Wireless charging other home 528 | millet with just 99? Lei Jun enough

MCU solution can not meet the market demand, the current SoC wireless charging chip as the most promising solution architecture is widely optimistic about the industry.

As the trend of component price increases intensifies, the SoC solution has fewer components and its advantages are more prominent. One of the key features is: Higher cost performance and lower BOM costs.

Component prices

Industry insiders all know that the delivery of MOSFETs, capacitors, chips and other components has been continuously extended, and it faces shortages and price increases all the time.

As for the reasons for this: Suppliers believe that market demand is not high, and lack of efficient communication channels.

Another reason is that the wireless charging production process is long, and this is due to the current wireless charging equipment integration is not enough, supply stability is easily affected by factors outside the industry. SoC integrated chip can be a good solution to the current With these problems, it can allow equipment manufacturers to greatly reduce the material procurement catalog and improve the stability of supply.

Under the background of rising prices, integration can be achieved, which is indeed a big selling point.

Industry may set off price war

At the MIX 2S conference on March 27th, Lei Jun devoted a lot of space to introducing the wireless charging function, and took out the Belkin Wireless Charger, which was priced at Apple’s recommendation price of 498 yuan, and the Samsung wireless charger and the price of 528 yuan. For comparison, it also supports wireless fast charging. As long as the price of the wireless charger is only 1/5, it is only 99 yuan! The wireless charging industry will set off another round of price war.

We speculate that we can achieve such a low price. A large part of this is because it uses SoC solutions.

Dismantling can be foundMillet wireless chargers really use the SoC wireless charging scheme, which fully confirms our guess.

BOM BOM Competition

First look at the actual case, first is the traditional PCB wireless charging board, as shown below.

Under this traditional MCU solution, the control chip, driver chip, op amps are all independent, and there are quite a few external components. All in all, it is very complicated and there are too many components. There are various types of stock preparation, and the production test process is complicated, which is not conducive to rapid product development. Production and marketing.

Let's look at another case: SoC solution, with Yi Chong wireless fully integrated SoC wireless charger program 'EC8000 series' as an example, as shown below.

With this SoC solution, there is only one large chip on the PCB and two MOS transistors, which are quite concise. The SOC integrates a wireless charging driver, an H-bridge driver, an op amp, and a built-in temperature protection function. One chip implements all functions. , Can effectively control costs and streamline production processes.

Let's take a closer look at the comparison between the two BOM lists.

It can be seen that the MCU mainly uses 12 components, while the SoC only requires 3, obviously the latter BOM List is much less, it saves a lot of components, it is more streamlined, and the overall cost is naturally more low.

The reason why it can be so streamlined is that the SoC integrates components and functions such as voltage and current detection, power supply voltage regulation, MOS driver, demodulation of received signals, and Q value detection.

As a result, the BOM List is much less. Not only is the overall price and cost lower, but the SoC's streamlined features make it easier for the rapid development of products, production, and marketing, so it also saves a lot of time and effort.

to sum up

The development path of mobile power, from the early MCU+ power supply solution architecture, gradually changed to SoC integration as the market matured. Similarly, the wireless charging industry is bound to eliminate backward MCU solutions and embark on the same SoC. Development route.

So, this kind of scheme of SoC can adapt to the market demand more, it is also the cost-effective scheme that accessory manufacturer needs more at the same time.

2016 GoodChinaBrand | ICP: 12011751 | China Exports