At the COMPUTEX TAIPEI, Group Electronics exhibited a number of new flash memory mastering solutions, including the first publicly-received PS5012-E12, the top-level masterpiece, with unmatched performance, and a new version for the data center, the PS5012. -E12 DC.
The PS5012-E12 is the third-generation PCI-E 3.0 x4 NVMe flagship SSD master controller. It is manufactured on the advanced TSMC 28nm process and integrates the latest and most powerful technologies of the Grouplink, including the CoXprocessor 2.0 processing architecture, and low power consumption. The third generation error correction engine LDPC 3.0, DSP digital signal processor, supports 3D TLC, 3D QLC flash particles, maximum capacity up to 8TB.
PS5012-E12 DC is a special version for the data center , Through firmware optimization, to further enhance durability, reduce latency, enhance continuous performance, support up to 8TB of maximum flash capacity, optional PCI-E, M.2, U.2 and other appearance styles, Performance exceeds all other similar products on the market, continuous reading and writing up to 3.4GB/s, 3.0GB/s, and random read/write up to 600000 IOPS.
In addition, Grouplink will also exhibit the PS3112-S12DC SATA SSD master controller, UFS memory cards that are comparable to SSDs for mobile devices, and Thunder 3 portable SSDs that have been adopted by many partners. SD/microSD storage designed for surveillance applications Card, fingerprint identification U disk, etc.
