With the speed of replacement of electronic products speeding up, electronic products continue to speed up and miniaturization, the trend of connectors following this pattern is particularly obvious, so there is a USB Type-C interface. As early as 2015, USB Type-C In the market has been widely supported, as of now its application has been everywhere.
USB Type-C design, ultra-thin, mini, brings with it speed of data transmission, enhancement of scalability, speedup of current transfer rate and other internal technology updates.
The USB Type-C connector has a small size, a small pin design, and a very small solder joint after soldering, resulting in a small holding force and a low strength of the core wire. Therefore, the requirements for the packaging process are high, and the ordinary packaging process cannot meet the production requirements. .
In the traditional high-pressure injection molding packaging process of USB Type-C, excessive pressure will damage the components, cause solder joints to fall off, and have a high defect rate. The low-pressure injection molding process is very suitable for the packaging of these small-sized electronic components. The injection pressure of injection molding is only 1.5~40bar and the operating temperature is around 150-210°C, which can avoid the damage to the components such as the high pressure injection process, thereby increasing the yield rate and avoiding potential negative risks.
Kane New Materials, specializing in the R&D, production and application promotion of special low-pressure injection-molding plastics, can provide USB Type-C tailor-made packaging material solutions, and from the preliminary product evaluation, mold program determination, rubber material selection, equipment The selection of the final process parameters, and even the large-scale production will provide full technical advice and support services.