Victor Peng, President and CEO of Xilinx, said that this is the most important engineering achievement since the invention of the FPGA. This new architecture is part of an expanded market strategy that will help companies move beyond FPGAs and break the limitations of hardware developers. The application of ACAP products in data centers and general markets will accelerate the popularization of flexible strain calculations and accelerate the realization of the vision of smart, connected, and flexible strained world.
Victor Peng, President and CEO of Xilinx, said that the application of ACAP products will accelerate the realization of the vision of smart, networking, and flexible response to the world.
ACAP is a highly integrated multi-core heterogeneous computing platform that can be flexibly changed from a hardware level for a variety of applications and workload requirements. In addition, ACAP's self-adaptive capabilities can be dynamically executed in milliseconds during operation. The power efficiency ratio will exceed the CPU and GPU.
In the ACAP core there is a new FPGA architecture that combines distributed memory and hardware programmable DSP blocks, a multi-core SoC, and software programmable. In addition, ACAP also has a chip control module for security and power management, hardware Programmable memory controller, supports cache coexistence interconnect architecture accelerator (CCIX) and PCIe interface, multi-mode Ethernet controller, programmable I/O interface and sequencer. Software developers can use C/C++, OpenCL And Python and other languages, to carry ACAP-based system.
ACAP is suitable for all kinds of applications brought about by the rise of massive amounts of data and artificial intelligence, including video transcoding, databases, data compression, machine vision, operational storage, etc. Software and hardware developers can apply to endpoints, edges, and clouds. Started development of ACAP-based products. The product codenamed "Everest" is the first ACAP product family to adopt 7nm process technology. It is expected to start production in 2018 and ship in 2019.