1. Committed to improving solar cell efficiency, Heraeus Photovoltaic releases new Hecaro conductive adhesive
Gathering micro-network news, Recently, Heraeus Photovoltaics, a world-leading provider of renewable energy technology solutions, launched a series of new products at the 12th SNEC (2018) International Conference on Solar Photovoltaic and Smart Energy (Shanghai). Products and new services further expand the company's product portfolio. These new solutions combine Heraeus' leading position in the global metallization slurry sector and become part of Heraeus' strategic transformation. Through strategic transformation, Heraeus Will further expand the scope of application of its innovative results so as to benefit the entire photovoltaic value chain.
In this exhibition, Heraeus first introduced an advanced conductive adhesive called Hecaro, whose silver content is very low, but its performance is comparable to that of high silver content conductive adhesives. In addition to saving total cost, Hecaro specializes in Optimized for the screen printing process, not only fast curing, but also long-term stable and reliable. With the above advantages, Hecaro conductive adhesives will become hot and advanced solar cells (such as shingles, heterojunction cells (HJT) and full back Electrode contact crystal silicon solar cell (IBC) connection material.
The expansion of Heraeus to related applications is also in response to market trends in the PV industry. Many PV companies hope to find a partner that can provide them with more comprehensive products, solutions and technical support to help streamline their processes.
Dr. Zhang Weiming, the executive vice president and chief technology officer of Heraeus Photovoltaics, stated that Heraeus's expertise in the fields other than silver paste is a matter of course. He said: 'Heraeus' brilliant achievements in the field of silver paste are very impressive. To a large extent, it is due to the comprehensive solutions we provide to our customers, helping them to achieve greater breakthroughs in cost reduction and efficiency gains. Heraeus’ recent highlights of the 'Beyond Silver Pulp Product Portfolio' will further increase their competition. Advantages and Innovation Capabilities. It is also important that our efforts also help the solar industry further reduce the total cost per watt of electricity generated.
The expanded Heraeus portfolio includes:
• HeraGlaze©: A high-purity, high-density, diffusion-preventing coating designed to improve the performance of silicon wafers in the production of solar wafers. Due to the increased cross-section of the silicon ingots, HeraGlaze can simultaneously improve the wafer yield and battery conversion efficiency. • Heraeus Solaray infrared radiant heat lamp: High quality quartz tube and heating material, and through the control of material properties to improve the stability of the solar cell sintering process to help customers achieve higher conversion efficiency; • HecaroTM: One has The revolutionary conductive adhesive, containing less than 50% silver content, is stable and reliable, and can be quickly coated. In addition, Hecaro is also suitable for screen printing process; • Battery line process optimization services: Through close cooperation with world-class research institutions , Heraeus can provide customers with complete solar cell analysis, simulation and process optimization services. • Silver paste-screen combination: A one-stop solution designed specifically for photovoltaic customers to reduce test time and production costs. The edition can effectively optimize the metallization process of the photovoltaic cell production line, realize thin line printing and ensure long-term printing stability.
During this PV exhibition (W3-510 booth), Heraeus Photovoltaic's technical experts also introduced photovoltaic industry solutions other than silver paste.
2.Grid adjustment 7nm process makes AMD easy to meet TSMC
Has always been AMD's loyal partner for Globalfoundries, responding to AMD's announcement that the 7-nm process node will join TSMC as a foundry. It is moving that AMD products will not appear too much between the two foundries. With major differences, Trellis will adjust related processes to be consistent with TSMC as much as possible, so that the product performance of both parties will be consistent.
AMD plans to enter the 7-nanometer process node next-generation product development, including Zen 2 architecture processors, Navi architecture GPUs, Vgea architecture graphics cards and other products are determined to adopt 7-nanometer process, AMD has also decided that 7-nanometer process simultaneously use TSMC and Gemini's technologies. The problem is that the foundry's production technologies are different. How AMD wants to ensure product consistency becomes a problem. GeGe said that it will make concessions when it accepts foreign media interviews. It will adjust process technology to make it with TSMC 7 The close proximity of nano-fabrication technology allows AMD to use both CG and TSMC technologies.
Manufacturers of semiconductor chips, even though TSMC, Gexin, and Samsung all have 7-nanometer process technology, the problem is that each technology is different. All the 7-nm process production line widths are not necessarily the same, which allows the simultaneous use of two chips. The foundry of the wafer will encounter many problems. For example, before the Apple A9 processor used TSMC 16nm and Samsung 14nm process technology, the last two foundry's processor performance, power consumption is not the same, to the Apple irritability Less trouble, so it was decided afterwards that TSMC would exclusively manufacture.
Therefore, even though AMD announced the Polaris architecture, it also mentioned that it will use TSMC and Gexin as its foundries. However, the subsequent foundry is only Gexin, but at the 7-nanometer process node, AMD has renewed its position and will use it simultaneously. The two foundries. Although this is a lot of trouble, AMD is more likely to worry that once a single vendor has become a problem, all production will stall and many TSMCs will be more reliable.
As for the 7-nanometer manufacturing process of TSMC and Gexin, which is not the same, how does AMD guarantee that the quality of the chips produced by OEMs will be the same? Even the minimum requirements cannot be significantly different. They stated that they adjusted the gate pitch and SRAM cell of the 7-nm process to make it more similar to TSMC's 7-nanometer process, which enabled AMD to use two 7-nm processes simultaneously.
The lattice core further pointed out that AMD also expressed its understanding of the use of TSMC as a substitute factory. The reason was that AMD's order demand exceeded the production capacity of the lattice core. Therefore, TSMC sought to join the foundry. This is no problem for the lattice core. As for AMD's adoption of the 7-nanometer manufacturing process of the two foundries, what kind of orders will be assigned to the two foundries? Market participants estimate that, according to the current situation, the Zen 2 processor in the CPU segment will It may continue to stay in the production of grid cores, and TSMC, which has always had high-performance GPU production experience, will be assigned to the GPU chip production orders. TechNews
3.8-inch wafer foundry capacity tight
Due to the shortage of MOSFETs and the impact of price hikes, upstream 8-inch wafer production capacity has raised alarms. The 8-inch quotation has been escalated again. The world’s advanced 8-inch production capacity is still in short supply. The industry estimates that it will not be able to achieve settlement until early next year.
Recently, the MOSFET quoted price has increased. As the trend of household appliances in mainland China continues to increase, the demand for MOSFETs continues to increase. In addition, new applications such as wireless charging, Internet of Things, and automotive applications have led to an increase in the demand for related components, resulting in the global 8-inch crystal. The capacity utilization of the circle foundry is maintained at a level of around 100%.
In addition, the expansion of global wafer foundries is mainly based on 12-inch advanced processes. The 8-inch equipment is expensive and does not meet the investment benefits. Global wafer foundries do not plan to significantly expand production. The overall demand continues to increase, resulting in supply and demand. The situation will be even more intense.
In addition, there will be a large number of orders for power management and vehicle use by foreign IDM makers, and this glory will continue all the way to 2019. And the industry expects that the trend of IDM manufacturers' release will only increase and will not decrease, mainly due to foreign companies. The optimization of product mix will continue to release mid-end gross profit orders to professional foundries for production. The company concentrates its resources on vehicle use, industrial control and other niche-based product development, lowers production costs and costs, and the advanced world has passed a number of IDM customer certifications. It is expected to continue to benefit from this trend. United Evening News
4. The national science and technology major special projects undertaken by Jiangfeng Electronics passed the formal acceptance
Gathering micro-web news, May 31, National Science and Technology Major Project (02 special item) '45-28nm Ultrahigh-Purity Series Sputtering Target Development and Industrialization of Wiring for Wires' hosted by Jiang Feng Electronics (Project Number: 2011ZX02705, The following referred to as 'project') passed the official acceptance of the National 02 special acceptance expert group.
According to the disclosure, Jiangfeng Electronics is mainly responsible for three of the topics in this project: 1. Film performance testing and analysis of Cu alloys for 45-28 nm wiring, Co, Ni, Ta (subject number: 2011ZX02705-001); 2, 45 Development and industrialization of ultrahigh-purity Ta, Cu alloy, Co, and Ni alloy targets for -28 nm wiring (Question ID: 2011ZX02705-002); 3, Preparation and industrialization of ultra-pure Cu anodes for 45-28 nm wiring ( Project ID: 2011ZX02705-007)
Through the implementation of the project, Jiangfeng Electronics achieved ultra-high-purity metal sputtering targets and high-purity Cu-P alloy copper anodes in volume production at the 45-28nm technology node for 300mm wafers, and built an analysis of related products. Testing platform. The verification report shows that the above-mentioned mass production products have been certified by internationally renowned semiconductor customers, and the product quality has reached the international advanced level.
According to the relevant regulations of the country's major special projects management, the project to be checked and accepted this time is the pre-project post-project grant (pre-dial start-up fee). During the implementation of the project, the company has received the government-subsidized funds for the project and the subject of cooperation. RMB 1,601.66 Ten thousand yuan, the actual amount of execution confirmed by this internal acceptance was RMB 44,271,600. The project was approved according to the project of “Ultra-high-purity series sputtering target material development and industrialization for 45-28 nm wiring”. After the formal acceptance of the project, The company expects to receive government grants of no more than RMB 28.2550 million.
Jiang Feng Electronics stated that the goal of the country’s major national special projects is to promote the development of China’s electronic materials industry, form China’s semiconductor target materials from raw materials to finished products, and finally use the customer’s industrial chain. The semiconductor chip manufacturer's material needs provide a solid guarantee. The successful implementation of the project will also have a positive impact on the company's future development.
5. TSMC Nanke 3nm Plant N3 Challenged Power Supply Problem
Members of Tainan City, Cai Yuhui, Wang Jiazheng, and Hong Yufeng, held a press conference on the 31st. They not only questioned the future of power supply at the TSMC N3 plant (3-nanometer process), but also doubted whether Tainan would suffer a major blackout.
In the peak of summer electricity use, Tainan City Councillors today questioned whether the Taiwan Semiconductor Manufacturing Co.'s 3-nanometer manufacturing plant will have power supply problems after it settled into Nanke. The deputy director of the Tainan City Council Economic Development Bureau, Xiao Furen, said that the power supply of the TSMC 3-nanometer process plant is flawless.
Representatives from Tainan City, Cai Yuhui, Wang Jiazheng, and Hong Yufeng, etc. held a press conference today, not only questioning the future supply of power to the N3 plant of Taiwan Semiconductor Manufacturing Co., Ltd. (3nm process), but also questioning whether Tainan would have a blackout.
Xiao Furen said that the existing power of Tainan Science Park in Southern Science Park is enough to supply TSMC's N5 plant (5-nanometer process) and the power of TSMC's N3 plant. In the future, the power will be recovered, additional temporary power substations and EHV substations will be added. With local planning, power supply is flawless.
He said that Tainan has promoted solar photovoltaics for many years. The community has applied for 4650 pieces of photovoltaics, with a capacity of 445MW (megawatts), which accounts for 16% of the country. The city will also step up energy conservation and dissemination.
Nan Ke Management Director Lin Weicheng told the Central News Agency that in the construction of the TSMC N5 plant in January this year, water and electricity will be available in the next year; N3 plant is scheduled to be delivered in the middle of next year, and both the Ministry of Economic Affairs and the Department of Water Resources in Taiwan have promised. N3 plant water, electricity supply no problem.