1. Runxin technology optical structure enters volume production stage, and this year's expected net profit growth of 30%
Set micro-network news, June 6, Runxin Technology released the 2017 results announcement (updated), the announcement shows that in 2017 the company achieved total operating revenue of 1,829,100,100 yuan, an increase of 18.88% over the same period last year; Attributable to the listed company The net profit of shareholders was RMB 54,414,800, an increase of 10.34% over the same period of the previous year. The net profit after deducting non-recurring gains and losses was RMB 53,909,600, an increase of 15.85% over 2016.
Runxin Technology indicated that the growth of the company's performance has mainly benefited from the company's continued increase in R&D investment in wireless connectivity, RF and sensors, and significant growth in smart homes, image transmission, security, automotive electronics and other emerging markets.
In the following year, the company will continue to grow in wireless connectivity ICs, radio frequency and power amplifiers, and sensor ICs. The company plans to increase revenue by 30% in 2018 and achieve a 30% increase in net profit.
At the same time, the company focused on R&D and investment in 'wireless connection and sensor systems', 'security access control systems based on living biometrics', 'audio, radio frequency, optical integrated structural components' and other projects have entered the mass production phase , Will bring considerable growth to the company in smart phones, Internet of things, security access control and other fields.
Runxin Technology is a leading distributor of IC products and solutions. It mainly provides technical support services including IC application solutions to customers to form IC product sales. The company's main business is to wirelessly connect chips, RF components. And the sensor chip is the main, the company's main IC suppliers are Qualcomm, Si Jiaxun, AAC Technology, AVX/Kyocera, Huiding Technology, etc., with the United States of the group, together with electronic, ZTE, DJI, Huasan Communication and other customers.
2. Chairman of Shennan Circuit: ZTE's normal payment in May, still benefiting from 5G development
Gathering micro-network news, Recently, Shennan Circuit, a leading domestic PCB manufacturer, conducted investor Q&A on issues such as the localization of chips and the impact of Sino-US trade relations. The introduction of the research and development director of Shennan Circuit, Qiu Hua, the company in the 1990s After digging the first barrel of gold from the game board, it seized the dividends of the development of the domestic communications market. Currently the company is a core supplier of leading communications equipment manufacturers in the world, including Huawei, Nokia, ZTE, etc. and for the recent ZTE Yang Zhicheng, chairman of the company, said that at present, the incident did not have a major impact on the company's operations. As of May, the payment was normal. Future communications is still one of the company's major development directions. Looking back at the beginning, 3G, 4G, etc. A technological innovation can allow the company to rise to a new level. It is expected that the company can still benefit from the development and construction of 5G, but 5G construction itself may have a longer evolutionary process. From the perspective of performance, Shennan Circuit is expected this year. The net profit for the six months will reach 252 million to 300 million yuan, and the year-on-year increase is expected to be 0 to 20%. Shennan Circuit stated that it will continue to focus on expanding and strengthening its core business. Maintain steady development of production and operation, according to industry body Prismark report shows that in 2017 Shennan Circuits PCB company ranked the world's first 21, the first three in the top ten vendors in the only domestic-funded enterprises.
With the advent of 3.5G and wireless charging era, smartphone glass casings will become mainstream
The world is about to enter the 5G era. With the increasing popularity of wireless charging, in order to prevent signals from being shielded, the development direction of mobile phone casings has gradually shifted to non-metallic materials, including glass, ceramics, and carbon fiber, among which glass is due to low cost and technology. High quality, light weight and other features, will take the lead to become the mainstream.
Millet recently released three heavy weight new machines. Their common feature is the use of a glass case, which makes the glass case has officially become the development of high-end intelligent machines. Taiwanese factory-related concept stocks, including the market name including the Union, Hong Zhun , Ying Hua and other companies will benefit.
Millet recently released three new aircraft, including the Mi 8 Discovery, Mi 8, and Mi 8SE. The common features include: Design of glass back cover components, all upgraded to OLED (organic light-emitting diodes). The ratio of more than 80%, became the biggest highlight of the millet's new machine.
The market believes that Xiaomi’s new machine adopts a glass back cover component design, and Apple, Samsung and other flagship machines have also begun to use, highlighting the development trend and direction of the future high-end smart machines, plus the increasing popularity of wireless charging and so on. , Designing a new blue ocean for intelligent machines in the 5G era.
In fact, the current global glass enclosures are concentrated in Corning, Lansi, and Bonn and other three major plants, Lan Si and Bern as land plants. According to foreign-funded Merrill Lynch pointed out that since next year, Samsung, Apple and other mobile phones Giant eel, will introduce the design of all-glass machine components, officially opened the new era of glass cases.
Corresponding to the relevant supply chain of the Taiwan Department, the name of the market, among which the 3D curved glass forming machine developed by the confederation, has received orders from the big factory Lansi, the market pointed to the future of the alliance will eat apples and non-Apple intelligent mobile phone glass machine Shell machine component equipment orders have become the biggest beneficiaries of the new trend.
Zhengda, which is part of the Hon Hai Group, originally mastered 3D glass manufacturing technology, but the market pointed out that in the previous years, Zhengda had transferred the technology to Hon Hai, in exchange for royalty income to make up for losses. Currently Hon Hai Group, The main task of development includes the development of new materials such as glass cases.
Yinghua actively cooperated with other countries' enterprises in recent years to prepare for business opportunities in glass cases. The market revealed that apart from working with China Chun Hing Industrial Co., Ltd. to develop 2.5D and 3D glass technologies, it also cooperated with Japan First Chemicals Co., Ltd. to develop mobile phones. With a ceramic case.
In fact, according to market comparison, although the glass casing is not as good as metal and ceramic in thermal conductivity, it is much better than plastic, and its electromagnetic shielding performance is far lower than that of metal, and its light weight, high hardness, and relatively mature technology. , Suitable for large-scale production, at the same time with cost advantages, so it has gradually become a rookie. Economic Daily
4. Smartphone demand bottoms out, Credit Suisse looks at Haoyu and ASM Pacific
Credit Suisse issued a research report, referring to meeting with 74 investors in the past 3 weeks. Investors generally believe that the demand for smart phones bottomed out and that they were low in timing. However, stock selection needs to be cautious and selective. Hong Kong stocks are among the related stocks, and they are optimistic. Yu-Optics and ASM Pacific, stocks rose more than 4% and over 3%.
The report pointed out that in the supply chain of smart phones, the demand for mobile phones in mainland China is recovering, and Apple's mobile phones have bottomed out in the second quarter. However, competition in the supply chain has increased. Investors are optimistic about the potential winners of the Lixin Precision Club and reevaluate them at the same time. AAC Technologies, but agreed to reduce the space is limited, wait for the 'buy' opportunity after the second quarter results.
Credit Suisse said that the industry is positive about the risks of overseas business, optimistic about Hikvision, the semiconductor market, investors' interest has increased. Selecting shares, the software stocks are optimistic about Chinasoft International.
In addition, Credit Suisse stated that it is necessary to pay attention to the progress of Sino-U.S. trade disputes and that the relevant risks have been reflected.
The bank believes that compared with H-shares, it is more optimistic about A-shares, and Lisin Precision, Han's Laser, and Lance Technology are the first choices.
H shares are most optimistic about Sunny Optics and ASM Pacific.
As of 15:45 on the 6th, Sunny Optical shares rose 4.425% to HK$167; ASM Pacific reported HK$108, or +3.747%.
5.Guangzhou Semiconductor Association established to inject 'core' kinetic energy into Guangzhou
From June 2nd to 3rd, Guangzhou Semiconductor Symposium, Guangzhou Semiconductor Summit was held in Huangpu District, Guangzhou Development Zone. The Guangzhou Semiconductor Association officially announced the establishment in this district. The association will promote the development of Guangzhou Semiconductor Development Industry Alliance. The coordinated development of the industrial ecosystem has promoted the leap-forward development of the semiconductor industry in Guangzhou, and it is a landmark for the development of the local semiconductor industry.
Academician of the Chinese Academy of Sciences, Xu Ningsheng, President of Fudan University, Ding Wenwu, President of National Integrated Circuit Industry Investment Fund Co., Ltd., Ye Tianchun, Director of Institute of Microelectronics, Chinese Academy of Sciences, Zhang Wei, Dean of School of Microelectronics, Fudan University, Deng Shaozhi, Dean of School of Microelectronics, Sun Yat-sen University, etc. More than 10 academician experts, more than 50 representatives of the semiconductor companies in the city and 160 representatives from all walks of life participated in the event.
Automotive electronics chips can be used as a breakthrough in differentiation
At the Guangzhou Semiconductor Symposium held on June 2nd, nearly 30 guests from the industry, academia, investment community, and political circles revolved around the global perspective of the semiconductor industry in Guangzhou, particularly the IC industry how to make plans discuss.
"I'm very glad to see the semiconductor industry in Guangzhou move." Ye Tianchun, director of the Institute of Microelectronics of the Chinese Academy of Sciences, believes that integrated circuits are a global industry. There is not a single place that can do all the business. Instead, it is better to do a deep job at one point. The key is to differentiate, to be more advanced than competitors, more competitive, more leading, and to be irreplaceable.
Yue Chen, CEO of GDD, and Gu Wei, Consultant of the IC Value Innovation Park of GDD, said in the speech: 'The automotive electronics chip has such a large demand. Why can't China's IC design factory enter? It is because we lack our own authentication platform. Customers can only use foreign products. 'He disclosed that Yuexin is negotiating with GAC and BAIC, and hopes to cooperate to build a credible certification platform for China's own IC design enterprise services, so that domestic auto companies can rest assured that the use of domestic In addition, Guangzhou's capital and market are both on-line, and building such a platform will also help to cultivate more talents. 'From Yuexin, we need to differentiate.' said Chen Wei.
According to Xu Ningsheng, academician of the Chinese Academy of Sciences and president of Fudan University, China's demand is the driving force behind the development of the industry in the world. 'We have come to participate in the most cutting-edge and core technology's key nodes in global competition. We should take this opportunity to form our own core competitiveness. '
According to Zou Sheng, deputy party secretary of the Economic and Information Committee of Guangdong Province, and inspector Zou Sheng, the following three tasks are focused on: First, give full play to the role of the Guangdong Industry Fund and step up investment in chip projects; Second, use the current east wind to do a good job in Guangzhou The industry integration of chip design; Third, do a good job of connecting the application companies, give play to the advantages of Guangdong's manufacturing province, aim at smart manufacturing, Internet of things, etc., and gather talents together.
Guangzhou Semiconductor Association Condensed Guangdong, Hong Kong, and Macau in the Bay Area Value Innovation
On June 3rd, the Guangzhou Semiconductor Association announced the establishment of the Guangzhou Development Zone in Huangpu District and held an unveiling ceremony. The Association was initiated by Yuexin and served as the president unit, with 51 units co-founding.
After reading through the list of founding members, there are a number of companies including Ankai Microelectronics, Anbao Electronics, etc., in Huangpu District, Guangzhou Electronic Development Zone, and upstream and downstream companies from Shenzhen and Foshan; both South China University of Technology and Sun Yat-sen University. South China Normal University, Guangzhou University and other local colleges and universities, the University of Macau has also joined the assembly of Guangdong, Hong Kong and Macao Bay Area industry strength.
Zhang Wei, executive dean of the School of Microelectronics at Fudan University, believes that Guangzhou's integrated circuit industry should be placed in the context of Guangdong Province, the Pearl River Delta, and the Guangdong, Hong Kong and Macau Dawan Districts. 'Guangzhou will become a core of Guangdong, Hong Kong, and Macau's Dawan District in the future. Guangdong Yuexin should become the core of our value innovation platform for IC industry in Guangdong, Hong Kong, and Macao Bay Area.
"After the establishment of the Guangzhou Semiconductor Association today, all aspects of resources began to gather in Guangzhou. We hope that Guangzhou will become a major force in the national integrated circuit industry, not just a new force, and will jointly bring China's integrated circuit industry to a new level.' Ye Tianchun Said.
Director of the Huangpu District, Mr. Chen Xiaohua, deputy director of the Administrative Committee of the Guangzhou Development Zone, mentioned in his speech that he hoped that experts and entrepreneurs would invest more scientific research achievements and industrial projects in Huangpu District, Guangzhou Development Zone, the nearest place to success. , Conspiracy for industrial development, for a better future, and jointly promote the 'core' in Guangzhou. '
According to reports, the association will undertake business functions such as member training exchanges, market evaluations, conferences and investment promotion, industry statistical surveys, and enterprise and product certification and evaluation. 'The association will play a role as a communication link, make recommendations for the government, and make joint efforts with the China Semiconductor Association. , To provide services for enterprises in the industry chain. 'Chen Wei introduction.
Guangzhou's semiconductor industry has a strong growth momentum
In recent years, Guangzhou has firmly grasped the 'spring' of the new round of development of the semiconductor industry, laid ahead of the innovation and development of the integrated circuit industry, and accelerated the construction of the 'China Made 2025' Pilot Demonstration City, and successively issued the "Guangzhou City to encourage the development of the integrated circuit industry. Several Provisions, "Guangzhou City's Five-year Action Plan for Accelerating the Development of IAB Industries," clearly defined IC as the focus and direction of industrial development.
Through unremitting efforts, Guangzhou has gradually achieved scale from scratch in the areas of integrated circuit design, packaging and testing, as well as semiconductor devices, optoelectronic devices, etc. The implementation of the Guangzhou IAB industry plan has opened up the semiconductor industry. Prologue.
At the end of 2017, Huangpu District and Guangzhou Development Zone introduced Guangzhou Yuexin Project, the first wafer manufacturing project in Guangzhou, and Zhongxin New Knowledge City in Guangzhou. It will build the first 12-inch chip factory in China with a virtual IDM as its operational strategy. It is also Guangzhou's first 12-inch chip production line, which fills the blank of manufacturing industry in Guangzhou.
After the project is completed and put into production, it will realize the production capacity of 40,000 12-inch wafers per month. It will meet the demand for analog chips for innovative applications such as the Internet of Things and automotive electronics, achieve sales target of 10 billion yuan, and further boost the formation of upstream and downstream enterprises. The scale of production value of 100 million yuan.
Driven by the Yuepin project, 15 affiliates signed up here, including 14 industrial projects and an integrated circuit industry fund with a scale of 5 billion yuan. They built a 'chip design-wafer manufacturing-package testing-terminal'. Applying the 'integrated operation mode' to form an industrial chain with a cluster of industrial projects, the entire industrial chain will be built here, and will be built as a Guangzhou-based 'core' Zhizhi Park.