SIP packaging technology needs. Semiconductor industry revealed that the next generation of packaging technology will import more fan-type (fan-out) packaging, such as 5G front-end module FO-AIP antenna packaging. It is noteworthy that, as TSMC entered the Advanced Packaging field, the publication of the following 10 nm process wire links to each other two bare crystal, called Integrated chip system (system-on-integrated-chips; Soics) encapsulation technology, which is quite similar to the SIP package, also means that SIP encapsulation is no longer just the strength of a professional-sounding factory, TSMC has stepped into the SIP package and is no longer limited to the advanced encapsulation of a single chip. The survey operators said SIP will be the 5G generation of important packaging technology, such as 5G RF (RF) module architecture, obviously different from the 4G era, it will include 12~16 IC, which makes the importance of SIP, the estimated day of the moon, the core and other positive layout of the seal of the survey industry will benefit, The related SIP package Base board industry such as Jing and so on is also expected to benefit synchronously. The survey operators pointed out that, in the current development of the pace of view, Taiwan's IC design industry is slightly slow, Han Samsung, Lu plant Huawei are very positive to enter the 5G business opportunities, for the latter section of the test industry, even the next half of 2019 years will have 5G chip test revenue contributions, Taiwan plant more think the real fermentation point of time after 2021,
