Compared with traditional magnetic stripe cards, financial IC cards store data information through integrated circuit chips embedded in the card, which has advantages of high security, large storage capacity and multi-functionality, thereby gradually replacing the traditional magnetic stripe card. With the promotion of the People’s Bank of China, the process of EMV (collectively known as Eurocard, MasterCard, and Visa) is being accelerated.
In 2015, domestic shipments of pure financial IC card chips were about 6 million, which was less than 1% of the total domestic market for pure financial IC card chips. With the completion of technology improvement and product certification of domestic chips, the 2016 pure financial IC card chip The localization process has been accelerated. It is expected that in 2017, domestic chips will make greater contributions to the field of financial IC cards.
In 2016, financial IC card chip products manufactured by Hua Hong Semiconductor eNVM technology were successfully awarded CC EAL5+ and EMVCo safety certificates issued by international authoritative certification organizations and MasterCard CQM certification, respectively, proving Hua Hong Semiconductor's financial IC card chip manufacturing process technology. The safety management system has reached the international advanced level, has received international recognition and recognition, and has laid a good foundation for the expansion of domestic and foreign financial markets.
At present, Hua Hong Semiconductor, based on mature 0.13 micron and 0.11 micron embedded non-volatile memory (eNVM) process technologies, continues to upgrade and innovate, and has successfully achieved 90nm eNVM technology with more advanced feature sizes. Mass production. This process has the advantages of excellent stability, high reliability and low power consumption. Compared with the previous generation of technology, it further reduces the chip size, thus providing customers with leading technology and more competitive solutions.
Hua Hong Semiconductor (Wuxi) Phase 1 (Hua Hong No.7 Plant) Pile Foundation Project Starts
Hua Hong Semiconductor (Wuxi) is building a 12-inch integrated circuit production line with a production capacity of 40,000 chips per month. The company's process technology capacity will be upgraded to the 65/55 nm technology node, and the existing eNVM technology advantages are bound to extend to deepening. Smart cards, microcontrollers (MCU), security chips and other products provide excellent manufacturing solutions.
The Wuxi base is not only the first manufacturing project outside the Shanghai area of Hua Hong Group, but also the first VLSI manufacturing project invested by the National Integrated Circuit Industry Fund in Wuxi.
It is understood that Hua Hong Wuxi Integrated Circuit R&D and Manufacturing Base Project covers an area of approximately 700 mu, with a total investment of US$10 billion, a total investment of approximately US$2.5 billion in Phase I, a new process grade of 90-65 nanometers, and a monthly production capacity of approximately 40,000 pieces. The 12-inch featured process integrated circuit production line supports applications in emerging areas such as 5G and the Internet of Things. Hua Hong Wuxi Base Project will construct several 12-inch integrated circuit production lines in phases. After the implementation of the first phase of the project, the second production line will be started in due course. .
The first phase of Hua Hong Semiconductor (Wuxi) Co., Ltd. plans to complete the civil construction in the first half of 2019, complete the construction of the purification plant and the installation of power mechanical and electrical equipment in the second half of the year, and gradually increase production through the line. It is expected that the annual output value will reach 5 billion yuan. .