The 3rd General Assembly Innovation Design Competition Promotion Team is released

On May 23, 2018, the largest semiconductor component distributor in the Asia-Pacific region, Great General Assembly, announced that the third WPG i-Design Contest was reviewed by experts. After that, 55 teams have emerged from the 271 registration teams. The University of Greater China will provide support for the teams entering the semi-finals from the development board to the funds, and will provide valuable bonuses to the winning team. The theme of the competition is 'Intelligent Core City, Galloping Core Future' is intended to inspire and encourage the creativity, imagination and execution of the participating teams. The amazing inspirations they have generated are evident through the contest website. This competition is also supported by NXP Semiconductors. (NXP) and other well-known manufacturers in the industry's full support and support.

By the end of the registration deadline on April 22, 271 teams including Tsinghua University, Harbin University of Science and Technology, Xiamen University, and Taiwan University had received applications for projects such as smart cities, intelligent transportation systems, and smart car management. The contest attracted both sides of the Taiwan Strait. A number of excellent college student teams, including many experienced contestants, brought with them patented high-quality innovative products, making the technical level of this competition once again improved.

The team entering the semi-finals will receive successively free development boards and devices provided by the University of Shanghai National Assembly. On July 26th, the University of Shanghai will hold an online technology exchange meeting to answer the difficult questions for the participating teams. It also welcomes electronic system enthusiasts and engineers to join together. Participation. After a four-month development phase, the final winning mainland team and the Taiwan team will perform the finals and awards ceremony in Beijing on December 8. The University of Greater Vancouver has established a generous bonus for this winning team.

The competition received strong support from the industry. NXP Semiconductors, as a platinum-level sponsor, will continue to provide strong support for the platinum sponsors, Nexperia and ON Semiconductor. (Semiconductor) is the gold sponsor of the competition. In addition, the mainland competition has received technical guidance from the China Semiconductor Industry Association, the China Educational Innovation School-Enterprise Alliance and the China Software Industry Association, and provides follow-up support to the winning team. Taiwan events have also been obtained. Asian IoT Alliance, Taiwan Smart City Industry Alliance, Taiwan Vehicle Connectivity Industry Association, Augmented Reality Interactive Technology Industry and Research Alliance and Tailora Taiwan Intelligent Automation and Robotics Association.

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