After the first public display in March, Samsung Electronics announced today that it has been the first in the world to mass-produce a new generation of 64GB DDR4 RDIMM memory chips based on 16Gb Die particles, mainly for enterprise and cloud service applications.
Samsung stated that the standard frequency of this memory is 2666MHz , follow-up can also be easily enhanced, while It consumes up to 19% less than two 32GB.
Samsung's large-capacity memory is mainly targeted at AMD's EPYC server platform, because the latter has excellent memory expansion performance, supporting eight channels, each equipped with 16 memory slots. Using this 64GB memory module, the total capacity can reach 2TB.
Take this opportunity, HPE (formerly HP Enterprise Division) also introduced a new generation of server ProLiant DL385 Gen10, equipped with AMD EPYC processor, the world's first with this 64GB of Samsung's large memory, dual 32-slot, total memory 2TB.
There is also a single HPE ProLiant DL325 Gen10 with 16 slots and 1TB of total memory.
HPE revealed that the new memory can bring about a 16% performance increase.
Samsung also revealed that Will soon begin trial production of 16Gb Die 256GB memory chips, using four Rank, eight Rank TSV technology, is expected to be completed by the end of this year, can provide 8TB of system memory for a two-way server.
