Beijing's First 8-Inch Integrated Circuit Production Line, Target Monthly Capacity 50,000 Pieces

On April 15th, the Yandong Microelectronics 8-inch integrated circuit R&D industrialization and sealing and measurement platform project included in the list of key projects for the Beijing Science and Innovation Center in 2018 was held at the Shangliang ceremony. The project is expected to be put into production in the development zone by the end of this year.

This is also the first time since the first half of this year, the first high-energy excimer laser independently developed by Keyi Hongyuan has passed the factory inspection and acceptance, and the second phase of North China Ventures has been put into use. The contract of Weixin Sealing & Expansion Project has been signed.... The industry has once again achieved fruitful results. It is reported that this project will be the first mass production 8-inch integrated circuit production line in Beijing. It will mainly produce 8-inch line-up 0.11um integrated circuit chips and their packaged products. The monthly production capacity can reach 50,000 pieces. At the same time, this project is also the first large-scale 8-inch production line in Beijing. Through cooperation with international leading drive circuits and power device manufacturers, the company has built the most advanced domestic technology production line for the Beijing area. Design companies, scientific research institutes provide trial production platforms, provide verification platforms for equipment and materials companies, and help speed up Beijing's creation of a national technological innovation center for the integrated circuit industry.

The transformation of achievements has always been one of the characteristics of the development zone. As a “district” of the Sancheng District, Beijing Yizhuang undertook the transformation of scientific and technological achievements of the three major science cities. The Yandong Project is not an example. At the end of March this year, Beijing The first high-energy excimer laser independently designed, produced and manufactured by Keyi Hongyuan Optoelectronics Technology Co., Ltd. passed the factory inspection and acceptance. This product fills the gap in the field of excimer laser technology in China and breaks the long-term market of foreign manufacturers on this technology product. Monopoly. After the prototype completes relevant experimental verification, it will begin to provide orders to Shanghai Microelectronics Equipment Group.

In addition to providing powerful services for enterprises, the development zone also provides strong financial support for the development of integrated circuit companies. It has established an IC investment and financing system with Yizhuang SDIC as the core. It has participated in 12 integrated circuit industry funds. The total size of the fund exceeds 160 billion yuan, and Yizhuang Guotou has subscribed and paid more than 16 billion yuan, focusing on the national integrated circuit industry investment fund (national level), Beijing Integrated Circuit Manufacturing and Equipment Sub-fund (Beijing level), Beijing integration The Circuit Design and Packaging and Measurement Sub-Fund (Beijing Municipality) cooperated with BOE, the world's third largest panel maker, to establish a core-energy investment fund, and cooperated with chip design emerging companies to establish a northern cooperation with Sui and Tang Changhou investment funds.

The development zone actively created a globalized layout, relied on Yizhuang Guotou Investment and Financing Platform, organized funds to carry out overseas project acquisitions, achieved advanced projects and technology introduction in the integrated circuit industry, and successfully introduced ISSI, Howe Technology (OV), and Mima. The key companies in the overseas IC industry chain, such as Mattson Equipment Corporation and Silex (MEMS foundry in Sweden), help China in such key areas as memory, image sensor chips, semiconductor equipment, and MEMS (Micro Electro Mechanical Systems). Realize the curve overtaking, and fill the gaps in domestic related industries.

The high-quality environment has brought about rapid industrial clustering. In recent years, the integrated circuit industry in the development zone has made significant progress and breakthroughs. There have been nearly 100 upstream and downstream companies, and the industrial chain is gradually perfecting. The total industrial output value of key enterprises was up to 2013. The year's 12.57 billion yuan rose to 21.56 billion yuan in 2017, with an average annual growth rate of 17.8%.

In the integrated circuit design process, with the arrival of Chichuang North and the extension to the downstream of the industrial chain, the design companies have more closely cooperated with BOE and SMIC’s core companies, and the virtual IDM model has been strengthened and exceeded. Infineon, Huaxia Core, Zhaoyi Innovation, and other well-known integrated circuit design companies at home and abroad are conducive to the construction of an integrated ecosystem of 'chip-software-machine-system-information service'.

In the wafer manufacturing process, the 12-inch wafer production line represented by SMIC North, the 8-inch featured process line represented by Yandong Microelectronics, and the MEMS sensor chip production line represented by Nano Micro Silicon Succession have settled and started construction. Among them, after the expansion of the SMIC B2 project in the north, a 12-inch wafer high-end production capacity will be formed with the B1 project, and the process node will span 130-14 nanometers, becoming the largest and most technologically advanced integrated circuit in the country. The production base will continue to expand its production capacity to 300,000 pieces per month in the future; the Yandong 8-inch line project will become the first mass-produced 8-inch line in Beijing, an important addition to the 12-inch wafer production line. Regional design companies, scientific research institutes provide trial production platforms, and provide verification platforms for equipment and materials companies. Nanomicro silicon plans to introduce 13 industry-leading MEMS engineering integrated application core processes and 27 groups of more than 200 international patents to form MEMS. Product R & D and manufacturing platform and production management system, built Beijing's first MEMS foundry production line to lead the international standards, to fill the blank of the domestic pure MEMS body silicon process OEM.

In the packaging and testing process, Qorvo is a wholly owned US company that designs, develops and manufactures 'Radio Frequency' integrated circuit products. The products are used in RFICs for wireless communications and RFICs. Signal processing and transmission equipment, the company is the main supplier of global power amplifier products, is committed to open up the market of local wireless LAN (WLAN) and Bluetooth wireless technology products. The Weixin expansion project has officially settled in the development zone, after the project reaches production, The development zone will have a new billion-dollar enterprise. At the same time, the development zone is actively bringing in advanced sealing and testing projects with advanced technology, and will continue to enhance the integrated circuit packaging and testing capabilities of the development zone.

In the equipment manufacturing sector, on the basis of the semiconductor high-end equipment represented by the North Huachuang that has already been formed, in recent years, we have introduced the zero-imprinted lithography machine represented by Keyi Hongyuan, Huazhuo Jingke and Dongfang Jingyuan. Component Clusters. Among them, Beijing North China Chong Microelectronics Equipment Co., Ltd. is committed to building R&D and manufacturing bases for high-end semiconductor process equipment and core components. It has successfully developed Etching Equipment (ETCH), Chemical Vapor Deposition Equipment (CVD), and Physics. Vapor deposition equipment (PVD) More than 20 types of products based on three types of semiconductor equipment products successfully replaced similar products of foreign manufacturers, and some products formally entered overseas mainstream chip production lines. Beijing Kehong Hongyuan Optoelectronics Technology Co., Ltd. launched a comprehensive national 02 special project. 28nm immersed exposure light source project development, completed the 193nm engineering prototype experiment; Beijing Huazhuo Jingke Science and Technology Co., Ltd. production of lithography machine work table to fill the gaps in the domestic lithography key parts R & D and manufacturing areas, with exclusive and not The alternative position lays the foundation for the next step in the development of the lithography machine in Beijing. Electronic Technology Co., Ltd. undertake 02 specific tasks, completed the first China-made multi-functional e-beam pattern detection system, system integration, reached the international advanced level.

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