On the afternoon of May 11, Xiamen Semiconductor Investment Group Co., Ltd. and Hong Kong Jinbai Technology Co., Ltd. (hereinafter referred to as Jinbo Technology) signed a high-density flexible substrate (soft board) project investment (M&A) agreement. According to the microgrid, on April 17, Xiamen Semiconductor has just completed the signing of a high-end package carrier (hardboard) project jointly with Taiwan Hengjin Technology. It can be said that Xiamen Semiconductor realized its use in the field of packaging and testing carrier boards in the shortest time. Hard + soft' industry layout.
It is reported that Xiamen Semiconductor and Jinbai Technology will jointly set up Xiamen Jinbai Technology Semiconductor Co., Ltd. (hereinafter referred to as: Xiamen Jinbo), and Xiamen Jinbo will wholly acquire Hong Kong Jinbai and build it in Xiamen Haicang Information Technology Industrial Park. A 3kk/month FPC production line. The first phase of the project will invest approximately RMB 730 million, covering an area of approximately 70 mu. It is expected to be officially put into operation in 2020, and the annual output value will reach more than RMB 1 billion.
Realize the "hard + soft" industrial layout
With the gradual expansion of the global, especially China's semiconductor market, especially driven by emerging markets such as 5G, display panels, intelligent, wearables and Internet of things, flexible circuit boards (FPCs) are used as a type of printed circuit board. Its flexible, light weight, high wiring density, high flexibility, and other types of circuit board can not be compared to the advantages, will become the future of circuit boards and various types of new electronic components packaging development trend.
Based on this, Xiamen Semiconductor and Jinbai Technology decided to jointly invest in the construction of a high-density flexible substrate design, R&D and manufacturing base in Xiamen Haicang. The project will use the world's leading high-density, ultra-fine and multi-layered design and process technology. Focus on OLED COF, fingerprint identification, optical communication, wearable and automotive FPC.
Wang Huilian, general manager of Xiamen Semiconductor Group and chairman of Haishu Information Industry Co., Ltd., said that Jinbo Technology is an international team, and the company’s technology research and development and operation management all have international capabilities. The successful signing of the project was filled. At present, the successful landing of the project indicates that Haishu has entered a new stage of development.
It is worth mentioning that just last month, Xiamen Semiconductor had just completed the signing of a high-end package carrier (hardboard) project jointly with Taiwan Hengjin Technology. It is reported that the total investment of the project is 4.6 billion RMB and it will be implemented in two phases. In the first phase of the project, the company will invest RMB 2.3 billion and reach an output value of more than RMB 2 billion. It plans to start mass production in the third quarter of 2019. The products are mainly for high-performance chips such as CPU, GPU and FPGA, and AI, 5G, Networking and other applications.
It can be said that Xiamen Semiconductor realized the 'hard + soft' industrial layout in the field of packaging and testing carrier boards in the shortest possible time, and provided support for improving the layout of the industrial chain around integrated circuit technology.
Xiamen Haicang integrated circuit industry development success story
In recent years, Xiamen has devoted great efforts to the layout of the integrated circuit industry, and has basically formed a relatively complete industrial chain integrating materials, design, manufacturing, and packaging and testing. In 2017, the output value of integrated circuits in Xiamen reached nearly 15 billion yuan, an increase of nearly 40%. Among them, the output value of the above-scale enterprises ranks in the top six in the country, and the growth rate of the output value of the design industry ranks fourth in the country.
In terms of regional planning, Haishu District, as a rising star, based on the overall planning of Xiamen City, issued the “Implementation Plan for Xiamen IC Industry Development Plan Haicang District”, as well as supporting industrial support policies and talent introduction and cultivation policies. Positioning the idea of 'one game of chess in the city, differentiating layout, and dislocation development', focusing on the development of product-oriented features, packaging and testing and design industry.
In order to more effectively lay out and promote the development of the integrated circuit industry in Haicang District, Xiamen, on December 9, 2016, the government of Haitang District invested in the establishment of Xiamen Semiconductor Investment Group Co., Ltd. According to the micro-grid, more than two years since the establishment of Xiamen Semiconductor. Since time, the development of the integrated circuit industry in Haishu District, Xiamen has been described as a success story:
In August 2017, the Tongfu Microelectronics advanced sealing and testing production line project with a total investment of 7 billion yuan was laid in Xiamen Haishu District. The project successfully landed and complemented the key to the lack of advanced sealing and testing production lines in Xiamen and even the southeast coastal areas. ring;
In September, Micronet and Xiamen Semiconductor Investment Group held the “Micro Semiconductor Summit” in Haishu, which brought together more than 250 Chinese and foreign companies, more than 30 CEOs of listed companies, more than 150 industry CEOs, and more than 50 IC sector investment agencies. Executives
In December, IDM leading enterprises Silan Micro signed a cooperation agreement with Haicang District Government to lay out the first 12-inch wafer fabrication line and the next-generation compound 4/6 line with a total investment of 22 billion yuan;
In January 2018, Xiamen Semiconductor and Taiwan Hengjin Technology signed a framework agreement for the construction of a package carrier board project. The first-phase registered capital was US$73.75 million, which was mainly for high-performance chips such as AI, 5G, CPU and FPGA, and the application requirements for modules.
In March, Greencore Semiconductor, with more than 27 years of in-depth research and fully independent intellectual property rights in flash memory technology, formally settled in Haicang, Xiamen, and became the first design enterprise to enter Xiamen Haicang IC Design Industrial Park. In the same month, the first Sino-Dutch Semiconductor Industry Cooperation Forum was held in Haitang, Xiamen;
In April, Xiamen Chiptronics, the parent company of Xiamen Semiconductor and Taiwan Hengjin, invested in the R&D, design and manufacturing base for high-end package carrier board in Haishu District, Xiamen, with a total investment of 4.6 billion RMB.
Xiamen Haishu IC Industry Enters a New Stage of Development
All along, from Xiamen to Haishu District, we have given strong support to the development of the integrated circuit industry. In June 2016, the Outline of the Xiamen Integrated Circuit Industry Development Program and the “Implementation Opinions for the Xiamen City to Accelerate the Development of the Integrated Circuit Industry” were issued successively. From the aspects of regional planning, capital investment, policy support, personnel training, and other aspects, we plan to develop the layout of Xiamen IC industry in the next 10 years.
In April 2018, the Xiamen municipal government issued the “Implementation Rules for the Accelerated Development of the Integrated Circuit Industry in Xiamen City”, which covers various investment and financing policies, support areas, talent grants, and research support for Xiamen's integrated circuits.
According to the expectation, by 2025, the scale of the integrated circuit industry in Haishu District, Xiamen will be no less than RMB 50 billion. Among them, the scale of the design industry will be RMB 20 billion, and the scale of the packaging and testing industry will be RMB 22 billion, which will drive the scale of related industries to exceed RMB 100 billion.
According to Wang Huilian, in 2017, Haishu Relying on the Semiconductor Group, completed a contracted investment of 32.7 billion yuan, and Haiyi has become one of the hottest integrated circuit development areas in mainland China. Currently, in the subdivision area, Haishu has formed. The industry chain layout with differentiated advantages. The signing of this contract with Jinbai Technology also marks that the Haishu IC industry has entered a new stage of development.
Since the development of the integrated circuit industry in October 2016, the achievements of the Haishu IC industry have been obvious to all. Wang Huilian stated that Haicang is the Haishu of China, Fujian and Xiamen. Hope the main leaders of Xiamen, the relevant departments cherish The hard-earned preliminary results, with a larger perspective, provide Haishu with a vision to develop the IC industry and continue to advance!