Recently, the project of IC packaging and testing and design research center with a total investment of 200 million U.S. dollars was settled in the Qingdao International Economic Cooperation Zone. The chairman of U.S. An Run Investment Group, S. Zhong, Director of Management Committee of Qingdao International Economic Cooperation Zone (Zhongde Ecological Park) Zhao Shiyu Yin Mingqin, Director of Qingdao Overseas Chinese Affairs Office, Xu Haijie, Deputy Director of Qingdao International Economic Cooperation Zone (Zhongde Ecological Park), attended the signing ceremony.
The project is invested by American Anrun Group and Shenzhen ZhuoRui SiChuang Technology Co., Ltd. With a total investment of USD 200 million, it will build a chip package, test and design R&D center. It will start construction in July 2018, and the chip will be packaged. The testing part is expected to be 2019. By the end of July, it will be completed and put into production operation; the design and research and development center will strive to be put into use before the end of 2020. After the project is completed and put into production, it will achieve an annual output of 4,500 million (KK) chips and 15 million (KK) sensors of light sensors. To achieve an annual output value of 1.8 billion.
Anrun Group was established in 2005. It is a well-known overseas Chinese enterprise and now has six wholly-owned subsidiaries and several large-scale enterprise group companies that share equity companies.
Founded in August 2004, Shenzhen ZhuoRui Sichuang Technology Co., Ltd. is a high-tech enterprise that integrates R&D, design, production, sales and service. It specializes in the distribution and distribution of well-known chip products at home and abroad, and has established in Taiwan. R & D team, building integrated circuit packaging plant in Shandong.