Beijing – May 7, 2018 -Arm announces that its Arm® Artisan® physical IP will be used to design TSMC's ARM-based SoC design 22nm Ultra Low Power (ULP) and Ultra Low Leakage (ULL) platforms. TSMC's 22nm ULP/ULL technology Optimized for mainstream mobile and IoT devices, compared with the previous generation of TSMC 28nm HPC+ platform, while improving the performance of Arm-based SoC, it significantly reduces power consumption and silicon area.
'The next-generation process technology released this time can meet more functional requirements in a smaller area with lower power consumption,' said Gus Yeung, general manager of Arm's physical design business group, 'Artisan Physical IP and TSMC's 22nm ULP/ The combination of the design and manufacturing cost advantages of ULL technology will provide our two partners with immediate benefits in terms of improved performance per milliwatt of operation and reduced silicon area.
The Artisan physical IP for TSMC's 22nm ULP/ULL process technology includes a foundry-backed memory compiler optimized for the low-leakage and low-power requirements of next-generation edge computing devices. In addition, these compilers also include Ultra-high-density and high-performance physical IP library of standard cells containing a power management kit and a library of thick gate oxide elements to help optimize low-leakage power consumption. In addition, the latest physical IP also provides a universal I/O solution To ensure full performance, power and area (PPA) optimization.
Li Shuo, senior director of TSMC's design infrastructure marketing department, said: 'Artisan's physical IP enables TSMC to accelerate tape-out time and bring to market faster SoCs designed for mainstream IoT and mobile devices. Based on the success of the cooperation between the two sides in the 28nm HPC+ platform, TSMC and Arm continue to focus on providing significant optimization in terms of power consumption and area, thereby providing partners with both parties the possibility of achieving a more optimal edge computing experience on more devices.
Arm's physical IP is a widely trusted and widely used solution. More than 10 billion integrated circuits (ICs) are shipped by Arm Partners every year. TSMC's 22nm ULP/ULL process technology for ARM's physical IP integration is currently under way. Actively pushing forward, we are committed to achieving tape-out for our mutual chip partners in the second half of 2018.