SiC technology provides better switching performance and higher reliability than silicon devices. SiC diodes have no reverse recovery current, and switching performance is independent of temperature. Excellent thermal performance, increased power density and reduced electromagnetic interference (EMI) , Reduced system size and reduced cost make SiC an excellent choice for more and more high-performance automotive applications.
ON Semiconductor's new SiC diodes are available in popular surface mount and through hole packages including TO-247, D2PAK, and DPAK. FFSHx0120 1200 volt (V) first generation devices and FFSHx065 650 V second generation devices provide zero reverse Recovery, low forward voltage, temperature-independent current stability, very low leakage current, high surge capacitance and positive temperature coefficient. They provide higher energy efficiency, while faster recovery increases switching speed and reduces The size of the required magnetic element.
To meet ruggedness requirements and work reliably in automotive harsh electrical environments, diodes are designed to withstand large inrush currents. They also include a unique patented termination structure that increases reliability and enhances stability. The range is -55°C to 175°C.
Fabio Necco, senior director of ON Semiconductor, said: 'On Semiconductors has introduced devices that meet AEC regulations and expanded Schottky diode series to bring significant advantages to SiC technology for automotive applications, enabling customers to achieve this industry-to-performance performance. Strict requirements. SiC technology is very suitable for automotive environments, providing higher energy efficiency, faster switching, better thermal performance and higher robustness. In the area of space-saving and weight saving, SiC has higher power density. Helps reduce the size of the overall solution, as well as the advantages associated with smaller magnetic devices, and is welcomed by customers.
ON Semiconductor will demonstrate these new devices during the PCIM as well as the company’s solutions in wide bandgap, automotive, motor control, USB-C power supply, LED lighting, and smart passive sensors (SPS) for industrial predictive maintenance applications. ).
ON Semiconductor will also demonstrate advanced SPICE models from leading industries that are susceptible to disturbances in program parameters and circuit layout, and thus represent a significant advancement over current industry modeling capabilities. Using this tool, circuit designers can advance simulation Process evaluation technology without expensive and time-consuming manufacturing iterations. Another advantage of ON Semiconductor's robust SPICE prediction model is that it can connect to a variety of industry-standard simulation platform ports.