SLM International’s co-CEO Liang Mengsong revealed that SMIC will mass-produce the 28nm HKC+ process in the second half of 2018, and begin trial production of the 14nm FinFET process in the first half of 2019, and will use it to enter the AI chip field.
Liang Mengsong said that the 28nm process will account for 5-10% of SMIC's shipments in 2018, with the new 28nm HKC accounting for nearly 28nm Poly-SiON.
In the fourth quarter of 2017, SMIC's 200mm wafer fab in Shenzhen had a capacity of 442,750 wafers. In the first quarter of 2018, it increased to 447,750. The average capacity utilization rate also increased to 88.3%.
At the same time, demand from power management ICs is also increasing, 200-mm wafer fabs are making full production, and high-voltage BCD processes are turning to their 300-mm fabs.
In 2017, SMIC’s revenue was US$3.101 billion, a year-on-year increase of 6.4%, gross profit margin was 23.9%, a year-on-year decrease of 5.3 percentage points, and net profit was US$1.081 billion, a year-on-year increase of 10.6%.
Among them, the contribution of the 28nm process increased 4.4 times to create a new high, with an overall share of 8.0%.
SMIC International CEO Zhao Haijun disclosed that in the first quarter of 2018, SMIC’s revenue was US$831 million, gross margin was 26.5%, R&D investment was US$123 million, and second quarter revenue was expected to increase by 7-9% QoQ, gross margin 23-25%. .
Zhao Haijun said: 40% of SMIC’s revenue comes from mainland China.
