Gathering micro-network news, 'What is most important in the 21st century is talent!'
In a highly information-based environment, the requirements for talent capacity are also getting higher and higher. Especially in the high-tech field, the core talents are even the most scarce resources in the world, especially in the chip field.
Japanese manufacturers enter the cornering mode
According to foreign media reports, Toshiba is working hard to recruit and retain semiconductor engineers as demand for memory chips increases. The report pointed out that the two new plants planned by Toshiba require more than 1,000 engineers.
According to statistics from Recruit Career, a human agency, there are 256 jobs for every 100 job seekers in the Japanese semiconductor industry to choose from, which exceeds the average of all industries and is much higher than the 52 jobs in January 2014.
In December 2017, Japan’s “SPA” magazine published a report titled “China's Booming to Buy Japanese”. The report focused on some well-known technology companies secretly scrambling.
The report took the case of Huawei, a major Chinese telecommunications equipment company with branch offices in Japan, and pointed out that the company’s recruitment advertisements were quite attractive. It was necessary to recruit 400,000 yen per month for engineering graduates who had just taken the school gate. The salary given by any famous Japanese technology brand company is also twice as high.
The Huawei example is only the tip of the iceberg, because there are also more land-based companies than Huawei. According to the headhunting company, BYD, the maker of car batteries and the development of monorail technology, is scouting in Japan. Japanese engineers are invited to go to Guangzhou. In addition to the annual salary of 30 million yen, the company also offers attractive housing allowances, dedicated drivers and translators.
Therefore, we can see that in addition to Renesas Electronics and other Japanese competitors began to pay high salaries, Changjiang Storage Technology, which built a memory chip factory for China's national investment fund, set up an office near Kawasaki Station to Toshiba two months ago (March 12). Fujitsu, NEC and other Japanese enterprise engineers beckoned.
The report pointed out that in the United States, South Korea, and Taiwan, many 30-year-old semiconductor engineers earn more than 10 million yen a year.
Domestic talent war continues
At the same time, China’s domestic demand for talent is also very strong, and it has repeatedly started the fight for talent.
As early as last year when the Toshiba acquisition proceeded, there was a person in charge of a foreign headhunting company who disclosed that: 'The success of a successful technical staff in obtaining a job is 40% of the annual income of the job changer'. In the semiconductor field, The introduction fee for technical personnel is sometimes as high as 10 million yen.
At the time, the article pointed out that in Toshiba, Ziguang Group has been well known for digging people behind it. The main 'buyer' of technicians was formerly Korea, now China.
'The talent is the first resource for the development of the integrated circuit industry, and it is also a key bottleneck restricting the development of China's integrated circuit industry.' Professor Wei Shaojun, Director of the National Nuclear High Fundamental Major Project Team, Director of the Institute of Microelectronics, Tsinghua University, introduced that integrated circuits are typical Talent-intensive industry. According to the output value of China's integrated circuit industry reaching one trillion yuan in 2020, at least 700,000 related talents will be needed, but now it is less than 300,000 and the gap is more than 400,000.
'Design is the core of the chip industry and also a short board for the development of China's integrated circuit industry. During the 13th Five-Year Plan period, China expects to use 140,000 chip design talents. At the same time, the national colleges and universities will have a training scale of about 100,000, accounting for a 30% loss. In fact, there are less than 70,000 people who have actually entered the industry, and the gap is nearly half. ' Professor Wei Shaojun said that the lack of talent supply has caused companies to recruit people very difficult and the labor costs have risen dramatically.
In addition to the scarcity of quantity, the quality of talents 'didn't matter' has also plagued many companies.
The Yangtze River Storage Company under the Ziguang Group is using government funds to build a large-scale memory factory that invests more than 2 trillion yen in Wuhan, Hubei Province. Related personnel of the Ziguang Group stated that the plant needs to ensure at least thousands of technologies to start smoothly. Staff'.
The effective recruitment rate in the semiconductor industry has increased from 0.5 to 1.5 times in three years. 'With the layoffs of Japanese companies coming to an end, recruitment will become increasingly difficult in the future,' said Recruit Career, a Japanese talent agency.
Industrial outbreak, talent demand
Behind the high-paid mining of major manufacturers, hidden is the explosive development of the entire industry!
IHS Markit pointed out that the memory IC is the industry category with the strongest growth, with an increase of 60.8% in 2017. DRAM and NAND have both achieved the highest growth record in 10 years, with sales increasing by 76.7% and 46.6% respectively.
According to the statistics from the General Administration of Customs of China, the import amount of integrated circuits (ICs) in 2017 increased by 14.6% year-on-year to US$26,104.89 billion, which was higher than the highest among all imported goods, far exceeding the crude oil of US$163.23414 billion.
In April 2018, the number of employees in the US semiconductor and electronic components manufacturing industry reached 369,600, a record high since May 2016, and the third consecutive month of expansion. In January and February 2017, the average number was 359,700. Statistics began in 1985. The lowest record since.
Micron Technology CEO Sanjay Mehrotra said on the earnings conference call on March 22 that due to tight supply, Micron plans to expand production in Singapore. It is expected that it will be ready for production from October to December 2019. In addition, Micron will also expand the scale of the Hiroshima plant in Japan. It is expected to be ready for production in early 2019.
Must win the battle for talent first
And if you want to win the explosive growth of the entire semiconductor industry, you must be inseparable from the support of talent.
In order to make a breakthrough quickly, the first is direct mergers and acquisitions, and the second is the introduction of talents. The case of multiple failures of mergers and acquisitions at home and abroad in Ziguang is enough to prove that the road to mergers and acquisitions is impracticable. Among these are various forces that are obstructing themselves and shunning our technology. The rapid progress of strength. In this way, we can only hope for the introduction and cultivation of talents, because the role of talents in industrial development is really too great.
Recently, the ZTE ban has told us once again that although China’s IC is the largest in the world, there is a big gap in terms of technology and self-sufficiency. A slight inadequacy will be imposed on people!
The semiconductor industry, as a technology-intensive industry, wants to quickly narrow the gap with the advanced level in foreign countries. The first step is to win talents is the most important thing, so as to realize the goal of strengthening the semiconductor industry! (Proofreading/Fan Rong)
2. Radio frequency devices: The cell phone that is given to people;
The radio frequency device of the mobile phone, like the troop of the army, depends on it.
China is the world’s largest mobile phone producer, but it cannot make high-end mobile RF devices. This requires solid accumulation of materials, processes, and design experience.
High-end RF chip lacks domestic products
On the main board of a mobile phone, 1/3 of the space is RF circuit.
The sound must be transmitted thousands of miles away. It must first be converted into high-frequency radio waves. The information is encoded as a sinusoidal wave of billions of crests in a second. It is received and restored by the other party’s cell phone, and the filaments are not disordered. This is the ability of radio frequency devices. The core component of the device is the power amplifier chip, also called radio frequency chip, 4G mobile phones generally use 4 to 5.
'We are like building a highway. The wider the road, the flatter the road. The more cars run, the faster.' said Wang Liming, an engineer specializing in RF chip design.
'The development trend of mobile phones is thinner and lighter, with lower power consumption, more frequency bands and greater bandwidth. This poses a challenge to RF chips.' Wang Liming said, 'RF chips convert digital signals into electromagnetic waves, and 4G mobile phones have to support more than a dozen. The frequency band, the information bandwidth is several tens of megabytes. The signal cannot be disturbed, which is difficult.
In 2018, the RF chip market was 15 billion U.S. dollars; there was no domestic product in the high-end market, and it was monopolized by Skyworks, Qorvo and Broadcom, and Qualcomm also took a place.
Over the years, these several products have been very well-received and their performance is very stable. Therefore, large mobile phone companies such as Apple, Huawei and Samsung, etc., basically use them. ' Wang Liming said.
The buyers of domestic goods are mostly small-brand mobile phones, and domestic goods are mostly 2G, 3G chips; 4G RF chips are basically foreign goods.
Radio frequency chip circuit design is a mystic art
The signal of high-frequency waves is very fragile. In a complex electromagnetic environment, the clarity and stability of the signal are maintained, and it depends on the anti-interference of each link. Designing such a circuit is an art that has not completely found the law.
For example, a rugged RF chip, like a loudspeaker, emits sharp, unwanted signals. Troubleshooting is very troublesome.
RF circuits are afraid of noise interference, but there are too many possibilities to introduce noise – power, proximity circuits, coupling, heat, self-components...
Unreasonable modeling, the circuit produced, the difference between the effect of one and the other.
From the drawing to the actual circuit, designers need more experience. What kind of layout, how to offset the adverse effects of various components, compatible with non-ideal components, designers must have a way. Introduce new components, small does not work, large It also generates new interference. The use of more components, power consumption will increase ...
Designers are thinking 'Do you want to buffer the feedback loop in series with a small resistor to buffer it?' 'Do you change the ground pin to shield the noise?' These types of problems often have no ready answer, rely on experience and trial and error. The circuit, as if laying eggs on a duck egg, often by feeling.
RF chips are analog circuits, which are different from digital circuits dealing with '1' and '0'. Digital circuit design is similar to programming, with mature modules and automation tools; while designing analog circuits is dealing with complex and unknown natural worlds. .
Zhang Guobin, founder of Electronic Innovation Network, said: 'The digital circuit industry needs more market response speeds. There are many well-established companies in China, but designing and producing RF devices requires a variety of basic scientific knowledge. Accumulation and manufacturing are key. 'Curve overtaking' is almost impossible. '
Small filter, poor in China
Another key component of RF devices, the filter, has a bigger gap at home and abroad. The high-end filter used in mobile phones, a multi-billion-dollar market, is entirely owned by foreign giants such as Qorvo.
The filter can remove signals outside the target frequency band, which is a very basic circuit device. 4G mobile phones use more precise and expensive filters. A mobile phone must be equipped with 10 or more. This high-end filter is based on the principle of piezoelectric effect. The introduction of sound waves to work; its base and coating using a number of new materials (some of which are used in the best military radar), the processing accuracy is very high, involving thin film deposition and micro-mechanical processes.
The steeper the edge of the filter band is, the more likely it is to avoid signal interference in adjacent bands. 'For example, a band-pass filter is like a door. The door frame of a high-end product can be very good, filtering messy signals very cleanly.' Zhang Guobin said. 'We are behind others in terms of performance indicators such as center frequency, cut-off frequency, linearity, sensitivity, etc., and cannot catch up to the moment.'
The gap between basic components is more than this one. Zhang Guobin gave an example: RF circuits have oscillators. They need a high-precision crystal oscillator. High-frequency signals need frequency-doubled signals. If the frequency accuracy of the crystal oscillator is not enough, then After the double increase, the signal will be too bad to be used. The most accurate crystal oscillator is mostly produced overseas.
Material is not past the kan
All high-end components are related to high-performance materials.
Zhang Guobin said that radio frequency circuits require high electron mobility. In this regard, compound semiconductors such as gallium arsenide and silicon germanium perform much better than silicon. Although our country began research and development of compound semiconductor base materials in the 1960s, it was commercialized. On the consistency of materials, the uniformity of electrical properties is not satisfactory. There are many core knowledge in this area that need to be explored by ourselves. It is our short board.
'Such as semiconductor materials have different doping ratios, the performance varies greatly. It's like making cakes and putting eggs, the ratio of eggs determines how soft the cake is. How much does it take? Others don't tell you. You can't succeed by hitting the big game. . '
Zhang Guobin said that the experiment of semiconductor materials has a long period of time. It is not a year or two that we can make achievements. 'There are many schools in our country that are doing research and doing well, but there are some materials that cannot be produced in volume.'
In addition, the use of new materials for high-end RF devices also requires designers to be familiar with the corresponding special processes and packages. Without innovative processes, yields will be much lower even with new materials.
Therefore, the domestic RF chip design companies are all looking for a factory. While several foreign giants have their own fabs, they will not take the housekeeping secrets to others' factories. (Reporter Gao Bo) Xinhua News Agency
3. The wafer-level optical chip company 'Xinyou Optoelectronics' completed a new round of financing;
In the investment sector on May 7, Xinyue Optoelectronics, a wafer-level optical chip company, focused on announcing the completion of A2 round of financing. This round was jointly invested by Lantern Capital, Walden International and the Chinese Academy of Sciences fund, Zhongke Chuangxing. Have obtained several rounds of financing from Sunny Optics, Kun Zhong Capital, Chen Hui Venture Capital, Zhong Heng Starlight.
Established in 2016, Paragon Optoelectronics is a high-tech company specializing in the R&D and application of wafer-level optical chips. It is dedicated to exploring the integration of semiconductor and optical technologies and designing semiconductor wafers to create nanoscale products. Low-cost optical chip.
It is understood that the company has complete design, plate making, scale production, closed loop detection, hot 3D imaging in the current market and driverless, AR/MR display, 5G optical communication link, medical imaging, aviation military and automatic security Other areas will play an important technical role.
On the team side, the core group of the Photovoltaic Optoelectronics R&D team and management team are professors and doctors from Stanford University, University of Rochester, Cambridge University, Zhejiang University, and other optoelectronic institutions; former Microsoft, NASA, Fortis Fiber Optics, Soreby, McKinsey and other international business executives.
At present, the first production line of Panyou Optoelectronics will be completed in May of this year. At that time, it will achieve mass production of diffractive optical chip DOE, optical display waveguides, high-speed optical communication links and other wafer-level optical chip products. In the frontier areas, through this round of financing, the company has built a comprehensive network of optics, semiconductors, Chinese Academy of Sciences, and well-known venture capital funds.
Yuanyi Capital Partners, Optoelectronics Ph.D. Liu Yiran, believes that the wafer-level fabrication of optical chips has made the photonic technology that has so far been put to the consumer sector and will trigger a series of incremental scenarios from short-term to long-term. Predictable, the future In three years, consumer-level applications such as depth sensing, AR, and unmanned three-demand machine vision will take the lead; in the medium and long term, photons will inevitably penetrate into the computing sector, triggering more profound machine intelligence applications. Change.
Wang Lin, an international partner at Walden, who has worked in semiconductor industry for many years, said that with Moore's Law moving to the limit, the development of semiconductor integrated circuits is drawing a perfect 'S curve' approaching the ceiling. 'Integrated light' replacing 'integrated power' will be a The irreversible transformation of the field. Backtracking the development of semiconductor chips, 'nanoscale' and 'scaled low cost' are the two characteristics of integrated circuit technology. Similarly, wafer-level optics allows optics to increase precision by an order of magnitude Reduce costs by an order of magnitude, making the commercial value of optical chips possible.
4. From the Chinese Academy of Sciences to Schlumberger: The birth of China's ultra-high-performance chips;
The arrival of 5G is accelerating.
Currently, 5G is at a critical stage of standards determination. In June of this year, the international standard organization 3GPP will soon complete the first version of the 5G international standard. At the same time, policies will continue to be favorable. On April 24, the National Development and Reform Commission, the Ministry of Finance issued a notice to reduce 5G. Public mobile communication system frequency occupancy fee standard......
5G technology can not only support the smooth interoperability of various types of robots (including 20.11 +3.93% of diagnostic stocks) including automobiles, but also realizes smart phones, smart homes, artificial intelligence, big data, and cloud computing. Quality's upgraded basic technology.
Faced with this on-going 5G wave, is China's chip industry ready? Although it is long-winded, China’s Zhizhi, represented by Huawei Hass, is still looking forward to. Currently in the baseband field, Huawei Hass It is the only Chinese company that can compare with Qualcomm. This is the result of Huawei's accumulation of various elements in more than 30 years. It is also not an overnight event.
At the start-up company level, there is also a company that is particularly special: Silang Technology, born out of the Institute of Automation of the Chinese Academy of Sciences and the former National Specialized Integrated Circuit Design Engineering Technology Research Center (established in 1992), former director of the center, former Institute of Automation, Chinese Academy of Sciences Director Dr. Wang Donglin led the team and has developed MaPU, a high-performance microprocessor for the first time. MaPU achieved global optimization for algebraic algorithms for the first time and is highly programmable. It was successfully streamed out in 2015.
MaPU can not only fully realize the performance of international giants' programmable processors, but also has a power consumption comparable to that of ASIC. Based on MaPU, Silang Technology has further developed three major areas of processors: UCP for 5G communication, for multimedia applications. UMP, and HPP for the field of hypercomputing. At the same time, it is also equipped with an AI domain processor: Deep neural network engine NNE.
Recently, at the Chinese Academy of Sciences Institute of Automation, the investment community interviewed the founder and chief scientist Wang Donglin of Schlumberger Technology. Wang Donglin first proposed an algebraic algorithm-level 'global optimization calculation' architecture based on this architecture, and the computational power and performance power consumption of the MaPU based on this architecture design. Compared with the international advanced level.
Systech Founder and Chief Scientist Wang Donglin
High Performance Microprocessor MaPU
Wang Donglin introduced that MaPU's greatest feature is its high computing power and low power consumption.
At present, there are several types of processors commonly used in the market. One type is a programmable processor, such as Intel, TI's processor. It is programmable and adaptable. But when executing a mathematical algorithm, its processor The utilization rate is generally around 15%, and the high energy is up to 20%. The processor utilization rate of TI's processors is only up to 40-50%. That is to say, these processors have such a high frequency. Multiple resources, but its execution efficiency is not high.
There is also an ASIC solution that does not require programming. It uses hardware to control the algorithm flow and control of the algorithm. This is actually an accelerator of the algorithm, so the execution efficiency can be very high, and it can be almost 100%.
Obviously, there is a huge difference in power consumption between programmable processors and ASICs. The problem with ASICs is that they are highly efficient, but algorithms are invariable. If the algorithm changes a bit, this chip cannot be used.
The MaPU can achieve near-ASIC efficiency (computational resource utilization can reach over 90%), and it is also highly programmable, with both advantages.
Take the supercomputing chip as an example. The performance and power consumption of the MaPU is the highest in the world
In Wang Donglin's view, the core problem of the current mainstream programmable processors is that it is a traditional architecture with low instruction levels and attempts to achieve local parallel execution through out-of-order multiple-emission and other techniques at runtime. This has caused computing resources in the chip. The utilization rate is not high, the amount of data IO is large, the dynamic power consumption is large, and the overall performance/power ratio is not high. It has been unsuitable for today's society to double the microprocessor's huge computing power and extremely low power consumption. If it can be applied from the whole algorithm To consider the parallel characteristics of different dimensions, such as time and space, and to use these parallel characteristics for overall optimization, the usage rate of the calculators in the kernel will be greatly improved. So Wang Donglin and his team have conducted rigorous measurement and experimentation. A solution for global optimization of algebraic algorithm level is proposed.
'A single instruction can implement an algebraic algorithm, so it's called an algebraic instruction. The instruction sets of traditional architectures are all arithmetic-level instructions.' Wang Donglin said that MaPU upgrades it to algebra-level arithmetic instructions, and 'MaPU uses algebraic instructions.' Pipeline zero-delay dynamic reconstruction (adapted to the algorithm) hardware architecture, achieves the same basic algorithm architecture as ASIC, and implements the global optimization execution process of the entire algorithm.
In short, MaPU can support both application-level global optimization and high-reconfigurable computing architecture and storage architecture at the software level, which can be flexibly adapted to the field (5G communication, multimedia, supercomputer or manual Various kinds of algorithms within the intelligent), it can be said that MaPU combines the advantages of ASIC, FPGA, and CPU, and it is a soft ASIC that is almost comparable to the performance power ratio of ASIC.
'MaPU-Algebra Operational Microprocessors, which generate major original innovations in parallel algebraic operations, parallel storage system instruction systems, and hardware architectures, increase microprocessor hardware support from scalar/superscalar operations to algebraic operations, increasing orders of magnitude Computational intensive field microprocessor energy efficiency ratio. 'Wang Donglin so summarizes.
Then, given the specific performance and power consumption ratio, Wang Donglin gave a set of intuitive comparison data:
Taking the Aurora H1.0 supercomputing chip as an example, the chip integrates 32 HPP processing cores, and the double-precision floating-point processing capability will reach 4,659GFLOPS@64. The estimated power consumption is only about 40W, and the performance/power ratio reaches 116GFLOPs@64. /W, first in the world.
Therefore, after the mass production of the MaPU, its original architectural advantages will hopefully enable China to achieve a major breakthrough in the microprocessor architecture, release huge computing power at the same energy ratio, and lead the independent innovation and development of the Chinese electronics industry.
In response, Bai Chunli, the president of the Chinese Academy of Sciences, said in the media in March this year: 'In the research and development of high-tech products, the Chinese Academy of Sciences will soon release a microprocessor with completely independent intellectual property rights - MaPU algebraic processor, reaching the international advanced level. It is believed that after the MaPU series processors come out, they will shine in the world of computers, communications and other areas of the consumer electronics market.
'MaPU's three children'
On the basis of MaPU, Smart Technology has further developed three powerful field processors: UCP in the 5G communications field, UMP in the multimedia field, and HPP in the Hypercomputing field.
UCP: The world's first full implementation of software-defined radio.
UCP is MaPU's enhanced general-purpose communications processor for mobile communications is the chip core of the 5G macro base station base station processor, UCP core can complete 5.8G fixed-point complex FFT per second, per second can complete 55GBPS LDPC encoding and 2.5GBPS decoding. According to preliminary calculations, a baseband processor with twenty UCP cores can satisfy all baseband processing requirements for a 64-antenna 5G macro base station.
'If you use FPGS to build a 5G system, you will need multiple pieces of interconnection to achieve a system solution, and FPGA-based circuit systems will generally<400-600MHz, 片间互联总线带宽受限, 运算能力受限, 这将成为实现5G系统的瓶颈. ' 王东琳说.
At present, UCP core is an international leading processor core that realizes a full software-defined 5G wireless transmission baseband processing system at an acceptable cost. Wang Donglin defines UCP as a software-defined radio that completely implements baseband processing in the field of mobile communications.
In addition to base station equipment manufacturers, UCP cores can also be provided to 5G terminal manufacturers. Due to the 5G standard, all terminals must be re-embedded to accommodate 5G algorithm baseband core (the original baseband core or DSP core can not deal with 5G downlink reception And the large amount of operations during uplink transmission, this is also an opportunity for the UCP core. All-in-one wireless communication equipment, broadband self-organizing network terminals in various fields are also UCP's ability to display its capabilities through full software-defined radio technology.
UMP: Thanks to its smart phone, smart TVs can be upgraded online with audiovisual experience, and can provide super-engines for high-definition photography, video and other applications.
UMP is Mapu's second 'kid' for smart phones, smart TV's multimedia microprocessor core.
UMP invented a more efficient parallel processing architecture based on the MaPU basic architecture, making the performance and power ratios of various types of video processing operations comparable to those of ASICs. In some respects, it even outperformed, while maintaining a highly programmable feature.
'This feature can make home TV with TV manufacturers video and audio processing algorithms to improve the visual and audio experience online, this is unmatched by the ASIC TV chip. 'Wang Donglin said, 'Also can quickly introduce new products through algorithm and software improvements . '
4 ultra-high definition TV engine chips (up to 8 watts) consisting of 4 UMP cores and 1 ARM core can meet all the video and audio processing requirements of 4K ultra-high definition TVs and TV system management based on Android. The audio and visual effects can be comparable to those of Sony. With Samsung's highest-end TV. 14 UMP cores + 1 ARM core super TV engine chip to meet all processing and computing needs of 8K Ultra HD TV.
Together with the NNE core developed by Silang in the AI field deep neural network engine, whether it is a smart TV or a smart phone, it can achieve high performance in high-definition video, machine vision, human-computer interaction, and lower domestic-made consumer electronics products. The cost will greatly improve the user experience. The first super TV engine chip will be finished in 2018, and can be applied for smart TV manufacturers to promote the application.
Compared with Intel's latest processor, the HPP core super processor is nearly an order of magnitude higher in power consumption.
At present, MaPU's third 'kid' HPP kernel is already a mature product.
'MaPU's core capabilities obtained through architectural innovation are still highly computation-intensive. ' Therefore, Wang Donglin has been hoping to build a supercomputing microprocessor for Mapu's enhanced core HPP (high-performance processing) for general-purpose computing to meet the needs of high-end server applications. .
In this way, Aurora H1.0, a super-computation MaPU microprocessor (which is expected to be completed at the end of the year) has been developed. The performance and power ratio of the Aurora H1.0 has been designed to be far superior to other microprocessors in the world. , It can be used as the core processor of super-computing system and super server.
Wang Donglin gave a set of data:
HPP-based supercomputer Aurora H1.0 has the same performance as Intel's latest Xeon Phi, but it can be reconfigured with 16/32/64/128 bits, and the performance/power ratio is improved by nearly an order of magnitude: providing equivalent 64-bit floating The point-to-point computing power when the Aurora H1.0 (2x16 HPP cores) consumes 40W and the Intel Xeon Phi processor is 300W.
NNE: Top Deep Neural Network Processing
Another product of SFRON: Accelerated neural network engine NNE inherited and developed MaPU's 'Concentric Circle Storage System Optimization Model', and optimized it for deep neural networks. The advantage is that for the mainstream neural network, the whole network throughput rate is high. Memory access requirements and low power consumption are comparable to those of Nvidia's deep neural network kernels, but they are more efficient. NNE's NNE absorbs the MaPU global optimization concept when it comes to storage systems and deep neural network configurations.
'NNE can support deep-learning training, especially supports intelligent reasoning, has been optimized specifically in video image recognition, and has outstanding advantages in target detection, recognition, and video image structuring.'. Wang Donglin.
An application scenario that can be expected is smart driving. In this scenario, UMP can process multi-camera images at high speed and extract objects to be identified. NNE is responsible for understanding the processing conditions, vehicle conditions, and providing key information needed for decision-making and driving control. UCP is responsible for providing extremely short-delay vehicle networking communications capabilities.
Gan sat on the bench, insisted on research and development for nearly 10 years of research team
Silang and its predecessor team have been researching the deployment of new instruction set architectures since 2009, and have developed fully independent and innovative microprocessor architectures. MaPU has experienced nine years of hardship. The R&D team is the original national ASIC design. More than 70 core scientific researchers in the Engineering Technology Research Center.
From the second quarter of 2017, the team began its corporate operation.
Wang Donglin is a person with a technical belief, as is teammates. The field of integrated circuits has always been inadequate, and there is a shortage of personnel. Because chips such as chips are too hard and the benefits are not high, many outstanding students are more willing to choose financial and Internet industries after graduation. Craftsmanship is required to make chips, requiring top-notch technical personnel willing to concentrate on R&D, and can withstand the pressure of successful R&D for a long time. The R&D team of Silang Technology has done it.
MaPU-based processors in several enhanced areas have their own advantages in their respective fields, and they can also be used in combination to achieve a variety of practical scenarios: 5G communications, smart phones, smart homes, supercomputers, smart driving, intelligence Cities, robots and drones, etc.
'Moore's Law cannot be applied forever, and chip performance upgrades have encountered worldwide bottlenecks. This is just the best opportunity for us to catch up.' Wang Donglin said, 'The chip is an industry that needs patience. We have been doing it for 9 years. Okay, the next important thing is to adjust to the actual application and optimize. ' The investment community
5. Layout of smart car frontier technology! Ningbo Junsheng teamed up with chip giant Datang;
Following the opening of another R&D center two months ago in the renowned motor city of Stuttgart, Germany, the world’s leading supplier of automotive parts and components, Junsheng Electronics, has taken another important step toward the smart car industry.
Yesterday (May 4th), Junsheng Electronics' Ningbo Yunsheng Puri Intelligent Vehicle Joint-stock Co., Ltd. and Chenxin Technology Co., Ltd., a subsidiary of Datang Group, signed a strategic cooperation agreement to jointly build a new generation of automotive intelligent vehicle linkage technology. The TBOX and V2X automotive electronics products are said to have taken a substantial step forward through the cooperation and participation in the national V2X vehicle networking related standards formulation.
'Junsheng and Datang's cooperation is a powerful combination of resources and competitive advantages in their respective fields. The two companies' market position and brand influence in the intelligent network-linked auto industry will be greatly enhanced. ' Chief Automotive Expert of China Automotive Engineering Research Institute Zhu Xi said.
unmanned
The so-called V2X, vehicle-to-vehicle information exchange (English: vehicle to everything), is considered to be the key technology of the future intelligent transportation system. The TBOX, short for Telematics BOX, is a part of the vehicle network system. Communication between background system and mobile phone app.
Why should Junsheng Electronics go deep into this field? Li Jie, deputy general manager of the group's smart car alliance, gave the answer -
'In the areas of car networking we are all familiar with, such as car navigation, audio and video entertainment, we are very mature and are well-known car manufacturers, especially the public's first-tier suppliers. But this is only a small part of the car network. The car network should be a new type of smart car linkage system, covering a new generation of TBOX, V2X automotive electronics products and many app applications and other products.
'Navigation, weather, positioning are basic services. In fact, V2X technology is a new service technology for travel. It is an integrated technology application for smart travel, car sharing and smart transportation. It is formed by the perception layer, communication layer and application layer. Chain. This requires the TBOX terminal, V2X terminals and communications products such as chips and modules, as well as the cloud platform and all traffic terminals and other common implementations.
Li Jie simulated the application scene of such a technology for winning all-in-one smart car travel.
Suppose you are now out for business talks with an important customer: Before going out, you check the condition of your car on a mobile phone, such as battery level, tire pressure, default destination, interior temperature, seat comfort, etc. Then, through the phone Identity authentication, keyless entry and start-up of the car, payment of parking fees, etc. After boarding the car, voice or gestures are used to control the equipment inside the car, such as sending and receiving e-mails and other business activities. During the driving process, the car is automatically Road conditions and real-time warnings make route changes. When you can't reach the destination interview on time, you can change to an in-car encrypted video conference.
Of course, the V2X technology, besides the interconnection between people and vehicles, focuses on the realization of the interconnection of vehicles and vehicles, vehicles and facilities, and vehicles and the cloud. The exchange of information between cars and all things, then it sounds like sharing cars, ownership transfer, accident data collection It is just around the corner. At the same time, V2X technology, active safety technology and so on are important foundations for autonomous driving and even unmanned driving.
In addition to the interconnection of people and vehicles, the V2X technology focuses on realizing the interconnection of vehicles and vehicles, vehicles and facilities, and vehicles and the cloud. Sharing cars, ownership transfer, and accident data collection are just around the corner.
In fact, this world-class automotive parts supplier announced three years ago that it invested heavily in smart driving and vehicle networking to improve the existing business ecosystem. Datang is in large-scale integrated circuit design, car networking, Ad hoc networks, key technologies in wireless communications and other areas have a profound accumulation.
According to Chen Di, vice president and chief engineer of Chenxin Technology, Chenxin Technology is participating in the declaration of major national science and technology projects while developing the V2X market. This is in line with the positive development of Junsheng Electronics in the field of car networking. The two parties cooperated to build new TBOX and V2X automotive electronics products in China, and made breakthroughs in product design, R&D, production, and market expansion.
The IC design scientist revealed at today's signing ceremony that the two parties will also jointly develop new automotive chips and terminal products through the establishment of a smart network-linked vehicle R&D and industrialization platform, and gradually explore the vehicle-mounted Beidou and Tiantong systems. , Wireless charging and other new areas of cooperation and exchange. Zhejiang online
6. Shanghai will join the Yangtze River Delta to take the lead in pushing the 5G network first;
Dongfangnet reporter Jie Min, Bo Kelin reported on May 7: The Municipal Government Information Office held a press conference today to introduce the “Three-year Action Plan for Fully Launching the 'Made in Shanghai' Brand to Accelerate the Move to a Global Manufacturing Excellence Base” .
In response to questions from reporters, the process of integration in the Yangtze River Delta is accelerating. What specific measures Shanghai has taken in the area of industrial cooperation, especially the cooperation in the Yangtze River Delta cities. Wu Jincheng, deputy director of the Municipal Economic and Credit Commission, said that the Yangtze River Delta is an important advanced technology of our country. Manufacturing bases, where industrial added value accounted for more than a quarter of the country's total, new energy vehicles accounted for one-third of the country's market share, robotic production capacity accounted for 1/2, integrated circuit industry reached half of the industry, and information services accounted for 1/3. High-end equipment manufacturing level leads the country.
Facing the future, the Yangtze River Delta proposes 'two Yangtze River Deltas', the industrial cluster industry Yangtze River Delta and the digital wisdom Yangtze River Delta, to cultivate world-class industrial clusters. It is difficult for a Shanghai-based company to form a world-class level and influence. It must be long-term oriented. Triangle, build and share.
From the perspective of digital economy and smart cities, the Yangtze River Delta will also have to take the lead in promoting the pilot of 5G networks; projects such as the Industrial Internet will create world-class smart city groups. Next, Shanghai will also introduce some major deployments.