'Rumors' Kirin 710 adopts Samsung 10nm process | Performance exceeds Kirin 960;

1. Looking forward! Ziguang Zhanrui 'core' brand is released online on June 13; 2. Chuan Kirin 710 adopts 10nm process performance beyond Kirin 960 or July release; 3. 'Dedicated universal core', Shenjian Technology Tao AI core was launched in the second half of the year; 4. Mo Dakang: Zhang Zhongmou pushes the OEM to the extreme; 5. Ziguang Group has become the focus of the global semiconductor industry; 6. China Electronics and Nanjing jointly create high-frequency device industry technology research institute; 7. The Xiamen Torch Hi-tech Zone insists on high-end leadership in the layout of the next generation of innovative pillar industries;

1. Looking forward! Ziguang Zhanrui 'core' brand is released on the 13th of June;

Set micronet June 11, news, Ziguang Zengrui announced today, June 13 full-core brand will be released online, this will be the first time after the formal merger of Spreadtrum and RDA released a brand new strategy.

On January 19, 2018, Spreadtrum and RDA formally announced their merger. Ziguang Group officially responded to media such as Microblog and stated that the merger of Spreadtrum and RDA will gradually realize synergy in development strategy, product planning, marketing organization and operation management. Development. After integration, at the product service level, Spreadtrum will continue to focus on independent R&D and design of baseband chips for 2G/3G/4G/5G mobile communications; RDA will be committed to the R&D of core technologies in the field of IoT to better To meet the diversity of customers' choices and realize their long-term commitment to customers. From 2016, Ziguang Group will integrate its Spreadtrum Communications and RADIKE into Ziguang Zengru. January 19, 2018, to fully focus on the technologies of the two companies. With product advantages and maximization of resource sharing and business collaboration, Ziguang Group further integrated the two companies in the management system and organizational structure, with a view to achieving rapid development in innovation capability, chip independent design, and independent intellectual property rights. Drive the overall competitiveness with the driving force of 1+1>2, and enhance the strength of mid-to-high-end technology products, thus more actively promoting the development of China's semiconductor industry.

According to Micronet, Ziguang Zengru achieved a new round of personnel appointments. Since he took office as CEO of Spreadtrum last November, Zeng Xuezhong was promoted to CEO of Ziguang Zengru. Ziguang Zengru officially completed the integration of leadership and system architecture. In July, Ziguang Group acquired Spreadtrum Communications for US$1.8 billion. In July 2014, Ziguang Group completed the acquisition of RDA Microelectronics for US$907 million. For Ziguang Group, how to achieve the integration of the two companies has been affected by the industry. Paying close attention. In February 2016, Ziguang Zengrui was established. Spreadtrum and Rydico are affiliated to Ziguang Zengrui. However, the two companies are still operating independently and have their own system architecture and staffing. According to statistics, as of the end of 2016, Ziguang ZhanRui has become China's largest chip design company, achieving annual shipments of more than 1 billion chips, including 650 million mobile phone chip shipments. At present, Ziguang Zengru has become the world's third largest mobile phone baseband chip design company, largest in China. Pan chip supplier, China's leading 5G communications chip company.

2. Chuan Kirin 710 using 10nm process performance beyond the Kirin 960 or July release;

With the official launch of Huawei's glorious Play with its 'very scary technology', the unicorn 710 processor that will be debuted next month has naturally become a hot spot for everyone to follow. Although it is still unclear about the specific release time, according to the news According to people's comments on Weibo, the Unicorn 710 processor will use the Samsung 10nm LPP process. The specification is simply the Kirin 960 CPU downclock + Kirin 970 GPU denuclearization. Performance should look like a Kirin 960. Between unicorn and 970.

Kirin 960 frequency reduction version

Despite the news that the Kirin 710 processor codenamed 'Miami' will officially debut next month, there are currently fewer relevant specifications leaked on the Internet. According to sources disclosed on Weibo, according to sources, Qilin The 710 processor uses Samsung's 10nm LPP process. The main reason for the replacement of OEMs is that TSMC's OEM billing costs are relatively high. Most of Huawei's foundry business has been handed over to Samsung Semiconductor.

As for the specifications of the Unicorn 710 processor, in addition to Samsung's 10nm LPP process technology, sources said that it will be the Unicorn 960's CPU frequency reduction + unicorn 970 GPU drop core, Huawei is said to test the water in the midrange chip , Based on the ARM public version Cortex-A73 to make changes, but afraid of power problems can not be solved.

Positioning is similar to Qualcomm

And if this news is true, then it means that the Unicorn 710 will be a 4×A73+4×A53 architecture with a Mali-G72 GPU, but in the end it will become a matter of how many cores there is no exact statement. In the past, there was news that the Unicorn 710 would use dual-ISPs or ISPs that use the Unicorn 970 processor. If the NPU is also added, then the overall performance will undoubtedly be worth looking forward to. But if it has the same positioning, The comparison of the Snapdragon 710 processor, the source said that the A73 architecture could not be changed with the A75.

However, this does not determine that the performance of the Unicorn 710 is inferior to that of the A75. After all, the performance of the evaluation processor also includes other factors such as the GPU. In addition, Huawei still has 'very scary technology', so it can only formally become available in the future. Only a more accurate comparison can be made after the release. In addition, from the specifications of the Kirin 710 exposed this time, and Xiaolong 710 run points to tie the performance of the Xiaolong 835, both Huawei and Qualcomm seem to have adopted similar The strategy, which is to let the midrange processor achieve the performance level of the previous generation flagship processor.

Huawei Nova 3 starting

It should be noted that the relevant specifications of the above Unicorn 710 processors are all network rumors, but if they can achieve 80% of the performance of the Unicorn 970 processors as rumored, they are supplemented by optimization of the GPU turbo and special NPU chips. Then as the Kirin 659 upgrade product launch Kirin 710 is undoubtedly quite worth the wait.

As for the starting model of the Unicorn 710 processor, it is reportedly codenamed 'Paris', which is the legendary Huawei nova 3. Currently, PRA-AL00 and PRA-TL00 models have achieved 3C certification, and Huawei nova 3e is supported. The same 18W fast charging technology. The rumor is still Liu Haiping design, but the aspect ratio becomes 19.5:9, it is possible to load 12MP+16MP dual cameras, will officially debut in July this year. Tencent Digital

3. 'Dedicated universal core', Shen Jian Technology's audio-visual AI core was launched in the second half of the year;

Nanjing Report on Micronet (Reporter/Xiaobei) 'The development of the AI ​​era was driven by three key elements: algorithm, data, and computation. ' Shen Jian, Vice President of chip R&D Chen Zhongmin held the "Ministry of Industry and Information Technology Core Dynamics Talent Program" on June 6. The keynote speech was given at the workshop of the “Master Core Thinking” Technology and Application Seminar in 2018. The status of AI general-purpose processors was analyzed, and high-efficiency, low-power deep-deep DPUs were introduced.

During the forum, Mr. Chen Zhongmin accepted an exclusive interview with Microtel.com, stating that the Shenzhen-listen chip series is expected to be available in the second half of this year and will provide engineering samples to customers for trial.

At present, China's AI start-up companies are contending. Each startup's AI chip has its own unique architecture and software development kit. What are the advantages of the Shenzhen-based DPU technology-based Tingtao AI chipset? According to Chen Zhongmin Mr. introduction, Hetao series AI chip has the characteristics of universality and high efficiency.

The Hearing chip is not implemented for a single algorithm ASIC. The convolutional neural network algorithm can be developed, deployed and operated on the HearTao hardware platform. Therefore, it is versatile. The listener chip pin is in the instruction set, micro-architecture, memory access, and many other aspects. The optimized design has resulted in a very high operating efficiency. In this way, even more power can be achieved with the same power consumption. In other words, the same power is achieved with shorter time and lower power consumption.

According to Chen Zhongmin, Shen Jian Technology focuses on the field of deep learning reasoning acceleration. Products include IP, FPGA solutions and upcoming chip solutions. Chen Zhongmin stated that Shen Jian's products are both special and universal. Dedicated, deep The goal is not pervasive computing. It is not a variety of procedures. It is a way of neural network computing. In general, on the premise of accelerated application of neural networks, it is a general framework for deep learning. The customer's neural network algorithm All of them can be mapped to their hardware platforms for operation through deep toolchains and compilers. In view of this, different system vendors or algorithm developers can easily migrate their own algorithms to deep-seated systems. Hardware products are more versatile than other domestic AI hardware companies.

With the slowdown of Moore's Law and the explosion of massive data, giants have shifted from general-purpose computing platforms to customized platforms. Microsoft has made use of FPGAs to force Google to build TPU platforms. While pursuing better performance, different application scenarios are proposed for AI hardware. Different requirements, mainly power consumption, response time and cost, such as security monitoring applications require less than 5W power consumption, automatic driving applications put forward higher requirements for real-time.

In response to the above requirements, Shenzhen Shenjian Technology adopts an optimized computing engine, optimizes the memory access system, and utilizes the sparseness of the neural network to optimize the software and hardware.

It is reported that Shen Jian Technology has been exploring depth optimization techniques. The DECENT depth compression tool incorporates pruning, quantification, and other compression techniques to compress computation models on the premise of ensuring accuracy. Neural Network Compilers DNNC maps the DECENT-compressed neural network model after training to an optimized instruction stream that is efficiently executed on the DPU. DNNC implements mapping from algorithm to deep-defined custom machine code. Therefore, the system memory bandwidth and power consumption requirements can be reduced.

Deep-DPU uses the same parallel computing as GPUs. GPUs excel at massive parallel operations, such as training a complex deep neural network model in the cloud. This work is currently only available for Nvidia's GPU clusters, Google TPU and others. According to reports, deep The DPU focuses on a lightweight parallel architecture, with 8 bits as the main operating unit, enabling lower power consumption, faster response time, and lower power consumption to bring customers lower costs.

According to Chen Zhongmin's introduction, Shen Jian is focusing on the data center, security monitoring, and automatic driving. The data center business is the direction of deepening the initial effort, and there are some successful cooperation cases. After 2017 in the field of security monitoring and automatic driving Business has invested more energy. (Proofreading/Xiaobei)

4. Mo Dakang: Zhang Zhongmou pushes the OEM to the extreme;

Today's foundry, long ago, is not the UMC. The foundry positioning of TSMC was not a so-called fab-lite. It is an open platform model that not only has IDM capabilities but also adheres to OEM services. Networking, AI era migration, market demand IC design companies must establish a deeper cooperative relationship with foundry. It is reflected in the fact that both parties are not only increasingly dependent on manufacturing, but also have to maintain close communication in market definition. The relationship even extends to the terminal link, forming a 'fate community' of multi-party cooperation. In this way, we can resolve the challenges of the future, ensure efficiency, quality, yield, and various commercialization effects. -Moda Kang Jun 11, 2018

The status and influence of global foundry in the semiconductor industry has been increasingly deepened, thanks to Zhang Zhongmou's second comeback in 2009, pushing the development concept of OEM to 'ultimate'.

The history of OEM

In 1987, the concept of foundry was started in Taiwan, China. It was a big leap in the semiconductor industry chain. It first promoted the progress of the fabless model. Today, it can be seen that the advanced process technology of OEMs has improved The IDM model is comparable, leading to the increase of OEM's weight factor in the semiconductor industry chain. For example, in the global chip (integrated circuit) output, one in every two blocks is processed by TSMC.

However, when TSMC, or UMC, just started, the semiconductor industry is actually dominated by the IDM model.

Until 1994, the output value of global fabless was only US$3.6 billion, reflecting that at that time, in addition to IDM, the foundry's process technology was far behind IDM. Therefore, the foundry was only the second supplier of IDM plants. When the capacity was in short supply, it could be used as In the IDM plant, the design industry was still very weak.

In the beginning, IDM and OEM were different in their concepts. IDM plants will certainly strive to pursue the ultimate in craftsmanship. Moore's Law is one of its driving forces. For example, Intel will not spare any effort to promote the continuous shrinkage of its process and its adoption. New technology, so its research and development costs reach about $10 billion a year, which is almost the highest in the world.

The foundry is a service system, which provides customers with the services of process technology, to meet the needs of customers. The birth of foundry is highly sought after by the fabless, which can save the huge burden of investment in factories. Therefore, from a logical analysis, Workers should not pursue the most advanced process technology. The risks and costs are too high. To develop the individual process for the customer's needs is rare (depending on the customer's cost for the process development), it considers several customers. The use of the same type of technology to save costs, so the industry has a view that the technical content of the previous foundry is not too high.

Zhang Zhongmou pushes the OEM to the extreme

TSMC is also not likely to be a one-time climber. It was observed that it has two key points. It is one of the most significant investments in the late 1990s. It almost took off the hat of the OEM only as a second-rate technology. The other is Zhang Zhongmou in 2009. The second comeback, it stands tall, looks far, is determined to push the concept of OEM to 'ultimate', that is, OEMs should also actively develop the most advanced process technology, and keep pace with IDM.

Therefore, from the aspect of operations, it strengthened R&D to collect top talents. The average annual investment in equipment is about US$10 billion. After several consecutive years of hard work, we have been at the forefront of the most advanced technological processes, such as 7 nanometers since 2018. Production, its Tainan Jingyuan Eighteenth Plant was grounded in January 2018, and will use the Extreme Ultraviolet (EUV) lithography technology to produce a 5nm process on a large scale. It is expected to start trial production in 2019 and mass production by 2020. , It is expected to produce 1 million 12-inch silicon wafers a year, with a total investment of NT$700 billion. It is the world's first production line with an energy production capacity of 5 nanometers. The industry is even more admired for OEMs.

At this stage, TSMC has no doubt with Intel and Samsung. As a result, TSMC is fully capable of attracting the world's top fabless, including Qualcomm, Apple, Huawei, Nvidia and other orders.

After Zhang Zhongmou assumed the post of CEO in 2009, he first doubled the capital expenditure in 2010 to 5.9 billion U.S. dollars, led Taiwan Semiconductor Manufacturing Co., Ltd. to spurt the industry’s cutting-edge 28-nanometer process chips, and the 28-nanometer process chip has become the mainstream of the smartphone era. In the same year, TSMC won the order of Apple, which had been exclusively owned by Samsung, and became a giant in the foundry industry.

According to "The World Magazine" reported in October 2017, TSMC’s share price has increased by 237 percent in the seven years that Zhang Zhongmou has regained control in 2016. TSMC’s cumulative investment from 2010 to 2018 reached US$79.6B.

Today’s foundry, long since it was not UMC, the foundry positioning of TSMC was not a so-called fab-lite, but an open platform model that not only had IDM capabilities, but also adhered to OEM services. Networking, AI era migration, market demand IC design companies must establish a deeper cooperative relationship with foundry. It is reflected in the fact that both parties are not only increasingly dependent on manufacturing, but also have to maintain close communication in market definition. The relationship even extends to the terminal link, forming a 'fate community' of multi-party cooperation. In this way, we can resolve future challenges, ensure efficiency, quality, yield, and various commercial outcomes.

Conclusion

There have been many recent articles praising Zhang Zhongmou for his 'Lifelong Learning for Happy Work, Watching Success and Failure for Moderate Life' and it is indeed worth our studying.

Regarding the development of China's semiconductor industry, Zhang Zhongmou said, 'In the next five to 10 years, Continental Semiconductor will make great progress, but TSMC will make even greater progress, and mainland companies will still fall back to back-selling for five to seven years.'

Compared with the progress of TSMC, there may be an increasing gap. It is not that we do not work hard enough, but the progress of TSMC is really too fast. Its investment efficiency is higher and it is at a different level. It cannot be compared with TSMC.

Today, when a great man retirees, he certainly has a big influence on TSMC, and Zhang Zhongmou has long thoughts and plans to replace it with a double-headed system.

Future global OEMs may have passed the “golden” era. It is already very difficult to achieve a growth rate of 10%. Due to the decentralization of future market forces and the fact that process technologies are approaching the limit, the performance and power consumption of products, etc. More demanding, many new applications such as AI, autopilot, and Internet of Things are bright prospects, but the actual application of the market will take time to develop, so the foundry will face greater challenges.

5. Ziguang Group has become the focus of the global semiconductor industry;

Recently, foreign media reported about the Chinese semiconductor company's "Violet Group" related news, the news that Ziguang Group has become the world's most concerned about the semiconductor industry.

According to the report, the semiconductor storage plant in Wuhan, Hubei Province invested by Ziguang Group, is about to be completed and will be put into operation within this year. The equipment for the trial production line has also started to be debugged. Zhao Weiguo, Chairman of China Unicom Group and Yangtze River Storage Technology, announced that 'investment in the next 10 years will be completed. 100 billion U.S. dollars to the chip manufacturing sector.. After the Group plans to follow Wuhan, it will also build a factory of the same scale in Nanjing, Jiangsu Province. In the context of the Sino-US trade war, China is accelerating the pace of semiconductor domestication. Red semiconductor manufacturers that may rewrite the industry order are receiving worldwide attention.

Image from Nikkei Chinese Network

As of May 21st, one of the three buildings expected to be built is undergoing internal renovations. The average daily number of workers is around 1,000. The second and third buildings are also the first building of the same size. The first building has a production capacity of about half that of Toshiba Memory Co., Ltd.'s Yokkaichi factory. Toshiba Memory Co., Ltd.'s Yokkaichi plant was jointly invested by Toshiba and Western Digital. It is currently the world's largest semiconductor memory factory. After 10 years Monthly production capacity of silicon wafers increased to 1 million, equivalent to 1.5 times that of Toshiba Yokkaichi factory.

Image from Nikkei Chinese Network

Nan Chuanming, director of the HIS Markit Japanese Investigation Department of the United Kingdom, stated that China's semiconductor technology, 'The semiconductor design technology of Huawei technology and other companies can be comparable to American companies'. About the production technology of the Ziguang Group, it believes that by digging talent from the US, South Korea, Taiwan, 'It is expected that the yield will increase soon.'

6. China Electronics and Nanjing jointly create the Institute of High-frequency Device Industry and Technology;

A few days ago, China National Electric Power Co., Ltd. and Nanjing jointly established the Nanjing High-frequency Device Industrial Technology Research Institute in the core valley settled in Qinhuai District. The establishment of the Institute of high-frequency device industry technology marks the strategic cooperation between China Electronics and Nanjing City has taken a Substantial steps. According to the cooperation agreement, China Telecom Valley High-frequency Device Industrial Technology Research Institute will fully establish a creative carrier based on the 55 Qinhuai headquarters of China Electronics, focusing on new terahertz technology, millimeter-wave chips, and optoelectronic integrated devices. In the five major industries such as carbon nanotubes and graphene, we have established a three-in-one innovation and incubation chain of 'new R&D institutions, national key laboratories, and technological innovation incubators' to create a national team for electronic device industry research and development. Upstream and downstream technology companies in the industrial chain promote the transformation and industrialization of a number of scientific and technological achievements, and build a 'two landings and one integration' demonstration base.

The establishment of the High-frequency Device Industrial Technology Research Institute will further give play to the advantages of China's electrical technology, achieve deep military-civilian integration, and break through the technological bottlenecks of strategic emerging industries such as 5G mobile communications, Internet of things, and new energy; will further enhance the autonomy of core components. The ability to control, realize the “change lanes and overtakings” of the third generation semiconductor industry; create a new situation in which technological innovation and industrial development are closely integrated, and build a comprehensive and open innovation park with multi-domain and multi-level services. The establishment of the Institute of Industrial Devices for Frequency Devices will serve as a starting point for 55 joint efforts with the Nanjing and Qinhuai Districts to create an emerging industrial cluster and industrial ecosystem centered on Nanjing, creating an extremely powerful electrical and electronic industry in Nanjing and China. Innovative business card featuring SASAC website

7. Xiamen Torch Hi-tech Zone insists on high-end leadership and layout of the next generation of innovative pillar industries;

As an important carrier for the implementation of innovation-driven development strategies and the promotion of high-quality economic development in Xiamen, Xiamen Torch Hi-tech Zone in recent years has taken the lead in constructing national independent innovation demonstration zones and national dual-innovation demonstration bases to implement innovation-driven development strategies and deepen supply. The side structural reforms are the main force for building a city of high-quality innovation and entrepreneurship, and make positive contributions to Xiamen's economic development and industrial transformation and upgrading.

Constantly moving towards the high end of the industry chain

At the recent Digital China Construction Summit held in Fuzhou, many of the participants were received by Yunzhixin, a company in Xiamen Torch Hi-Tech Zone, to receive the robot 'ring powder'. In December last year, as a domestic artificial intelligence unicorn enterprise Yunzhi The company that settled in Xiamen, Yun Zhixin settled in Xiamen Software Park (Phase III). At the same time, Yun Zhisheng established the first research institute dedicated to the application of artificial intelligence engineering in Xiamen Software Park (3rd phase). Supercomputing platform, carrying out artificial intelligence algorithm and application research.

The large-scale investment and strategic layout of leading companies in the industry is common in the Xiamen Torch Hi-tech Zone. In recent years, Xiamen Torch Hi-tech Zone has grasped global innovation trends and major national strategic needs, introduced external culture, promoted industrial transformation and upgrading, and continuously advanced the high-end industrial chain. .

The rise of the integrated circuit industry is a typical example of upgrading and improving the quality of the Xiamen Torch Hi-tech Zone. In February of this year, the company's Torch Hi-tech Zone, Xiamen City, announced that the successful trial production will use the 28-nm High-K/Metal Gate process. The product yield of the customer's products was as high as 98%. It has become the most advanced 12-inch fab with the highest level of technological yield in China's mainland.

As the only pilot unit of the national optoelectronic display industry cluster, Xiamen Torch Hi-tech Zone's flat panel display industry panel and module shipments ranked sixth in the country, LED industry chip shipments ranked first in the country, computer and communications equipment industry machine, server And monitor shipments ranked first in the country.

Adhere to high-end guidance and strengthen innovation-driven. Xiamen Torch Hi-tech Zone will preemptively lay out the next generation of innovative pillar industries, from leading companies, innovation platforms, expert teams, R&D institutions, and industrial funds, to promote integrated circuits, artificial intelligence, and automobiles. The development of the electronics industry; the implementation of industrial innovation capability upgrading projects, the establishment of leading enterprises, applied technology research institutes, professional incubators new industrial innovation chain, research and formulation of special policies, focusing on cultivating highly innovative and high-growth gazelle enterprises and unicorn enterprises

Foster new energy for economic development

As a large-scale 'incubator', the Xiamen Torch Hi-tech Zone brings together a variety of innovative and entrepreneurial resources. In recent years, under the support of the 'double-creation' boom, a variety of market-oriented, low-cost, and different forms of new creative space have sprung up. Grow. At present, Xiamen Torch Hi-tech Zone boasts 3 state-level technology business incubators and 18 science and technology ministry's record-breaking spaces. There are 2,228 incubators and teams, forming a nursery, incubation, acceleration, and industrialization. Innovation and Entrepreneurial Support System. As of the end of last year, Xiamen Torch Hi-tech Zone had 49 gazetted enterprises and ranked 11th in the National High-tech Zone.

The achievements are derived from Xiamen Torch Hi-tech Zone providing a series of 'housekeeper-style services' to build a merging, coordinating and sharing 'double-creating' eco-environment. To solve the financing problems of small and medium-sized enterprises, we strive to create 'a capital platform + four' A project and capital docking platform + a series of financial innovation products 'of the '1+4+X' technology financial system, has now gathered more than 300 venture capital, guarantees, banking and other financial institutions, and formed more than 30 billion yuan in financial capital. In 2017, more than 500 small and medium-sized micro enterprises helped to obtain financing of over 5 billion yuan. To guide enterprises to use high-level intermediary services, enhance innovation capabilities, and fully implement the 'torch innovation vouchers', in the form of government procurement services, The use of market-oriented technologies, financial services, talents, and other services to support up to 35% of the support. In addition, Xiamen Torch Hi-tech Zone also actively promote the 'large visits' activities, to corporate demand-oriented and develop relevant policies. 2017, Xiamen Torch Hi-tech Zone Through the company's large-scale visits, we coordinated and solved nearly a thousand important problems in business operations.

Taking “Talent” as an example, we will focus on promoting the development of 'Double Innovation'. Xiamen Torch Hi-Tech Zone will vigorously implement the talent development strategy, and use talents to innovate and start businesses to promote industrial development, including the implementation of 'campus deep farming' and 'urban deep plowing' programs, and organization of enterprises to key universities and colleges. Recruiting with the city; Supporting the development of the SAC Union University, through the effective integration of training resources, sharing of resources, establishing a talent training collaboration mechanism, and reducing corporate talent management and training costs.

According to the plan, Xiamen Torch Hi-tech Zone will focus on building an international open and innovative system. Organize companies to set up R&D centers and business centers nationwide and even globally, and help park companies effectively connect with innovative highland technologies, projects, and create internationalization of 'Belt and Road' accelerators. A two-way collaboration platform; the introduction of international, domestic and international legal agencies, intellectual property rights, and financial services to help companies “go global” and help foreign companies land in Xiamen. China High-tech Industry Guide

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