NXP Launches RF Power Module with Standard Package

NXP Semiconductors today announced the launch of two new power modules that are expected to become the new standard in the coming years.

The simplicity of these new modules is that they combine the common TO-247 and TO-220 power packages while providing LDMOS technology for RF transistors, making installation very easy. At the same time, the compact reference circuit can also be used at 1.8 MHz. Repeated reuse in the frequency range of 250 MHz. This will save considerable cost and, for most HF and VHF systems, shorten the time to market and optimize the supply chain.

Removing barriers to entry in RF power products One of NXP’s new RF solutions is the MRF101AN transistor, which provides a 100 W output in the TO-220 package, and the other solution is the MRF300AN transistor, which provides a 300 W output with TO - 247 Packaging. Plastic packages currently available for high power RF require precise reflow soldering processes. These new transistors use standard through-hole technology to assemble to printed circuit boards (PCBs), which saves cost. Because the transistors can be fastened vertically In the chassis, or through a more creative, more versatile method of installation (such as installed under the PCB), so the heat dissipation is also simplified. This provides more choices for the mechanical design, which helps to reduce the material cost (BoM) and Shorten the time to market.

Provide flexibility without sacrificing performance At a frequency of 40.68 MHz, the MRF300AN outputs 330 W of continuous wave (CW) with a gain of 28 dB and an efficiency of 79%. As part of NXP's extremely durable transistor family, This series is designed for use in harsh industrial applications and is capable of withstanding 65:1 voltage standing wave ratio (VSWR).

It uses a 5.1 x 7.1 cm power module reference design to support robust performance using cost-effective PCB materials. The design can be adjusted to support designs from 1.8 to 250 MHz by simply replacing coils and discrete components. Any other frequency, without changing the PCB layout. For RF designers, this will ensure that the product will be on the market quickly, so as to develop power amplifiers to meet the needs of new markets.

For greater flexibility, each transistor offers two configurations: The MRF101BN mirrors the pinout of the MRF101AN, enabling a compact push-pull layout that satisfies the requirements of broadband applications without compromising efficiency.

The MRF101AN and MRF300AN are targeted at industrial, scientific, and medical (ISM) applications, as well as HF and VHF communications. Switch-mode power supplies are also expected to create a new market because this technology enables higher frequency switches than existing solutions, thus lowering Total material costs. All of these products participate in NXP's 'Continuing Product Supply Plan' to ensure supply for 15 years.

Availability MRF300AN is now available. MRF101AN is currently sampling and is expected to begin production in September 2018.

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