On May 8, Tuzheng Technology held a new product conference in Shenzhen, released 5 new products with innovative fingerprint industry, and launched a new upgrade of the sixth-generation V8 fingerprint recognition algorithm. At the same time, it brought a lot of differences from the traditional FOD. The chip stacking and DISP ultra-thin packaging technology ensure the good experience of wet and dry fingers under normal conditions and push China's fingerprint industry to a new height.
Five Arrows Get Together, Join Alibaba, Huawei Hass Adds New Product Line
At the press conference, the five new products brought by Tectech are ceramic fingerprint sensors and modules, high-performance single-chip integrated fingerprint modules, and support for state-of-the-art single-chip integrated fingerprint modules. Ultra-thin packaged low-power fingerprint sensor and Wi-Fi digital video module.
Ceramic cover type sensors are gradually becoming the standard product for mid-to-high end fingerprint locks. The ceramic cover plate sequence fingerprint sensor and module products released by Graphs & Tech. have realized a ceramic cover plate on a large area sensor with a new packaging process. The protection program, which is the first mass production application of ceramic cover plate in a large area of fingerprint recognition sensor.
High integration, high reliability, cost-effectiveness, low power consumption, single-chip realization of the smallest size is the application point of the current single-chip fingerprint module. Figure is the high-performance single-chip integrated technology brought about this time Fingerprint module, with a thickness of only 650 μm, adopts self-designed ultra-thin packaging technology to assemble semiconductor fingerprint sensor and fingerprint algorithm chip and large-capacity memory on one chip, up to 40 I/O pins, open 64KB application Program space, support for secondary programming development, speed identification less than 0.35S, completely changed the current production structure of the industry application system, can save an MCU.
The new products brought by Graphs & Technologies also support the state-of-the-art single-chip integrated fingerprint module, which adopts a single-chip integrated package from Tuzheng Technology. The entire package thickness is only 650 microns. The built-in Cortex M3 core SE is in the security chip. Internal operation of fingerprint recognition algorithm, support for secondary development, unique FOD package design to ensure the safety of the security of the chip, has a secret authentication; also has ultra-thin package low-power fingerprint sensor, its thickness is only 225 microns, ultra-low Power consumption, full-speed operating current of less than 1.5mA in active mode, is the thinnest and lowest power fingerprint sensor in the industry.
In addition, Tuzheng Technology officially announced the addition of a new product line at the press conference and launched the 'Wi-Fi Digital Video Module', the 'WiFi Cat's Eye' module, together with Alibaba, Huawei Hass, represented by fingerprint locks. The wireless cat's eye function of the application scenario is designed as a low-power consumption module. It can be directly integrated into the front panel of the fingerprint lock, through the Wi-Fi network, giving smart lock video calls, remote unlocking and other new functions, as if to give the smart lock Gives both eyes, promotes the development of mid-to-high-end smart locks to 'gatekeeper robots'. Among them, Huawei Hass developed digital video compression technology for fingerprint lock applications. Alibaba Security Lab led the development of a security framework ID2 for high-security IoT devices. Ensure access and interactive data security.
Smart lock is the trend of domestic traditional lock industry upgrading. Although China's smart lock development time is short, but the development speed is the fastest in the world. Industry experts predict that in the next three to five years, the size of China's smart lock industry will be Achieving 100 billion yuan will lay the foundation for the main force in the lock industry. The fingerprint chip industry's enterprise technology, products and innovation services will undoubtedly quickly drive the rapid upgrading of traditional industries.
Launched V8 algorithm with a low error rate of 0.0001%
The 'fingerprint recognition algorithm' used in the 'fingerprint recognition module', which is the core part of the fingerprint lock, is the fingerprint recognition 'brain' of each smart lock, and it is the software algorithm for identifying and operating the 'fingerprint' information. 'fingerprint algorithm' It requires high practicality and requires time accumulation and iteration.
It is reported that Tuzheng Technology's fingerprint algorithm has been developed for 17 years, and after 15 years of commercial inspection. Fingerprint recognition algorithm technology is also the core technology of Tuzheng Technology. After the connection of objects in the Internet of Things, “Wisdom” requires information acquisition and processing technology. The core of this core is the 'algorithm'.
In the release, Tuzheng Technology officially launched the sixth generation of the newly upgraded fingerprint recognition algorithm V8 version. Chart positive technology CTO Zhao Xu introduced, V8 algorithm uses a stable structure features and image features depth fusion algorithm, so that the pass rate is higher The generation is increased by 10%, the misrecognition rate is as low as 0.0001%, and the dependence on structural features is reduced to 1-2.
Fingerprint algorithm, unlike other technologies, is very practical, requires database accumulation and iterative iterations, and cannot be closed behind the door. In addition, after the explosive growth of the smart lock industry in China, the 'fingerprint algorithm' is also diversified and developed. No standard has been formed yet. The introduction of the Graph V8 algorithm can guide the industry's attention to the convenience of fingerprint recognition algorithms. At the same time, it can enhance password protection and improve the anti-attack ability of the algorithm.
According to reports, the algorithms used by all the fingerprint identification modules currently on the market by Tuzheng Technology are self-developed algorithms of Tuzheng Science and Technology, and they always take security as the first consideration, and try to optimize the experience performance on this basis. The algorithm of science and technology has been constructed on the basis of the structure feature algorithm, and on this basis, the image algorithm is introduced to improve the accuracy of comparison.
DISP and Emulation help to innovate fingerprint recognition module
For a fingerprint chip product, the chip packaging method will affect other aspects of the chip design. Small changes within the package are sufficient to significantly change the electronic or mechanical characteristics of the package system. This single-chip solution allows the sensor , Memory and algorithm chips are highly integrated, which saves space and cost, allows customers to have cost advantages in terms of solutions, has greater space and flexibility in industrial design, and adapts to high-value, personalized market trends.
At present, it is using industry-leading DISP package, FOD package fingerprint identification modules have achieved mass production. Figure positive technology has successfully introduced wafer-level packaging and SiP (System in Package) chip-scale package, representing the positive Technology has industry-leading autonomous capabilities in the back-end of the chip - advanced packaging design and simulation capabilities, through the chip behind the fingerprint recognition module to help shape the revolution.
Compared to traditional fingerprint design solutions, the ultra-thin fingerprint products of Tuxun's DISP package have a minimum thickness of 225um, making it the thinnest product in the industry. At the same time, R&D through simulation-driven products can significantly shorten the development cycle. For complex structures Fingerprint packaging products, in advance to find mold flow problems of the packaged products, can shorten the development cycle, can achieve a successful mold opening.
According to Xie Jianyou, vice president of Tu Zheng Science and Technology, the mold flow simulation completely reproduces the filling process in the plastic packaging process, eliminates the risk in the encapsulation process, eliminates hidden dangers, and improves product reliability. Stress Simulation: During the actual use of the fingerprint product simulation The stress conditions of each plastic part are analyzed to eliminate the hidden dangers of failure. Thermal simulation: The thermal evaluation of the high heating elements in the fingerprint application product is performed to find the thermal bottleneck and optimize the product structure design. The measured temperature of the product inductance L1 is 49.8 in the case. °C, the simulated temperature is 50.685 °C, with an error of 1.77%.
It can be seen that Tuzheng Technology has become a full-industry-chain high-tech enterprise with semiconductor fingerprint chip design, fingerprint algorithm design, semiconductor fingerprint chip SiP package design, module and application design capabilities, and at the same time, Tuzheng Technology has a trail of chips. Design, simulation and R&D capabilities. Multi-chip stacking is achieved through FOD design, which enables volume production of thinner, smaller, higher integration, and more stable performance products.
In addition, the new hardware products rely on different traditional DISP ultra-thin packaging, integrated semiconductor fingerprint module multi-chip stack packaging technology innovation, will lead the 'small package, high performance, low power consumption, heterogeneous integration, single chip' The trend of innovation brings greater penetrating power, provides the texture and design basis of high-end products, guarantees a good experience of wet and dry fingers under normal conditions, and promotes the second revolution of Chinese fingerprint technology.