1.SIM accelerates elimination! China Mobile carries the first eSIM chip with Ziguang Zhanrui;
According to the micro-message news, China Mobile today launched the China Mobile Inside Project of the Smart IOT and released its first eSIM chip. China Mobile said that this chip was developed by Ziguang Zengru and China Mobile, and is an independent brand.
According to China Mobile, the eSIM chip is C417M. The main feature is the integration of China Mobile's eSIM function, support for over-the-air card writing, minimizing the size of the terminal, and avoiding poor communication or SIM card failure due to adverse environment or vibration. Improve the stability of the chip.
The first C417M series chip
China Mobile Inside plans to launch the first C417M series chip, which is China Mobile's own brand and cooperates with Ziguang Zengru to develop R&D. Its main feature is to integrate China Mobile's eSIM function, support air card writing, and minimize terminal volume while avoiding If the environment of the deployment scenario is bad or the vibration causes the SIM card to be in poor contact and cannot communicate, the stability of the chip is further enhanced.
This series of chips integrates the China Mobile SDK and can seamlessly connect to OneNET, the China Mobile Internet of Things open platform, to help companies achieve rapid and low-cost R&D of upper-layer applications. In addition, the on-chip FOTA function enables the products to be continuously enhanced after launch. And the problem is fixed. The chip released this time includes two kinds of C417M-S and C417M-D, all support the mainstream LTE frequency band of China Mobile and global operator, support functions such as bluetooth, Wi-Fi, FM and GNSS multimode satellite positioning,etc., Satisfy a variety of practical scenarios such as Bluetooth calls, music playback and positioning navigation.
From the chip level to the eSIM package, its reliability is higher, and its tolerance to harsh environments is better. The eSIM function is directly embedded in the communication chips purchased by the terminal manufacturers, simplifying the production process. At the same time, the terminal manufacturers do not need to separately dock the chip manufacturers and Operators, which can effectively reduce communication costs and can ensure the security of communication information more effectively, will play an important role in the networking, smart wear, industrial equipment monitoring and other fields.
Chip and Terminal Subsidy Program
China Mobile and China Mobile Inside Embedded Chips, together with Guangzhou Mobile, provide chip and terminal subsidy programs for industrial chain partners, effectively reducing development costs and industry entry barriers, while reducing the production and operating costs of the industrial chain. In the Internet of things industry chain, promote the accelerated development of intelligent industry.
In terms of content and channel operations, China Mobile and Guangzhou Mobile will vigorously promote industrial cooperation based on the China Mobile Inside Program, and provide more value-added services for industry chain partners and end customers, including online real-name authentication capabilities , Terminal management capabilities, local information value-added services (insurance, transportation, education, etc.) Combine local mobile user resources, develop channel capabilities, and further promote industrial cooperation and in-depth operations.
For the individual user market, Guangzhou Mobile launched the '1+N' IoT marketing model to promote the in-depth operation of 'individual user + IoT card'. In conjunction with China Mobile Inside's custom chip, explore the 'business + terminal' industry model. ' The 1+N' marketing model provides individual clients with end-to-end services such as number-based payment, online processing, online real-name, online payment, and online delivery, reducing transaction costs for customers.
At the same time, it will also provide special subsidies for terminals participating in the China Mobile Inside program to benefit consumers and allow more consumers to experience the convenience brought by the Internet of Things. In the first phase, the owners of private car owners will enjoy the exclusive package and service. The smart wearable family enjoys the smooth package. In which the owner enjoys the package users only need to pay 1 yuan per day, you can enjoy dynamic navigation, voice interaction, audio-visual entertainment, insurance and other intelligent services to help people. Pay 1 yuan, you can enjoy voice calls, accurate positioning, weather forecasting, sports step counter and other intelligent services.
At the press conference, China Mobile IC Innovation Center and China-made communication chip leader Ziguang Zengru signed a cooperation agreement, China Mobile ICT Smart Hardware Center and An Changxing, Yanqiang, Lenovo, Zhongtong TV At the same time, driving control technology, Donghua Star Alliance and other partners signed a contract.
China Mobile also stated that in the future, the eSIM chip can be applied to various Internet of Things terminals, such as smart meters, smart homes, industrial equipment, agricultural equipment, drones, etc. Previously, at CES Asia 2017, China Mobile launched The eSIM NB-IoT communication module M5310, the eSIM chip introduced this time will promote the development of the mobile phone industry and the internet of things industry. (Proofreading/Maomao)
2. Ziguang Zengrui and China Mobile in the launch of the first China Mobile Inside 4G eSIM SoC chip;
On May 25th, China Mobile's China Mobile Insider officially announced the China Mobile Inside project and signed a contract with Ziguang Zengru. The two parties will jointly launch the first self-developed 4G eSIM independent brand in China. SoC chip - C417M-S, C417M-D.
In the era of interconnection of all things, in the face of complex usage scenarios, traditional SIM cards have been unable to meet the requirements for miniaturization, stability, high efficiency, remote configuration, etc., and new eSIM technology has emerged, resulting in lower prices for users. Convenient, more secure communication experience.
In the future, Ziguang Zengrui will jointly launch China Mobile IoT to continue to launch more competitive pan-chip platform solutions to serve industry partners and boost the development of the Internet of Things. At the same time, Zhanrui is also committed to strengthening the upstream and downstream industries. Cooperate in battle to create a bright future for everything.
3. Experts commented on domestic chips entering the central mining directory: they must also strive for their own efforts;
In the past few days, a message about 'domestic chips included in government procurement' spread. The reporter confirmed the news by inquiring and verifying the relevant experts. In addition, the interviewed experts said that this is indeed the country’s emphasis on institutional support. Signals for the development of domestic chips, but should not be over-interpreted as 'domestic chips have ushered in spring'.
The reporter learned from the inquiry that on May 17, the government procurement center of the central government office issued a solicitation opinion on the purchase of information products (hardware) and air-conditioning products for the central government agencies from 2018 to 2019. It is attached to the announcement. In the “Request for Comments on the System for Purchasing Technical Standards for Servers”, it can be clearly seen that in the server product procurement category announced this year, on the basis of the existing towers, racks, high-density servers and other categories, a new “domestic chip server” was added. In the category, and listed therein are the CPU performance parameters required for Loongson CPU server, Feiteng CPU server and Shenwei CPU server.
Entering the Central Reserve List for the first time
The reporter learned from multiple verifications that this should be the first time that domestic chip servers have entered the public release list.
'As far as I know (domestic CPU server) entered the publicly released procurement list, this is the first time. 'Zhang Tianyi, general manager of strategic planning department of Tianjin Feiteng Information Technology Co., Ltd. (hereinafter referred to as 'Fengteng') told reporters of the "China Science Journal" : 'Originally it was not published in this way. It was all internal applications that were promoted in the form of projects.'
Shen Wei chip team also confirmed that this is the first time that the domestic CPU server entered the government procurement list.
'Before you did not enter the procurement list, government agencies can not purchase or purchase; Now you can purchase. 'In the opinion of the CEO of Godson ZhongKe, this has a 'very important, landmark significance' for domestic chips. The country has strong support for domestically produced chips'.
Zhang Chengyi also told reporters that this move shows that the country has started to “promote the application of domestic chips from the institutional level.” The reporter asked: 'Is this a big push?' Zhang Chengyi also gave a positive answer.
Domestic CPU also have their own gas
However, entering the Central Reserve List does not mean that the domestic chips will move to the Kangzhuang Avenue. Zhang Chengyi reminded that for the first time it was included in the list. Strictly speaking, it only opened a door and it has the qualifications for political and political use. Is the central government agency purchasing? It depends on the specific circumstances.
"In fact, it is still the domestic CPU itself that has to strive for competitiveness, and to improve performance, energy efficiency ratio, cost optimization, and ecological construction, and to truly compete with Intel, AMD's production of chips on the same stage." Zhang Chengyi said that if you want the state sector to simply frame Out of the 'domestic' category, will be questioned. No other indicators of the relative advantage, or can not be user's approval, after a few years will eventually be eliminated by the market.
In addition, Hu Weiwu believes that considering that the development of the chip industry also includes the software environment and the overall maturity of the software ecosystem, the domestic chips must be fully replaceable. It may be necessary to wait between 2020 and 2025. 'Only after a certain batch size, there are problems. Will find that in the process of this application slowly mature, slowly growing. '
Zhang Chengyi also told reporters that in the field of general-purpose CPUs such as desktop computers and servers, domestic chips currently face relatively high ecological pressure.
“Domestic chips still have certain competitiveness in certain areas, such as traditional high-performance computing, artificial intelligence (AI) applications—high-performance computing applications are relatively narrow, and AI is emerging. Both are facing an “ecological legacy”. 'Not too big, as long as the level of chip design goes up in China, the ecology is also easier to perfect.' Zhang Chengyi said a word, said: 'But in the field of general-purpose CPU, domestic CPUs must break through not only design barriers, but also ecological barriers. Spelling hardware and software as a whole.
Ecological cultivation is essential
In the current server chip market, Intel is almost alone. Its x86-based server chips, which are proprietary to AMD, account for more than 99% of the global server chip market. In domestic chips, whether it is the Godson-based MIPS architecture, ALPHA The architecture of Shenwei, or the ARM architecture, is unable to compete with Intel's x86 architecture chips.
However, Zhang Chengyi believes that in recent years, the ARM chip server ecosystem is undergoing some good changes.
'I personally feel that the ARM ecosystem is the most opportunity to challenge x86.' Zhang Chengyi told reporters that currently in the field of ARM-architecture chips, there are internationally promoted 'Linaro', an open-source collaborative engineering organization for ARM ecosystem development software. , The “Green Computing Industry Alliance” under the guidance of the Ministry of Industry and Information Technology has promoted the ecological construction and application promotion of a series of open-chip technologies based on ARM. In such an environment, not only a number of companies such as Feiteng, Huawei, and China have been brought together. The core technology providers and manufacturers of ARM chips have also attracted many software and hardware manufacturers, system integrators, and enterprise users such as Baidu and Alibaba. They are interested in the ARM architecture ecosystem.
From the perspective of Total Cost of Ownership (TCO), ARM servers still have advantages over x86 servers in some areas. 'Zhang Chengyi said that while ARM servers are currently inferior to x86 in overall performance, if they fight energy efficiency, they fight for concurrency. In particular, TCO emphasized by many data centers, in some scenarios ARM architecture servers perform better.
Zhang Chengyi also stated that the ecological changes in the field of ARM architecture chips also inspired us that no matter what kind of architecture, we can only use the characteristics of this kind of architecture chip in a specific application scenario to gradually nurture the application ecology and hope to usher in a true spring. network
4. Chinese scientists discovered the first flexible inorganic semiconductor material;
Recently, Shi Xun, a researcher at the Shanghai Institute of Ceramics, Chinese Academy of Sciences, and Chen Lidong collaborated with German scientists to discover the first flexible inorganic semiconductor material α-Ag2S (Au Sulfide). This typical semiconductor is very unusual at room temperature. Metal-like mechanical properties, especially good ductility and bendability, are expected to be widely used in flexible electronics. At present, relevant research results have been published in the internationally renowned academic journal Natural Materials Science.
In recent years, flexible electronics have attracted widespread attention and rapid development worldwide, and are believed to bring about an electronic technological revolution. It is an emerging electronic technology for fabricating organic/inorganic material electronic devices on flexible substrates. The unique deformability and efficient, low-cost manufacturing process, in information, energy, medical, defense and other fields, has a wide range of application prospects.
However, current inorganic materials, especially semiconductors, are brittle materials. Under large bending, large deformation and tensile conditions, they are prone to cracks and lead to device failure; in addition, organic semiconductors have relatively low mobility compared to inorganic semiconductors, and electrical The range of adjustable performance is small and it cannot meet the vigorous development demand of the semiconductor industry.
Therefore, the development of inorganic semiconductor materials with good ductility and bendability, and the breakthrough of flexible electronic technology in the field of integrated equipment and manufacturing processes, is an urgent requirement for the development of flexible electronics.
After years of research, the research team of the Shanghai Institute of Ceramics found that α-Ag2S has very unique and unique mechanical properties relative to other semiconductors or ceramics. It has the same ductility and deformability as metal, and it has external forces and large strains. Under the condition of no material damage and breakage, the maximum deformation can reach more than 50%, the maximum bending deformation exceeds 20%, and the tensile deformation reaches 4.2%. All these values far exceed the known ceramic and semiconductor materials, and Some metals have similar mechanical properties.
In this regard, the research team further studied the mechanism and mechanism of these abnormal mechanical properties of α-Ag2S, and prepared α-Ag2S films for the application of flexible electrons. It was found that α-Ag2S has greater deformability than bulk materials. And, after tens of hundreds of repeated bending deformations, its electrical properties remain almost unchanged or change little. Furthermore, unlike known brittle ceramic and semiconductor materials, α-Ag2S semiconductors have metal-like mechanics. Performance, which can maintain the integrity and electrical properties of the material under bending and deformation. Its wide range of adjustable electrical properties, suitable bandwidth, and large mobility make it possible to be widely used in the field of flexible electronics. At the same time, this study It will also open research work to find and discover other semiconductor materials with similar metal mechanical properties. Economic Daily
5. Ketong Core City Kang Jingwei: The chip is the entrance of future science and technology demand will increase dramatically;
Kang Jingwei, chairman of China's largest IC components and electricity supplier Tongxin City, said at the Snowball Hong Kong Stocks Forum that with the rapid development of the IoT industry in China's communications industry, the demand for chips as an emerging electronic manufacturing industry will increase dramatically.
According to statistics, there are more than 3 million electronic manufacturing companies in China, and it is the world’s largest chip use country. The amount of imported IC components in China exceeds RMB 2 trillion annually. Kang Jingwei stated that chips are important basic industries in China’s high-end manufacturing industries in the future. , It is also a high-input, fast-changing market. In chip sales, Cogobuy has explored a unique business model of 'technology promotion + product sales' to help the chip industry and chip users achieve precise matching.
Kang Jingwei disclosed that at present, Cogobuy strengthens its control over overseas high-end chips on the one hand, and on the other hand accelerates cooperation with domestic chip companies to help local excellent chip companies to open the market. Currently, it has cooperated with more than 40 domestic companies. Cogobuy City will use chips as an entry point for electronics manufacturing, enter the electronic emerging manufacturing market, and benefit from high-growth industrial opportunities,” said Kang Jingwei.
6. Anti-photon darkening at Shanghai Optoelectronics Co., Ltd. Progress in research of deep-UV transmission hollow fiber
In May 2018, LaserFocusWorld, the international laser industry magazine, reported on the breakthrough in the research of anti-photon darkening and deep ultraviolet energy-transmitting air-core optical fiber researched by Shanghai Institute of Optics and Fine Mechanics, Chinese Academy of Sciences. High-power laser unit technology of Shanghai Optics-Machine Institute. The laboratory developed anti-resonant hollow-core quartz fiber, which achieved a low loss transmission of 0.1 dB/m at 218 nm, which was reduced by nearly an order of magnitude compared to the conventional fused silica fiber. The pulse width was 17ns, and the pulse energy was 0.47μJ. In the process of 266 nm Q-switched laser with 30kHz repetition frequency, no photonic darkening occurs in the hollow fiber within 1 hour, far beyond the performance of refractive index silica fiber. The research results are published in Opt. Express 26, 10879 (2018 ).
Traditional refractive index light-guided solid optical fibers represented by quartz optical fibers have achieved great success in the field of optical fiber communications, optical fiber sensing and fiber lasers, and various optical fiber products have become indispensable in national defense, industrial and basic research. Tools. In recent years, with the development and introduction of new materials, the low-loss transmission window of refractive index fibers has been continuously expanding and has covered the visible to mid-infrared wavelengths. However, at the ultraviolet and deep ultraviolet wavelengths, it is limited to glass materials. Intrinsic absorption, multiphoton absorption, and loss of refractive index fiber increase sharply; photon darkening due to high energy photons fundamentally limits the application of conventional fibers in the field of ultraviolet laser transmission. With ultraviolet and deep ultraviolet With the constant maturity of solid-state laser technology, high-power laser transmission in the ultraviolet band is increasingly urgent for new types of low-loss, anti-photonic darkening fibers.
Hollow fiber, that is, the core region without high refractive index material, is mainly filled with gas or vacuum. Different from the principle of total reflection of the refractive index type solid optical fiber, the hollow core optical fiber realizes light in the low refractive index core region by introducing a complex cladding structure. Low-loss propagation. Anti-resonant hollow fiber has emerged as a new type of hollow fiber in recent years. It has the advantages of wide transmission window, low transmission loss, good single mode, etc. Compared with refractive index fiber, hollow fiber optical mode field Coverage with optical fiber materials can be reduced to 10-4 to 10-5, making the hollow fiber laser's anti-laser damage threshold, anti-photon darkening, rapid increase in radiation resistance, absorption of optical fiber material, fiber nonlinearity and fiber dispersion Rapid reduction, especially for high-power laser transmission and low-wavelength laser loss transmission.
Figure: Anti-resonant hollow fiber and loss measurement results