In the era of high tide of mobile electronics products, micro-net news gathered that the companies of packaging and testing have also emerged. Due to the pressure of rapid update of the electronic product market, the requirements for the quality of packaging and testing as well as the output requirements are also rising.
According to the prediction of the Tiepi Industrial Research Institute of TrendForce, the top 10 packaging and foundries in the first half of 2018 will have an estimated revenue of 11.12 billion US dollars, an increase of 10.5% year-on-year, which is 16.4% lower than the same period of last year.
Changjiang Electronics, Tianshui Huatian, Tongfu Microelectronics accounted for a new high
Among them, Changjiang Electronics Technology, Tianshui Huatian, and Tongfu Microelectronics all had double-digit growth. The three manufacturers accounted for 26.9% of the top ten packaging and foundry total revenues, a record high.
In terms of rankings of the world's top ten IC IC manufacturers, there was no change in rankings in the first half of the year. In order to control Sun Moonlight’s investment in its subsidiaries, ARKEL, Jiangsu Changdian, and Sun Moonlight invested in its silicon products, Licheng, Tianshui Huatian, Tongfu Microelectronics, Lianhe, Jingyuandian and Nanmao.
This ranking has not changed much compared with 2017, of which only the joint test rose by one, ranking eighth, and Jingyuan Electric falling one place, ranking ninth.
In terms of revenue growth rate, Changjiang Electronics Technology, Tianshui Huatian and Tongfu Microelectronics have increased their revenues by 18.7%, 40.9%, and 17.2% respectively in the first half of the year, both of which have achieved double-digit growth. .
Topo Industrial Research Institute pointed out that in the first half of the year, due to the slowdown in high-end smartphone growth and wafer price increase, except for the annual growth rate of the packaging and foundry industry, the global IC packaging and testing industry was also affected, with an estimated output value of 251.5. Billion US dollar, an increase of 1.4% year-on-year, a significant decline from 9.1% in the same period last year.
Domestic IC packaging and testing into the fast lane of development
With the rapid rise of emerging industries such as Internet of things, big data, and intelligent terminals, China's integrated circuit packaging and testing industry has begun to move from the previous low-end packaging field to high-end advanced packaging technologies. The advanced packaging market for R&D and layout has also become a Long Power, Hua Tian and Tong Fu Microelectronics and other packaging companies to test the important driving force for growth in revenue.
Previously, Tiebo Industrial Research Institute stated that due to the global industry consolidation and increased competition, China's IC packaging and testing manufacturers will focus on developing high-end Resident Evil packaging technology and market share from overseas acquisitions, and instead focus on developing advanced technologies such as Fan-Out and SiP. Packaging technology.
According to the capacity planning of Chinese fabs, it is estimated that the monthly production capacity of Chinese 12-inch wafers by the end of 2018 will actually increase by approximately 162,000 units. By then, the total monthly production capacity in China will be 1.8 times the original capacity of 200,000 units. These production capacities will increase further. Become an important driving force for China's packaging and testing industry to grow in 2018.
The main reasons for the growth of IC packaging and testing industry in China are:
In 2018, China's semiconductor domestic demand market, dominated by smart phones and other communications, is expected to grow by 6.5% annually.
Domestic packaging and testing companies continued to expand their production capacity, and local companies such as Jiangsu Changdian and Nantong Huada Microelectronics were supported by the government through semiconductor funds, and their expansion of production was relatively positive for foreign-funded enterprises.
Domestic domestic packaging and testing industry acquires technology through mergers and acquisitions. For example, Jiangsu Changdian acquires STATS ChipPAC, Nantong Huada Microelectronics acquires AMD Penang Plant and Suzhou Plant, etc., becoming China IC packaging and testing industry growth. One of kinetic energy.
TPI also pointed out that although the market is generally optimistic about such topics as automotive, 5G, and artificial intelligence (AI), the technology is still in the introduction stage, which has limited the output value of the industry in the field of sealing and measurement, and is at a disadvantage in the industrial value chain. In the segment, faced with the slowdown in the growth of smartphones, silicon wafer price increases led to higher costs. Most companies' gross margin performance in the first quarter was not as high as the same period last year.
Looking ahead, Tiebo Industrial Research Institute believes that although the traditional sales season will enter the second half of the year, wafer manufacturing costs will continue to increase as the wafer supply and demand gap expands, and the gross margin pressures faced by the industry will continue to reach the end of the year.