According to a report from DigiTimes Beijing on May 5, industry sources stated that Foxconn Electronics has established a semiconductor group and is considering the construction of two 12-inch wafer fabs.
The Foxconn Semiconductor Group is currently led by Young Liu, who is also a director of Sharp Corporation.
According to sources, Foxconn's chip manufacturing related subsidiaries, such as Jingding Precision Technology, and the core technology and technology have already operated under the Semiconductor Group. Jingding Precision Technology produces semiconductor equipment. The core technology is a semiconductor module dedicated to Packaging and testing of high-tech companies. Tianhao technology company is committed to the design and development of LCD driver ICs.
Allegedly, Foxconn is seeking to enter the wafer manufacturing sector and has allowed its semiconductor group to evaluate the possibility of building two 12-inch fabs.
Informed sources pointed out that although Foxconn failed to compete in the acquisition of Toshiba's memory chip business, the company did not give up its ambition in the semiconductor field.
For the report, Foxconn stated that it did not comment on the media rumors.