Set micro-network news (compiler / Aki), in late May, market analysis agencies will publish semiconductor market analysis report for the first quarter of 2018.
The contents of this report will include: Discussion of the IC industry market in the first quarter of 2018, the routine forecast of semiconductor company capital expenditure in 2018, and the ranking of semiconductor suppliers in the first quarter of 2018.
Table 1 lists the top fifteen companies in global semiconductor supplier sales in the first quarter of 2018 (data is divided into two parts: IC and optoelectronics, sensors and discrete components). These include eight companies headquartered in the United States, three European companies, two South Korean companies, one company in Taiwan and one Japanese company.
The report pointed out that after Broadcom announced in April this year that it would relocate its headquarters from Singapore to the United States, Botong was listed as an American company in this report.
In addition, the top fifteen major semiconductor suppliers include a pure wafer foundry – TSMC, and four Fabless companies. If TSMC is excluded from the top fifteen rankings, MediaTek, a Fabless company based in Taiwan, China, will Ranked 15th.
The biggest change in this month’s report is that IC Insights realized that in some cases, semiconductor sales will be doubled, so the ranking announced is for semiconductor top suppliers, not simply Market share ranking.
Since many suppliers in the semiconductor industry supply products such as equipment, chemicals, and gases, rather than listing very clear data on the list as large IC manufacturers do, IC Insights will replace the Work and Fabless Inc. undoubtedly included this list.
In the April report, IC Insights still listed the IC vendor's market share ranking. The foundry was also excluded from the list.
Overall, the top 15 suppliers listed in Table 1 provide a clearer guide for the industry to determine which companies are top-tier semiconductor suppliers, whether they are IDM, Fabless or foundry.
Table I
Let's take a look at the specific data of this list.
Overall, in the first quarter of 2018, the sales of the top fifteen largest semiconductor companies increased by 26% year-on-year, while the growth rate of the global semiconductor industry during the same period was only 6%. The top fifteen semiconductor companies have grown faster than the global growth rate. Twenty percent.
What is even more surprising is that the three major memory providers Samsung, SK Hynix and Micron have grown by more than 40% year-on-year.
In terms of sales, 14 of the top 15 semiconductor companies had sales of at least 2 billion U.S. dollars. Four companies surpassed the same period last year.
As shown in the figure, semiconductor company's quarterly sales only need to reach 1.8 billion U.S. dollars, and it can be included in the world's top 15 semiconductor suppliers.
In the first quarter of 2017, Intel was still the number one semiconductor supplier, but from the second quarter of 2017 and the 2017 ranking, Samsung surpassed Intel.
In particular, with the rapid growth of the DRAM and NAND flash memory markets in the past year, Samsung’s sales in the first quarter of 2018 exceeded Intel’s 23%, and in the first quarter of 2017, Samsung was also behind Intel’s 5%.
Even more interesting is that the proportion of storage in Samsung's business is increasing. In the first quarter of 2018, storage accounted for 83% of Samsung's semiconductor sales. This figure was 77% a year ago, more than two years ago. 12%.
In addition, Samsung’s sales of non-storage products in the first quarter of 2018 were only US$3.3 billion, an increase of only 6% from US$3.12 billion in the first quarter of 2017.
In addition, IC Insights expects that in the coming years, the world’s top 15 semiconductor suppliers may usher in considering possible or impending mergers and acquisitions this year, such as acquisitions of Qualcomm and NXP, and possible market volatility in the future memory market. Great changes and gradually mature. (Proofreading / Fan Rong)
2. Terry Gou: Industrial Internet requires a lot of chips Hon Hai will be semiconductor
The China Securities Journal reported that Chairman of Hon Hai Group, Mr. Gou Tingming, delivered a speech at Tsinghua University on the 16th and described the blueprint of Hon Hai/Foxconn Group in the era of industrial Internet empowerment. It will fully promote intelligent manufacturing and endeavor to serve in the advanced real economy of mainland China. Promote the Internet, big data and artificial intelligence leader. He also emphasized that with the Industrial Internet, elephants (large enterprises) can not only dance but also jump up and tango.
In terms of semiconductor layout, Gou said that Hon Hai Group has set up a semiconductor business unit and has a team of hundreds of people to design and manufacture semiconductors because 'the industrial Internet needs a large number of chips, including sensing chips, traditional chips, etc. One year needs to import more than 400 billion U.S. dollars of chips, so semiconductors will certainly do it themselves.
Gou said that Foxconn will use the industrial Internet as a carrier to fully apply AI technology to enable visual inspections, immediate exception handling of people and logistics, and autonomous diagnostics of equipment. He pointed out that the era of industrial Internet empowerment is not called a factory. It is called intelligent manufacturing. The base, through the collection of data that is critical to the microscopic nanoscale, gathers the data in the cloud, calculates, analyzes, processes, and generates intelligent predictions. This can be a good “pre-event” and can accurately solve problems in industrial manufacturing.
According to news reports, Terry Gou made the opening speech on the second day of the second session of the World Smart Conference held in Tianjin on the 17th. The speech was entitled "Intelligent Manufacturing + Digital Economy = Industrial Internet." Terry Gou said that Foxconn had It is from the transformation of OEM companies and emphasizes the opportunity of the 'real economy'.
Gou pointed out that the number of people and machines connected to the industrial Internet is much greater than the number of people connected to the consumer Internet platform. By 2020, the number of Internet of Things (IOT) equipment will reach more than 50 billion yuan. According to M.D. The value of the Internet grows at the rate of the square of the number of users. The value of the industrial Internet platform will far exceed that of the consumer Internet platform, and it may even be a 'rich enemy'. According to forecast, by the year 2025, the Industrial Internet will create economic value of 82 trillion US dollars. It accounts for half of the global economy.
The 'real economy' is a keyword repeatedly mentioned by Terry Gou in his speech. He believes that it cannot emphasize 'Internet +' but it must be 'real economy + Internet'. Terry Goh said that now the Internet company, Apple, If you run into hardware and you surrender, Internet companies can only make entertainment systems for cars. They cannot produce a real economy.
Terry Gou also explained Foxconn's layout in the Internet and artificial intelligence. He used '8K+5G' in his work, smart home ecology, safety, health care, recycling, environmental protection, education, entertainment, and property transaction procurement.
In addition, Foxconn also lays out on the blockchain gold flow platform and uses the blockchain safe and reliable cryptography technology to open up the 'six flows' of the Internet, including the human flow, logistics, process flow, news flow, gold flow, and technology flow. In order to solve the problem of financing difficulties for SMEs, we must open up the Rendu Second Pulse of SMEs.
3. Is the new Fab plant in the United States ending?
Is there no new semiconductor Fab plant in the United States under construction?
According to the SEMI Global Fab Forecast (Fab Forecast) report released in February 2018, the new Fab plant was Meiguang No. 60 in Utah, USA. This is not a new or green plant, but it is rebuilt on existing structures. 3D NAND. It is expected that the equipment spending of this Fab plant will reach its peak in 2018.
Then it was Intel's Fab. 42. It was put on hold until the construction began in 2011. It is expected that the equipment will begin to be deployed by the end of this year, and equipment expenditure is expected to peak next year.
Many other Fab plants built many years ago are still increasing, such as Globalfoundries Fab 8 Phase 3 (TDC) and D1X (Module 1 and Module 2). D1X is a R&D pilot, not a mass-produced Fab plant. Globalfoundries in Malta The second fab's plan has been launched.
Samsung has a lot of room in Austin, but there is no sign that they will increase.
SEMI's global Fab plant forecast shows that five smaller plants are under planning or under construction, but these have little effect on the construction trend of the US Fab plant.
Basically it is! No more Fab plants!
If we divide the Fab plant equipment expenditure into two categories - new capacity investment and upgrades - we see a trend of increasing capacity at the Fab plant. See the chart below. (Comparing 2005-2011 with 2017-2019). Let's look at 2017 In 2018 and 2019, Globalfoundries, Intel and Micron were several large investors in new production capacity.
This year, 60% of all Fab plants are expected to invest in equipment to increase production capacity, but only one or two Fab plants (Micron and Globalfoundries) accounted for the bulk of this growth. The same situation in 2019, two factories (Intel and Globalfoundries) represents the largest growth share. Investment in new capacity will be lower than upgrade spending.
Once these fabs reach full capacity, additional equipment investment will seriously lag behind the increase in upgrade spending, marking the end of the new US Fab plant. SEMI
By SEMI Industrial Research and Analytics Director, Christian Dieseldorff
4. Chongqing plant will become SK Hynix's largest package testing facility in the world
According to news from the China News Service on the 17th, Wu Zaisheng, chairman of SK hynix Semiconductor (Chongqing) Co., Ltd., disclosed that the Chongqing plant of SK hynix, the giant of semiconductor memory industry, will build a second-phase project and become the world’s largest packaging and testing base.
The Chongqing Plant Phase I project was put into production in 2014 and currently has a capacity of 80 million chips per month.
The investment in Phase II of the Chongqing Plant is not less than US$1 billion. The contract was finalized this month. It is expected to begin in the first half of 2018 and put into operation in 2019. Wu Zaisheng stated that after the production, the total production capacity of the Phase I and Phase II projects will be 1.5 times that of the present By then, Chongqing's factory products will account for the total amount of SK Hynix flash memory products, which will increase from the current 30% to 40%, becoming the company's largest global packaging and testing base.
5. Shipments of silicon wafers in the first quarter of 2018 were higher than the same period of last year, setting a record
According to the quarterly analysis of the silicon wafer industry by SEMI SMG (Silicon Manufacturers Group), the quarterly global silicon wafer shipment volume reached the highest historical record, and global silicon wafer area shipments jumped to 3,084 MSI (millions) in the first quarter of 2018. Square inches), compared with area shipments in the fourth quarter of 2017, 2977MSI increased by 3.6%, which was a 7.9% increase from the first quarter of 2017 shipments.
Neil Weaver, director of product development and application engineering at SEMI SMG Chairman and Shin-Etsu Handotai America, said: 'This year's global wafer shipments have reached the highest level in history, so shipments of silicon wafers such as equipment shipments will also be large this year.' SEMI China
6. Tai Chi Industrial Subsidiary Wins Over 1.2 Billion EPC Project with SMIC Integration
Gathering micro-network news, May 17, Tai Chi Industry evening announcement, the company's holding subsidiary 11 technology has become SMIC IC Manufacturing (Shaoxing) Co., Ltd. MEMS and power device chip manufacturing and packaging test production base EPC project contracting project The successful bid unit has a bid price of 1.226 billion yuan.
According to the disclosure, the project is titled SMIC Shaoxing MEMS and power device chip manufacturing and packaging test production base project EPC general contracting project; Tenderee is SMIC Manufacturing (Shaoxing) Co., Ltd.; project scale total construction area of about 145335m2; The summary of the contract is the EPC general contract.
Taiji Industry indicated that the successful bid of this project reflects Eleven Technology's leading position in the EPC industry in the integrated circuit industry. The smooth implementation of the project will have a positive impact on the company's operating performance.