Prior to this, it was speculated that the first chips delivered by the Nanjing fab were Huawei Hass, but it seemed counterproductive.
It is reported that the first products based on TSMC's 16nm FinFET process are quite mature and advanced.
According to the statistics, the 12-inch wafer fab of Nanjing Semiconductor Manufacturing Co., Ltd. was laid on July 7, 2016. The original plan was to provide 16nm OEM support from 2018. The monthly production capacity was 20,000 wafers. The 12-inch wafer is 300mm, which is the current industry Recognized large-size wafers, it is not only a symbol of high technology level, but also help reduce cutting costs, increase productivity.
In addition, according to reports, TSMC and CEO Wei Zhejia said at a recent investor conference that the proportion of revenue from the mainland market has increased from 11% last year to 19% in the first quarter of this year.