Observing this year's semiconductor packaging and testing industry in Taiwan, the Institute of Industrial Intelligence (MIC) pointed out that this year, driven by the demand for high-speed computing chips, it is expected to maintain steady growth.
According to MIC, demand growth for smart mobile devices will slow this year, high-speed computing and artificial intelligence applications will become the main force driving the market, driving high-level wafer-level packaging needs.
According to Ye Zhenxiu, a senior industry analyst at MIC, the future growth momentum of the IC packaging and testing industry is focused on high-speed computing chips, including artificial intelligence, cloud computing, voice assistants, and big data analytics applications.
Ye Zhenxiu pointed out that high-speed computing chips need to be combined with more advanced packaging technologies, such as 2.5D IC or 3D IC technology. In response to performance requirements, it will also push up the capacity utilization rate of the scale-up packaging and industry scale.
Foundry Manufacturing Company TSMC Layout Planning 3nm Process New Plant. Senior Director of Packaging and Metering Plant said that 3nm wafer process may continue to use advanced fan-out wafer level packaging FOWLP (Fan-Out Wafer Level Packaging) Technology.
Observe the role of the 3nm process in the professional off-the-shelf packaging foundry (OSAT) supply chain at the end of the semiconductor industry. The senior surveyor of packaging and testing points out that it includes artificial intelligence chips, programmable logic gate arrays (FPGAs), application processors, and graphics. IC design companies, such as chips, should plan to supply the second source for testing, and OSAT Taiwan still has a key role.
In the competition situation of the manufacturers, industry sources pointed out that in addition to TSMC's InFO (Integrated-Fan Out) technology, the companies such as ASE and Licheng, etc., have successfully advanced advanced fan-out wafer level packaging technology. .
Sun Moonlight’s Sun Moonlight Co., Ltd.’s Sun Moonlight’s FOC (Fan-Out Chip-on-Substrate) process has laid a foundation for high-end FPGA chips and graphics processors; FO-PoP (Fan-Out Package-on-Package) and FO- MCM (Fan-Out Multi-Chip Module) and other technologies. Force into the active layout of the panel size fan-out package product line.