Semiconductor equipment leading application materials in material engineering continued to break through, is expected to lift the 7 nano-scale wafer manufacturing process efficiency bottlenecks, the process leading industry will continue to benefit, further, future generations of AI chip efficiency will be increased by 15%. Ching said that this is the first pile of transistor contacts and wires in 20 years of major metal changes, can be lifted 7 nm and the following wafer process of the main performance bottlenecks. The main chip designer can replace tungsten and copper with cobalt metal, thereby enhancing the performance of 15% chip, the material solution can combine dry cleaning, physical vapor deposition, atomic deposition and chemical vapor deposition on the Endura platform, to assist customers to accelerate the use of cobalt metal. Applied materials related operators explained that in the past, traditional Moore's law as long as a small fraction of easy to integrate materials, while improving the chip's efficiency, power, size, cost (PPAC). Today, some of the materials, such as tungsten and copper metal, under 10 nm process can not be smooth miniature, because of its electrical power in the transistor contacts and local metal wire process has been close to the physical limit, which is a fin-type transistor (FINFET) can not play a major bottleneck in full performance. Cobalt metal can eliminate this bottleneck, but it also needs to be changed in the process system strategy. As the industry shrinks its structure to its extreme size, the material behaves differently and must be engineered systematically at the atomic level, usually in a vacuum. Using cobalt as a new conductive material for transistor contacts and copper conductors, applied materials have been combined with a number of material engineering steps-pre-cleaning, physical vapor deposition, atomic deposition and chemical vapor deposition-on the Endura platform. Furthermore, the application materials also define a set of integrated cobalt combinations, including annealing on the producer platform, flattening on the reflexion LK Prime CMP platform, and electron beam detection on the provision platform. Customers can use this proven integrated material solution to accelerate time-to-market and increase chip performance at 7 NM and below. ". Prabhu, senior vice president of Semiconductor products business group. Jorge (Prabu Raja) said that 5 years ago, the application of materials that the transistor contact and copper wire will face a technical transition, and began to start other alternative materials development, in order to be 10 nm or less to go longer. Applied materials with expertise in chemistry, physics, engineering, and data science, delve into the broad product line of the application material itself, creating a breakthrough integrated material solution for the semiconductor industry. Due to the advent of large data and AI times, these technological transitions will also increase. Although the integration is still challenging, cobalt for chip performance and chip manufacturing has a significant benefit, in a small size with low resistance and variability, in a very fine size to improve the ability to fill the trench, and improve reliability.
