The boom in the mainland block chain continues, and the semiconductor industry is bullish on the need for efficient computing (HPC) chips. Although the special application chip (ASIC) of the mining machine's bit continental block chain has been converted to TSMC at the wafer generation end, Samsung two strong division of labor situation, but the Wafer test card field, the designated right from the wafer generation plant back to the land plant, such as the hands of the mainland, good at high-frequency, high-speed test solutions of the precision, then have been named orders, learned, Among the recommended by the operator, is the Taiwan-series wafer foundry leading TSMC. The precision system is not publicly commented on for specific customers or products. However, the industry is also familiar with the good testing has always been with TSMC, Apple (Apple), Qualcomm (Qualcomm), Samsung, HiSilicon and other cooperative relations, the precise measurement of the current major wafer test card-related solutions, about 70%-80% focus on the mobile phone application processor (AP) field, the supply chain operators said, Precision testing has been determined to take orders from international manufacturers, but the 3rd quarter of the handset chip manufacturers the actual demand can be how much, still need time to observe. The person familiar with the survey said that for the sentiment, the first half of the current performance is about flat, the 1th quarter is indeed relatively backward, but the 2nd quarter has been significantly back to temperature, the 3rd quarter will strive to maintain, the 4th quarter is expected to have a major contribution to the new products, many higher-order Probe card verification cases will slowly end in the This year is expected to remain operational growth momentum, the 4th quarter of the AP program will continue. 5G wafer test Card field, expected 2019, 2020 fermentation. Familiar with the wafer testing industry revealed that the second half of the AI, High-performance Computing (HPC) chip field is expected to have growth opportunities, AI field is to pay attention to the development of ASIC. At present, in the global market, 7 nano-process is the exclusive technology of TSMC, but the estimated demand for heavyweight customers may be slightly adjusted, overall mobile communications market volume is not much more likely to change. In spite of this, the block chain efficient chip is expected to fill the mobile phone AP capacity vacancy, and further with the concept of AI combined, once the volume can be large, the chip industry will be from the pan-chip conversion ASIC form. Wafer test Card related operators pointed out that the continuous bullish block chain, AI, 5G and other fields, the mainland's 2025-year plan is not far, the application level including car networking, IoT, cryptographic currency, finance, retail, Industrial 4.0 and so on. And familiar with the people of precision, the mainland block chain chip operators do more than dare to use advanced semiconductor process, the second half may also enter the 10/7 nm stage, the current is 16, 12 nm process. It is estimated that in the 3rd quarter of the block chain wafer testing field, the precision test will be expected to continue to have revenue contribution, and the precise measurement would continue to focus on the wafer test (CP). Familiar with the wafer test industry, said Apple has gradually moved to some of the chip design, the precision is not necessarily bad, the same chip, Apple designed its own product requirements more rigorous, testing time to see 6-8 hours, non-Apple design chip is only 3 hours. Of course, such as the wafer Test board design capacity of Terida (Teradyne) and other testing equipment industry actively want to enter the Gao Jiejing round Test Board manufacturing market, but in fact, to reach the technical threshold of the PCB board factory is not much. Observing the overall economic changes in the global market, the general manager of the survey, yellow water can be interviewed after the shareholder meeting said, indeed the U.S.-China trade war has been burned to the semiconductor sector, ZTE is backward, is indeed facing a more difficult situation, Huawei's sea-thinking technology is relatively complete many, It can even be said that in the field of non-memory should not do the product, the capacity of the chip products will be self-made, with the mainland company's younger generation of a positive culture, is indeed quite competitive. For the future development of the U.S.-China trade war, at present, the order level has not changed much, but in the long run, the United States IC design companies should be worried about the rise of the mainland wafer factory, the main department of TSMC forward Nanjing set up 12-inch wafer factory, almost no TSMC could not manufacture The TSMC Nanjing plant has been booked for a short time before it was built, and the precision test also benefited from the two major customer orders for the action wafer and AI wafer at TSMC's Nanjing plant. In his view, the demand for mainland chip makers for the 16-nm process is high, it is speculated that the future TSMC Nanjing Plant has the opportunity to expand, and the advanced process 7, 5, 3 nm, it is expected to stay in Taiwan, the precision will continue to benefit, the precision test has also thought to follow the footsteps of TSMC to Nanjing, but the current Shanghai stronghold can still be effective support, The future will be seen as the expansion of the TSMC Nanjing plant, and then decide whether to increase the Nanjing stronghold.
