The project includes two major parts of wafer manufacturing and packaging testing. Construction began on February 12, 2017. On January 22, 2018, the sealing and measurement plant began to move into the equipment and installed it. On March 15, the wafer fab began to move into the equipment and installed it. At present, the company is in the trial production stage. The fab will also be trial production in the third quarter. It is expected that all projects will be fully completed and put into production by the end of this year. The first phase of the project is expected to produce 20,000 chips per month, and 500 million will be packaged and tested. The chip will have an annual output value of 400 million U.S. dollars. In the second phase, it is expected to produce 50,000 chips per month, and 1.25 billion semiconductor chips will be packaged and tested. The annual output value will reach 1 billion U.S. dollars.
AOS International’s Chairman and CEO, Zhang Fuxing of Chongqing Wanguo Semiconductor stated in his speech that Chongqing Wanguo Semiconductor’s 12-inch power semiconductor chip and package testing project started from February 12, 2017, lasted 16 months. With AOS superior Technology and mature products, Chongqing Wanguo Semiconductor will be built into a world-class power semiconductor company.
AOS International Semiconductor also held the 'AOS Technology Communication Summit Forum' in Chongqing. Zhang Fuxing gave a detailed introduction to the role of power semiconductors in the green energy conservation industry in the keynote speech. He also stated that AOS will take up corporate social responsibility. To promote the development of power semiconductor technology. Inventor B Jayant Baliga, IGBT inventor, and T Paul Chow, tenured professor at Rensselaer Polytechnic Institute in the United States. Specially invited by the Organizing Committee to attend the forum and give a lecture.