On the morning of May 30th, Hangzhou Liang Microelectronics Co., Ltd. invested 8.3 billion yuan, and an annual output of 3.6 million integrated circuits for 12-inch wafer projects was formally signed in Zhangzhou District. The implementation of this project will break the foreign giants’ The monopoly in this product area has increased the localization rate of large-size high-end silicon wafers and effectively promoted the city to become a leading domestic integrated circuit material industry base.
CPPCC Vice Chairman, District Party Committee Secretary Zhu Xiaonong attended the meeting, Deputy Secretary of the District Party Working Committee, Deputy Director of the Administrative Committee Zheng Hejiang, Deputy Director of the Municipal State-owned Assets Supervision and Administration Commission, Director of the Fund Office Ma Weimin, District Party Committee Member Huang Jianlin, Director of the Green Hair Group Long Yang Liming and Hangzhou Minang Microelectronics Co., Ltd. Chairman Wang Minwen attended the event.
In March this year, the 8-inch silicon wafer production line project invested by Liang Company was officially put into production. This time, the company plans to invest an additional 8.3 billion yuan to build an annual output of 3.6 million integrated-circuit 12-inch silicon wafer projects. 3.5 billion yuan, renting about 70 mu of land and ground about 40,000 square meters of factory buildings from Jinrui Rui Technology (Zhangzhou) Co., Ltd., and building an annual output of 1.8 million 12-inch silicon wafers for integrated circuits. It is expected that the first phase of the project can achieve Sales revenue is 1.6 billion yuan and tax revenue is about 160 million yuan.
Zhu Xiaonong expressed warm congratulations on the signing of the project. She pointed out that the annual production of 3.6 million integrated circuits signed with a 12-inch silicon wafer project is a major event in the development of the integrated circuit industry in our district. It is a happy event that all relevant departments must create the business environment. Excellent demonstration area is an opportunity to do a good job in time nodes to provide quality services, closely link approvals, registrations, funds, etc., to ensure that projects start construction on schedule; to step up construction of the park's life and production facilities, and synchronize the promotion of talent apartments, bus lines and water, The construction of supporting facilities such as electricity and gas; the use of special work classes to carry out team operations, to grasp key links, to grasp key issues, and jointly promote project construction; to actively seek provincial industry guidance funds to promote the development of the integrated circuit industry in the park .
Wang Minwen expressed his gratitude to the district for its high quality and efficient services. He said that the construction of a 12-inch silicon wafer project with an annual output of 3.6 million integrated circuits is inseparable from the work of the party committee of the gathering area, the management committee, and the relevant departments. The company will seize the favorable opportunity according to the requirements of the time node, speed up the progress of the construction, strive to build the project early, put it into production early, and bear fruit as early as possible, and try its best to accelerate the run on the right road.
2. Bitcoin price fluctuates violently, foreign companies even throw up Taiwan Semiconductor Manufacturing Co.
TSMC Chairman Zhang Zhongmou once stated that the virtual currency has become an important growth momentum of TSMC, and that whenever the market fluctuates in the bitcoin market, it often associates with TSMC operations. Foreign Morgan Stanley (Damo) issued a report that the post-recovery of the bitcoin boom, Mining demand will have four scenarios.
Taiwan Semiconductor Manufacturing Co., Ltd. (TSMC) is scheduled to participate in the Citi Global Symposium held on the 30th. Bitcoin has undergone intense volatility in recent days. Treasury has sold foreign capital for up to 30 days, and TSMC has even sold five shares. The company accurately predicted Tamamoto’s second quarter will be due to fluctuations in virtual currency business revenue at the beginning of the year. Compared with the previous quarter, it was a conservative representative of the foreign capital.
Damao closely tracked the kinetic energy of virtual currencies. In May, seven analysts from home and abroad assembled an in-depth report titled 'Virtual Currency: After Gold Rush'. The content reiterated that the ups and downs of bitcoin prices pose a threat to the semiconductor industry, and the 1st quarter of TSMC One-tenth of the revenue received from the virtual currency plays a structural challenge indicator.
Damao pointed out that judging the risk of virtual currency, prices are often regarded as the only factor. In fact, dynamic changes in mining capacity are also critical. This factor can be evaluated by TSMC’s wafer shipments and constructed based on virtual currency prices and capacity changes. Four gold panning situation.
First, 'Gold Rush 2.0': As virtual currency prices rebound and mining capacity is limited, TSMC has invested in smart phones and high-speed computing to retain wafer production capacity, enhancing industry bargaining power.
Secondly, 'circle around the circle': Currency prices continued to rise but production capacity increased. As of April this year, Bitcoin will cost from 6,000 to 9,000 US dollars. At this time, TSMC is affected by weak cell phone demand and has more capacity to absorb mining demand.
Third, the 'soft landing': Some miners, including TSMC, have reduced their resources to invest in mining products.
Finally, a 'hard landing': Semiconductor supply is too slow to respond to price declines. TSMC faces capacity to make up for and reduce capital expenditures.
In the next six months, Damascus estimates that the average price of Bitcoin for each of the four scenarios is US$19,000, and the monthly production capacity for mining is reduced by 10%; the average price is US$19,000, the production capacity is increased by 30%; the average price is US$3,000, and the production capacity is reduced by 10 %, and average price of 3,000 US dollars, capacity increase by 30%. For this year's TSMC operations, the basic situation of the Morgan Stanley is the average price of 9,000 US dollars, production capacity increased by 15%, revenue increased by 2%. Economic Daily
3. Guotai Junan: For the first time, SMIC will increase its rating target price of 16.76 yuan
Guotai Junan issued a research report saying that for the first time covering SMIC, it gave a rating of 'overweight' with a target price of 16.76 yuan. The bank expects the company's 2018-2020 EPS to be 0.27, 0.48, and 1.04 yuan, giving the company 35 times PE in 2018. Price 16.76 yuan.
The bank stated that in 2017, the global foundry industry achieved a total revenue of 57.3 billion U.S. dollars, a year-on-year increase of 7.1%. With the rising demand for Internet of Things, automotive electronics, and HPC, the bank believes that the foundry market will continue to grow. .
According to the report, there is currently a possibility that TSMC’s unique industrial structure will be broken, and the second giant will appear. Breaking the monopoly of advanced manufacturing processes is in line with changes in the demands of customers' interests. The mainland’s undertaking of the transfer of the semiconductor industry has brought about a great development environment. The national strategy for the localization of integrated circuits brought about strong policy support; SMIC's active deployment of top-notch manufacturing processes has locked the foundry's core competitiveness. The company's upstream and downstream layout of TSMC's industrial chain has laid a foundation for comprehensive competitiveness.
In addition, Guotai Junan stated that the company’s revenue, gross profit margin, and capacity utilization rate continued to rise in the first quarter of 2018. The bank believes that the company has outperformed its performance in the second half of 2017. By comparing SMIC and BOE , Refer to BOE's track of success. The bank believes that SMIC will maintain a high level of R&D investment with the support of large funds, and it will be rain-proof on the international advanced path.
At the same time, SMIC also pays attention to mature processes and customized applications. SMIC’s revenue growth in CIS and NORFlash applications increased by 70% in 2017, and there are also active layouts for NAND Flash, BCD, power management and Internet of Things applications. , Mature process has become stable performance of the ballast stone. Sina Hong Kong stocks
4. Hua Hong Hongli Xu Wei: Wuxi IC R&D and manufacturing base is stepping up its construction
Yesterday, the signing of major projects in the integrated circuit design industry in Wuxi High-tech Zone and the Wuxi IC Design Industry Summit Forum were successfully held. A large number of experts and scholars shared their insights on the current status and development strategy of China's integrated circuit industry.
At the meeting, Xu Wei, Secretary-General of the Shanghai Integrated Circuit Industry Association, and Secretary of the Party Committee and Executive Vice President Hua Honghong, delivered a keynote speech titled "Interaction between Hua Hong's OEM and Integrated Circuit Design Industry Development" and demonstrated these years. Hua Hong actively cooperated with the upstream and downstream industry chain. He said that at the moment of the golden era of the development of China's semiconductor industry, Huahong Hongli, as the leading global specialty wafer foundry company, will always work with customers and partners. Work together closely to create a 'core' dream.
In addition, Hua Hong Wuxi integrated circuit R&D and manufacturing base is stepping up construction in the first phase, and will strive to build a world-leading 12-inch 90-65/55nm featured process manufacturing platform around smart terminals, 5G communications, Internet of things, automotive electronics, etc. , Serves IC design companies and related terminal application vendors.
5. A new generation of 5nm process chips unveiled, 24% smaller than previous product area
In the current global chip manufacturing industry, in addition to TSMC, Gexin, Samsung, and Intel, which have advanced production technologies, advanced technology logic chips can be produced with its powerful production energy. In addition, IMEC is on wafers. In the field of manufacturing, leading companies in technology research and development. As a result, Japan’s Samsung Electronics Co., Ltd. and South Korea’s Samsung have disclosed their layout of the advanced 5-nm process. Aimeco also announced a new technology last week that created the world’s smallest The SRAM chip has a chip area that is 24% smaller than that of the previous product and will be applicable to advanced 5nm process technology in the future.
In fact, because of the simple structure and other factors, R&D personnel in each generation of new processes often use SRAM chips for testing. The result is that the smaller the core area of the SRAM chip created by the user, the more advanced the process technology. Previous records , Samsung announced at the international conference in February 2018 that the journal issued a 6T 256Mb SRAM chip with an area of only 0.026mm2. However, the new generation of 6T 256Mb SRAM chips developed by Aimetech last week with Unisantis broke this record. The core area is only 0.0184 mm2 to 0.0205mm2, which is 24% smaller than Samsung's SRAM.
Aimeike indicated that the reason why the area can be greatly reduced is due to the use of a new transistor structure. Unisantis and Amtech use a vertical-surround gate transistor (SGT) structure developed by Unisantis. At a level of only 50nm, compared with a standard-type GAA transistor, the vertical SGT cell GAA transistor area can be reduced by 20% to 30%, and at the same time it performs better in terms of operating voltage, leakage current, and stability.
At present, Aimeike is working with Unisantis to customize the key process steps and steps of the new process. It is expected that through a new process to collaboratively optimize the DTCO technology, R&D personnel can use a 50nm pitch to manufacture 0.0205mm2 SRAM cells. The process can also be applied to nodes with 5nm process. In addition, the process technology can also use EUV EUV lithography to reduce the process steps, which makes the design cost equivalent to the traditional FinFET process. TechNews
6. Ultra-billion market space, the trend of localization of semiconductor equipment
Some time ago, the “forbidden core” incidents that ignited the domestic and international uproar have sounded alarm bells for the semiconductor industry in China. The semiconductor industry is not self-controllable and the security of the country cannot guarantee the development of the industry.
The demand for the development of the integrated circuit industry will inevitably push the localization process of the chip. The localization of future equipment is an inevitable trend. With the development of the national semiconductor industry, the domestic equipment market has a space of over ten billion yuan.
Enthusiasm for round plant investment drives semiconductor equipment growth With the improvement of the downstream semiconductor industry and the continuous upgrading of the wafer industry, the global investment in semiconductor wafer fabs has greatly boosted the growth of the upstream semiconductor equipment industry.
According to the SEMI report, from 2017 to 2020, there will be 62 new semiconductor fabs in the world, including 26 in mainland China, mainly in 12-inch wafer fabs. Take Luofangfa fab data as an example. 80% of the plant's investment is for purchase, which will surely drastically boost the development of the semiconductor equipment industry.
Localization of wafer manufacturing key equipment needs to be broken The wafer manufacturing industry is a typical asset and technology-intensive industry. Lithography machines, etching machines, and thin film deposition equipment are the core equipment for wafer manufacturing, accounting for 23%, 30%, and 25% of the wafer manufacturing process. As the core equipment of semiconductor chip, the machine has high technical difficulty, the price is more than 20 million dollars, the high-end field is monopolized by Dutch ASML, and the market share is as high as 80%. The latest EUV lithography machine can be used for trial production of 7nm process, up to 3- 400 million U.S. dollars.
The global foundries TSMC, Samsung, and Intel launched a process competition below 20nm today. China's leading lithography machine can only be used to process 90nm chips!
National policies and financial support continue to increase Since 2014, the state has proposed to establish an industrial chain plan for wafer-to-terminal products, requiring integrated circuit equipment materials to enter the international procurement supply chain before 2020.
To this end, the state has invested a large amount of funds and policies to promote the localization of semiconductors. The large integrated circuit funds have entered a period of intense investment. The total investment funds of the former IC industry reached 653.2 billion yuan, and the scale is expected to be equal to 1 trillion yuan. Covers IC design, wafer manufacturing, chip packaging and testing and other fields.
Localization of equipment is the most important aspect of localization of ICs. Only by truly mastering the most core technologies can localization be realized in the true sense. It can be predicted that the future investment of large funds and national industrial policies in equipment and policy support will be Continue to increase.
Domestic wafer manufacturing equipment is expected to exceed 10 billion in the next three years The market demand for wafer fabrication equipment in China is in a rising phase. According to the production conditions of 21 domestic 12-inch wafer fabs, comprehensive consideration will be given to the construction time of fabs, the ratio of equipment investment, and the potential of core power forecasting in 2018, 2019, and 2020 in China. The market space for domestic wafer manufacturing equipment reached 7.1 billion yuan, 13.7 billion yuan, and 18 billion yuan. The market space of 2018-2020 with SEMI caliber equipment is estimated to be approximately 25 billion yuan. The investment in the construction of fabs will be used to measure the 2018-2020 market. About 38.7 billion yuan in space.
Although the process of localization of semiconductor manufacturing equipment in China has been accelerating, the entire equipment market has presented a prosperous picture, but localization can only be achieved overnight if it is completely replaced. Continuously strengthening the level of research and development and improving technological capabilities is the only way to truly improve China’s semiconductor manufacturing equipment. The most effective method of international competitiveness.